Read Sony MEX-GS810BH / MEX-N6000BH Service Manual online
46
MEX-GS810BH/N6000BH
SECTION 7
ELECTRICAL PARTS LIST
KEY
BOARD
**********
When the KEY board is defective, replace the FRONT PANEL (SV) (ASSY) (Ref.
No. FP1).
*************************************************************
No. FP1).
*************************************************************
A-2045-586-A MAIN BOARD, COMPLETE (N6000BH) (See Note)
A-2045-587-A MAIN BOARD, COMPLETE (GS810BH) (See Note)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< CAPACITOR >
* C03
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C05
1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C09
1-116-707-11 CERAMIC
CHIP 47uF
20% 10V
* C010
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
C013 1-125-891-11 CERAMIC
CHIP 0.47uF 10% 10V
C016 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C017 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C018 1-116-724-11 CERAMIC
CHIP 4.7uF
20% 6.3V
C019 1-116-722-11 CERAMIC
CHIP 4.7uF
10% 16V
C020 1-118-480-11 CERAMIC
CHIP 4.7uF
10% 6.3V
C021 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C022 1-164-874-11 CERAMIC
CHIP 100PF 5% 50V
C023 1-164-874-11 CERAMIC
CHIP 100PF 5% 50V
C102 1-116-733-11 CERAMIC
CHIP 1uF
10% 25V
* C103
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C104 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
C105 1-118-477-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C106 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
* C107
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C109 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C301 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C302 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C303 1-112-839-11 ELECT
4700uF 20% 16V
C304 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C305 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C306 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
* C307
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
C308 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C309 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C310 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C311 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C312 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C313 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C314 1-118-930-11 CERAMIC
CHIP 10uF
10% 10V
C315 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
* C316
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C317
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C318
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C319
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C320
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C321
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C322
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C323
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
C324 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
* C325
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
* C326
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
C328 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C329 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C330 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C331 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C332 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C333 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C334 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
(GS810BH)
C335 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
(GS810BH)
C336 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
(GS810BH)
C337 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
(GS810BH)
C338 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C339 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C340 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C341 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C342 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C343 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C400 1-118-047-11 CERAMIC
CHIP 10uF
10% 16V
(GS810BH)
C401 1-128-992-21 ELECT
CHIP 47uF
20% 25V
* C402
1-116-735-11 CERAMIC CHIP 1uF
10%
16V
(GS810BH)
C404 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C405 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C406 1-124-779-00 ELECT
CHIP 10uF
20% 16V
* C407
1-118-035-11 CERAMIC CHIP 0.1uF
10%
25V
(GS810BH)
C408 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C409 1-124-779-00 ELECT
CHIP 10uF
20% 16V
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• SEMICONDUCTORS
In each case, u: μ, for example:
uA.
In each case, u: μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
Note: When the complete MAIN board is replaced, it is necessary to replace knob (VOL) (SV) assy simultaneously.
Also, the destination setting, Bluetooth operation check and Bluetooth information writing are necessary. Refer to
“DESTINATION SETTING METHOD” on page 4, “BLUETOOTH FUNCTION CHECKING METHOD USING
A CELLULAR PHONE” on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8.
“DESTINATION SETTING METHOD” on page 4, “BLUETOOTH FUNCTION CHECKING METHOD USING
A CELLULAR PHONE” on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8.
KEY
MAIN
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