Read Sony MDX-66XLP Service Manual online
2
MDX-66XLP
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. To Place the Set into Playback Mode .................................. 3
1-2. How to Check the Servo Board Waveforms ........................ 3
1-2. How to Check the Servo Board Waveforms ........................ 3
2. GENERAL
Preparations (US, Canadian Model) ........................................ 4
Connections (US, Canadian Model) ........................................ 4
Preparations (AEP, UK Model) ............................................... 5
Connections (AEP, UK Model) ............................................... 5
Connections (US, Canadian Model) ........................................ 4
Preparations (AEP, UK Model) ............................................... 5
Connections (AEP, UK Model) ............................................... 5
3. DISASSEMBLY
3-1. Panel (Rear) Assy ................................................................ 6
3-2. Case (Upper) ....................................................................... 7
3-3. Panel (Front) Assy ............................................................... 7
3-4. MD Block ............................................................................ 8
3-5. Main Board ......................................................................... 8
3-6. Chassis (OP) Block ............................................................. 9
3-7. Servo Board ......................................................................... 9
3-8. Optical Pick-up ................................................................. 10
3-9. Note on Assembly for the Chassis (OP) Block ................. 11
3-2. Case (Upper) ....................................................................... 7
3-3. Panel (Front) Assy ............................................................... 7
3-4. MD Block ............................................................................ 8
3-5. Main Board ......................................................................... 8
3-6. Chassis (OP) Block ............................................................. 9
3-7. Servo Board ......................................................................... 9
3-8. Optical Pick-up ................................................................. 10
3-9. Note on Assembly for the Chassis (OP) Block ................. 11
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 12
4-2. Block Diagram .................................................................. 18
4-3. Circuit Boards Location .................................................... 19
4-4. Printed Wiring Boards –Servo Section– ............................ 20
4-5. Schematic Diagram –Servo Section– ................................ 22
4-6. Schematic Diagram –Main Section– ................................. 23
4-7. Printed Wiring Boards –Main Section– ............................ 24
4-8. Printed Wiring Board –Power Section– ............................ 26
4-9. Schematic Diagram –Power Section– ............................... 27
4-2. Block Diagram .................................................................. 18
4-3. Circuit Boards Location .................................................... 19
4-4. Printed Wiring Boards –Servo Section– ............................ 20
4-5. Schematic Diagram –Servo Section– ................................ 22
4-6. Schematic Diagram –Main Section– ................................. 23
4-7. Printed Wiring Boards –Main Section– ............................ 24
4-8. Printed Wiring Board –Power Section– ............................ 26
4-9. Schematic Diagram –Power Section– ............................... 27
5. EXPLODED VIEWS
5-1. Case Section ...................................................................... 30
5-2. Main Board Section .......................................................... 31
5-3. MD Section (1) .................................................................. 32
5-4. MD Section (2) .................................................................. 33
5-5. MD Section (3) .................................................................. 34
5-2. Main Board Section .......................................................... 31
5-3. MD Section (1) .................................................................. 32
5-4. MD Section (2) .................................................................. 33
5-5. MD Section (3) .................................................................. 34
6. ELECTRICAL PARTS LIST
........................................ 35
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.
NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES
SONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL
OU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SERVICE NOTE
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
laser-tap
OPTICAL PICK-UP FLEXIBLE BOARD
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
NOTES ON PICK-UP FLEXIBLE BOARD
The pick-up flexible board in this set is secured to the optical pick-
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
up with an adhesive tape. Once the tape is removed, an adhering
force becomes weak, and it cannot be reused.
Therefore, if the optical pick-up is replaced, replace also the pick-
up flexible board with a new one.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
(KMS-241C/J1N)
(KMS-241C/J1N)
The laser diode in the optical pick-up block may suffer electrostatic
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.
break-down easily. When handling it, perform soldering bridge to
the laser-tap on the flexible board. Also perform measures against
electrostatic break-down sufficiently before the operation. The
flexible board is easily damaged and should be handled with care.
CLASS
PRODUCT
LASER
1
This label is located on the bottom of the chassis.
AEP, UK model
US, Canadian model
Ver 1.1
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