MEX-BT2500 - Sony Car Audio Service Manual (repair manual). Page 2

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2
MEX-BT2500
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This label is located on the bottom of the
• AEP, UK and E models:
chassis.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK 
 0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  
0
  SUR
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE
FONCTIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS
QUE  PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT
DONNÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS
PUBLIÉS  PAR  SONY.
Wireless Communication
Communication System: 
Bluetooth Standard version 2.0
Output: 
Bluetooth Standard Power Class 2 (Max. +4 dBm)
Maximum communication range: 
Line of sight approx. 10 m (32.8 ft)*
1
Frequency band: 
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
Compatible Bluetooth Profiles*
2
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile) 1.0
HSP (Headset Profile)
*1
The actual range will vary depending on factors 
such as obstacles between devices, magnetic 
fields around a microwave oven, static electricity, 
reception sensitivity, antenna's perfomance, 
operating system, software application, etc.
*2
Bluetooth standard profiles indicate the purpose of 
Bluetooth communication between devices.
Power amplifier section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W 
× 4 (at 4 ohms)
General
Output:
Power antenna (aerial) relay control terminal
Inputs:
Antenna (aerial) input terminal
AUM input jack (stereo mini jack)
Tone controls:
Low: 
±10 dB at 100 Hz (XPLOD)
High: 
±10 dB at 10 kHz (XPLOD)
Loudness:
+ 9 dB at 100 Hz
+ 5 dB at 10 kHz
Power requirements: 12 V DC car battery 
(negative ground (earth))
Dimensions: Approx. 178 
× 50 × 179 mm 
(7 
1
/
8
 
× 2 × 7 
1
/
8
 in) (w/h/d)
MW
Tuning range:
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
MW tuning interval: 9kHz/10kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 
µV
SW
Tuning range:
SW1: 2,940 – 7,735 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 10.7 MHz/450 kHz
Sensitivity: 30 
µV
Intermediate frequency: 10.7 MHz/450 kHz
Usable sensitivity: 9 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz: 0.5 % (stereo),
0.3 % (mono)
Separation: 35 dB at 1 kHz
Frequency response: 30 – 15,000 Hz
Mounting dimensions: Approx. 182 
× 53 × 162 mm 
(7 
1
/
4
 
× 2 
1
/
8
 
× 6 
1
/
2
 in) (w/h/d)
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessory:
Card remote commander: RM-X304
Parts for installation and connections (1 set)
Design and specifications are subject to change 
without notice.
MPEG Layer-3 audio coding technology and 
patents licensed from Fraunhofer IIS and Thomson.
The use of optical instruments with this product
• 
US and Canadian models:
will increase eye hazard.
CAUTION
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