MEX-DV2200, MEX-DV220EE - Sony Car Audio Service Manual (repair manual). Page 4

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MEX-DV220EE/DV2200
4
SECTION  1
SERVICING  NOTES
NOTE  THE  IC4  ON  THE  SERVO  BOARD  
REPLACING
IC4 on the SERVO board cannot exchange with single. When this 
part is damaged, exchange the entire mounted board.
NOTE  FOR  THE  20-PIN  CONNECTOR (CN901)
Do not use alcohol to clean the 20-pin connector (CN901) connect-
ing the front panel with the main body.
Do not touch the connector directly with your bare hand. Poor con-
tact may be caused.
NOTE  FOR  REPLACING  THE  COMPLETE  MAIN  
BOARD
If the complete MAIN board was replaced, be sure to refer to Tech-
nical News published separately.
NOTE  WHEN  THE  KEY  BOARD  IS  REPAIRED
In this set, the KEY board has been changed in the midway of 
production. Repair after distinguishing each type set to doing the 
repair referring to the following.
– KEY Board (Component Side) –
Suffix-11   :  1-877-076-11
Suffix-12 : 1-877-076-12
– Bottom View
(DV2200: US and Canadian models) –
– Bottom View
(DV220EE/DV2200: E and Indian models) –
Part No.
Region Code
Part No.
Region Code
Label indication
Destination
Signal format 
system
Region 
code
Part No.
NTSC
1
4-115-190-0
[]
DV2200: US and Canadian models
PAL
5
4-115-191-0
[]
DV220EE: Russian model
PAL
3
4-115-192-0
[]
DV2200: E (PAL) model
PAL
5
4-115-193-0
[]
DV2200: Indian model
NTSC
4
4-115-194-0
[]
DV2200: E (NTSC) model
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTE  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in tha optical 
pick-up block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
MODEL  IDENTIFICATION
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
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