Read Sony MDX-C7890R Service Manual online
– 2 –
1.
SERVICING NOTES
................................................ 2
2.
GENERAL
................................................................... 3
3.
DISASSEMBLY
......................................................... 9
4.
ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 14
MD Section ..................................................................... 14
Tuner Section .................................................................. 14
MD Section ..................................................................... 14
Tuner Section .................................................................. 14
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
3-023-589-01 (AEP: TYPE 2)
3-023-590-01 (AEP: TYPE 1)
3-023-590-01 (AEP: TYPE 1)
S
®
MDX-C7890R
MODEL NO.
FM/MW/LW MINIDISC PLAYER
POWER SELECT SWITCH
C E
A
• TYPE A/B Discrimination
[MAIN BOARD]
(Component Side)
• Model Identification
– Model Number Label –
IC700
MB90574PFV-G-113-BND ( TYPE A )
MB90F574PFV-G-113 ( TYPE B )
MB90F574PFV-G-113 ( TYPE B )
Laser Diode Properites
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
• Material: GaAlAs
• Wavelength: 780 nm
• Emission Duration: continuous
• Laser Output Power: less than 44.6 µW*
* This output is the value measured at a distance of 200 mm
from the objective lens surface on the Optical Pick-up Block.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED
LINE WITH MARK
!
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
SECTION 1
SERVICING NOTES
5.
DIAGRAMS
5-1. Printed Wiring Boards
– MECHANISM DECK Section – ................................. 17
5-2. Schematic Diagram
– MECHANISM DECK Section – ................................. 19
5-3. Schematic Diagram – MAIN Section – .......................... 23
5-4. Printed Wiring Board – MAIN Section – ...................... 27
5-5. Printed Wiring Board – PANEL Section – .................... 31
5-6. Schematic Diagram – PANEL Section – ....................... 33
5-5. IC Pin Function Description ........................................... 35
5-4. Printed Wiring Board – MAIN Section – ...................... 27
5-5. Printed Wiring Board – PANEL Section – .................... 31
5-6. Schematic Diagram – PANEL Section – ....................... 33
5-5. IC Pin Function Description ........................................... 35
7.
EXPLODED VIEWS
................................................ 52
8.
ELECTRICAL PARTS LIST
............................... 56
TABLE OF CONTENTS
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