Read Sony MEX-GS610BE / MEX-GS610BT / MEX-N6050BT (serv.man3) Service Manual online
9
MEX-GS610BE/GS610BT/N6050BT
3. ELECTRICAL PARTS LIST
A-1977-644-B MAIN BOARD, COMPLETE (GS610BT) (See Note)
A-1977-645-B MAIN BOARD, COMPLETE (GS610BE/N6050BT)
(See Note)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< CAPACITOR/RESISTOR >
* C03
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C05
1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C09
1-116-707-11 CERAMIC
CHIP 47uF
20% 10V
C010 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C013 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C014 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C015 1-115-416-11 CERAMIC
CHIP 0.001uF 5% 25V
C102 1-116-716-11 CERAMIC
CHIP 10uF
10% 16V
* C103
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C104 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
C105 1-118-477-11 CERAMIC
CHIP 2.2uF
10% 6.3V
C106 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
* C107
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C109 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C301 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C302 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C303 1-112-839-11 ELECT
4700uF 20% 16V
C304 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C305 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C306 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C307 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C308 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C309 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C310 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C311 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C312 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C313 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C314 1-118-930-11 CERAMIC
CHIP 10uF
10% 10V
C315 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C316 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C317 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C318 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C319 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C320 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C321 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C322 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C323 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C324 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C325 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C326 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C328 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C329 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C330 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C331 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C332 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C333 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C334 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C335 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C336 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C337 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C338 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C339 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C340 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C341 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C342 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C343 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C400 1-118-047-11 CERAMIC
CHIP 10uF
10% 16V
C401 1-128-992-21 ELECT
CHIP 47uF
20% 25V
C402 1-114-813-11 CERAMIC
CHIP 1uF
10% 16V
C404 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C405 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C406 1-124-779-00 ELECT
CHIP 10uF
20% 16V
* C407
1-118-035-11 CERAMIC CHIP 0.1uF
10%
25V
C408 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C409 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C410 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C411 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C412 1-100-966-91 CERAMIC
CHIP 10uF
20% 10V
C413 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C414 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C415 1-116-865-11 CERAMIC
CHIP 10uF
10% 25V
C416 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C417 1-116-728-11 CERAMIC
CHIP 2.2uF
10% 10V
C418 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C419 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
* C420
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(GS610BT)
* C421
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(GS610BT)
* C422
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(GS610BT)
C423 1-118-389-11 CERAMIC
CHIP 0.022uF 10% 25V
C424 1-118-389-11 CERAMIC
CHIP 0.022uF 10% 25V
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• SEMICONDUCTORS
In each case, u:
In each case, u:
μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
Note: When the complete MAIN board is replaced, it is necessary to replace knob (VOL) (SV) assy simultaneously. Also, the
destination setting, Bluetooth operation check and Bluetooth information writing is necessary. Refer to “DESTINATION
SETTING METHOD” on page 4, “BLUETOOTH FUNCTION CHECKING METHOD USING A CELLULAR PHONE”
on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8 on original service manual.
SETTING METHOD” on page 4, “BLUETOOTH FUNCTION CHECKING METHOD USING A CELLULAR PHONE”
on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8 on original service manual.
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