MEX-BT5000 - Sony Car Audio Service Manual (repair manual). Page 2

2

Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 ñ 8 ohms
Maximum power output: 52 W 

× 4 (at 4 ohms)

Outputs: 

Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna relay control terminal
Power amplifier control terminal

Inputs: 

Telephone ATT control terminal
Illumination control terminal
BUS control input terminal
BUS audio input/AUX IN terminal
Remote controller input terminal
Antenna input terminal

Tone controls: 

Low: 

±10 dB at 60 Hz or 100 Hz (XPLOD)

Mid: 

±10 dB at 500 Hz or 1 kHz (XPLOD)

High: 

±10 dB at 10 kHz or 12.5 kHz (XPLOD)

Power requirements: 12 V DC car battery 

(negative ground)

Dimensions: Approx. 178 

× 50 × 183 mm 

(7

1

/

8

 

× 2 × 7

1

/

4

 in) (w/h/d)

Mounting dimensions: Approx. 182 

× 53 × 162 mm 

(7

1

/

4

 

× 2

1

/

8

 

× 6

1

/

2

 in) (w/h/d)

Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories: 

Card remote commander:

Parts for installation and connections (1 set)

Your dealer may not handle some of the above listed 
accessories. Please ask the dealer for detailed 
information.

Note
This unit cannot be connected to a digital preamplifier 
or an equalizer which is Sony BUS system compatible.

Design and specifications are subject to change 
without notice.

MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and Thomson.

Bluetooth Standard version 2.0

Bluetooth Standard Power Class 2 (Max. +4 dBm)

Line of sight approx. 10 m (32.8 ft)*

1

2.4 GHz band (2.4000 

− 2.4835 GHz)

Modulation method: FHSS
Compatible Bluetooth Profiles*

2

A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile)
OPP (Object Push Profile)

*1

The actual range will vary depending on factors 
such as obstacles between devices, magnetic 
fields around a microwave oven, static electricity, 
reception sensitivity, antenna's perfomance, 
operating system, software application, etc.

*2

Bluetooth standard profiles indicate the purpose of 
Bluetooth communication between devices.

RM-X301 (US, Canadian)
RM-X302 (AEP, UK)
RM-X303 (E)

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

This label is located on the bottom of the

• AEP, UK, E model

chassis.

• Keep the temperature of the soldering iron around 270 ˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

CAUTION – CLASS 1M INVISIBLE LASER RADIATION
WHEN OPEN.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.

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