Read Sony DSX-A60BT Service Manual online
28
DSX-A60BT
SECTION 7
ELECTRICAL PARTS LIST
A-1847-637-A BT BOARD, COMPLETE (Included in MAIN board)
(See Note 1)
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When the BT board is defective, exchange the complete mounted board.
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KEY
BOARD
**********
When the KEY board is defective, exchange the FRONT PANEL ASSY (Ref. No. FP1).
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A-1959-340-A MAIN BOARD, COMPLETE (Including BT board)
(See Note 1, 2)
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7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< SURGE ABSORBER >
AB101
1-805-043-11 ABSORBER, CHIP SURGE
< CAPACITOR >
C101 1-114-329-11 CERAMIC
CHIP 0.47uF 10% 50V
C102 1-114-329-11 CERAMIC
CHIP 0.47uF 10% 50V
C105 1-128-992-21 ELECT
CHIP 47uF
20% 25V
C106 1-100-588-21 ELECT
CHIP 1000uF 20% 6.3V
C110 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C119 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C122 1-135-366-11 ELECT
CHIP 100uF 20% 16V
C136 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C143 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C144 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C149 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C150 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C151 1-164-937-11 CERAMIC
CHIP 0.001uF 10% 50V
C152 1-118-345-11 CERAMIC
CHIP 0.01uF 10% 25V
C155 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C157 1-162-918-11 CERAMIC
CHIP 18PF
5% 50V
C158 1-162-919-11 CERAMIC
CHIP 22PF
5% 50V
C160 1-116-720-11 CERAMIC
CHIP 10uF
20% 6.3V
C161 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C206 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C212 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C213 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C214 1-100-966-91 CERAMIC
CHIP 10uF
20% 10V
C216 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C218 1-126-210-21 ELECT
CHIP 220uF 20% 4V
C219 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C220 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C221 1-126-208-21 ELECT
CHIP 47uF
20% 4V
C223 1-100-742-91 CERAMIC
CHIP 2.2uF
20% 10V
C225 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C226 1-164-845-11 CERAMIC
CHIP 5PF
0.25PF 50V
C227 1-164-845-11 CERAMIC
CHIP 5PF
0.25PF 50V
C228 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C229 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C231 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C232 1-164-852-11 CERAMIC
CHIP 12PF
5% 50V
C233 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C234 1-116-720-11 CERAMIC
CHIP 10uF
20% 6.3V
C235 1-116-720-11 CERAMIC
CHIP 10uF
20% 6.3V
C236 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C237 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C238 1-164-852-11 CERAMIC
CHIP 12PF
5% 50V
C239 1-112-298-91 CERAMIC
CHIP 1uF
10% 16V
C240 1-164-940-11 CERAMIC
CHIP 0.0033uF 10% 16V
C241 1-164-882-11 CERAMIC
CHIP 220PF 5% 16V
C244 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C245 1-165-492-21 ELECT
CHIP 100uF 20% 10V
C250 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C252 1-100-567-81 CERAMIC
CHIP 0.01uF 10% 25V
C255 1-112-781-11 CERAMIC
CHIP 1uF
10% 10V
C256 1-100-966-91 CERAMIC
CHIP 10uF
20% 10V
C259 1-100-909-11 CERAMIC
CHIP 10uF
10% 6.3V
C260 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
C261 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C263 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C264 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C265 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C266 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C267 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C268 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C269 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C274 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C275 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C276 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C277 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C290 1-125-777-11 CERAMIC
CHIP 0.1uF
10% 10V
C291 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
C301 1-164-882-11 CERAMIC
CHIP 220PF 5% 16V
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
When indicating parts by reference num-
ber, please include the board name.
ber, please include the board name.
Note:
• Due to standardization, replacements in
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
All resistors are in ohms.
METAL:
Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F:
F:
nonfl ammable
• CAPACITORS
uF:
uF:
μF
• COILS
uH:
uH:
μH
• SEMICONDUCTORS
In each case, u:
In each case, u:
μ, for example:
uA.
. :
μA. . , uPA. . , μPA. . ,
uPB.
.
:
μPB. . , uPC. . , μPC. . ,
uPD.
.
:
μPD. .
Note 1: When the complete BT board or complete MAIN board is re-
placed, it is necessary to confi rm operation. Refer to “BLUE-
TOOTH FUNCTION CHECKING METHOD USING A CEL-
LULAR PHONE” on page 5.
TOOTH FUNCTION CHECKING METHOD USING A CEL-
LULAR PHONE” on page 5.
Note 2: When the complete MAIN board is replaced, the destination
setting is necessary. Refer to “NOTE THE MAIN BOARD OR
SYSTEM CONTROLLER (IC101) REPLACING” on page 4.
SYSTEM CONTROLLER (IC101) REPLACING” on page 4.
BT
KEY
MAIN
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