CDX-GT66UPW - Sony Car Audio Service Manual (repair manual)

2012F33-1

© 

2012.06

Model Name Using Similar Mechanism

CDX-GT660UP

Mechanism Type

MG-101CA-188

Optical Pick-up Name

DAX-25A

•  The tuner and CD sections have no adjustments.

FM
Tuning range: 87.5 – 107.9 MHz
Antenna (aerial) terminal: 

External antenna (aerial) connector

Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz

AM
Tuning range: 530 – 1,710 kHz
Antenna (aerial) terminal: 

External antenna (aerial) connector

Intermediate frequency: 

9,115 kHz or 9,125 kHz/5 kHz

Sensitivity: 26 μV

Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit

Interface: USB (Full-speed)
Maximum current: 1 A

Output: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W × 4 (at 4 ohms)

Outputs: 

Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna (aerial)/Power amplifier control 
terminal (REM OUT)

Inputs: 

Remote controller input terminal
Antenna (aerial) input terminal
Telephone ATT control terminal
AUX input jack (stereo mini jack)
USB signal input connector

Power requirements: 12 V DC car battery 

(negative ground (earth))

Dimensions: Approx. 178 × 50 × 180 mm 

(7

1

/

8

 × 2 × 7

1

/

8

 in) (w/h/d)

Mounting dimensions: Approx. 182 × 53 × 162 mm 

(7

1

/

4

 × 2

1

/

8

 × 6

1

/

2

 in) (w/h/d)

Mass: Approx. 1.3 kg (2 lb 14 oz)
Supplied accessories: 

Remote commander: RM-X211 
Parts for installation and connections (1 set)

Your dealer may not handle some of the above 
listed accessories. Please ask the dealer for 
detailed information.

Design and specifications are subject to change 
without notice.

t CPU/RAM

– IBM PC/AT compatible machine
– CPU: Intel Pentium III Processor 450 MHz 

or higher

– RAM: 256 MB or more (For Windows XP), 

512 MB or more (For Windows Vista or 
later)

t USB port

Windows XP, Windows Vista, Windows 7

For details on compatible editions or Service 
Pack, visit the support site on the back cover.

CEA2006 Standard
Power Output: 17 Watts RMS    4 at 
4 Ohms < 1% THD+N 
SN Ratio: 80 dBA 
(reference: 1 Watt into 4 Ohms)

Monitor
High color (16-bit) or more, 800 × 600 dots or more

Other
Internet connection

t The following system environments are not 

supported.
– Non IBM PC type computers, such as 

Macintosh, etc.

– Homemade computers
– OS upgraded computers
– Multi-display environment
– Multi-boot environment
– Virtual machine environment

t Depending on the computer condition, 

operation may not be possible even with the 
recommended environment.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

CAUTION
The use of optical instruments with this 
product will increase eye hazard.

Music recognition technology and related 
data are provided by Gracenote®. 
Gracenote is the industry standard in music 
recognition technology and related content 
delivery. For more information, please visit 
www.gracenote.com. 

CD, DVD, Blu-ray Disc, and music and 
video-related data from Gracenote, Inc., 
copyright ©2000 to present Gracenote. 
Gracenote Software, copyright ©2000 to 
present Gracenote. One or more patents 
owned by Gracenote apply to this product 
and service. 
See the Gracenote website for a non-
exhaustive list of applicable Gracenote 
patents.

Gracenote, CDDB, MusicID, MediaVOCS, 
the Gracenote logo and logotype, and the 
“Powered by Gracenote” logo are either 
registered trademarks or trademarks of 
Gracenote in the United States and/or other 
countries.

Microsoft, Windows, Windows Vista and 
Windows Media and logos are trademarks 
or registered trademarks of Microsoft 
Corporation in the United States and/or 
other countries.

This product contains technology subject 
to certain intellectual property rights of 
Microsoft. Use or distribution of this 
technology outside of this product is 
prohibited without the appropriate 
license(s) from Microsoft.

iPhone®, iPod®, iPod classic®, 
iPod nano®, and iPod touch® are 
trademarks of Apple Inc., registered in the 
U.S. and other countries.

Apple, Macintosh and iTunes are 
trademarks of Apple Inc., registered in the 
U.S. and other countries.

MPEG Layer-3 audio coding technology 
and patents licensed from Fraunhofer IIS 
and Thomson.

Pandora, the Pandora logo, and the
Pandora trade dress are trademarks or 
registered trademarks of Pandora Media, 
Inc., used with permission.

For the State of California, USA only
Perchlorate Material – special handling 
may apply, See 
www.dtsc.ca.gov/hazardouswaste/perchlorate
Perchlorate Material: Lithium battery 
contains perchlorate

ZAPPIN and Quick-BrowZer are
trademarks of Sony Corporation.

12 TONE ANALYSIS and its logo are 
trademarks of Sony Corporation.

SensMe and the SensMe logo are 
trademarks or registered trademarks of 
Sony Ericsson Mobile Communications AB.

 .............................................   3

 ..................................................................   5

3-1. Disassembly 

Flow 

...........................................................   7

3-2. Cover 

...............................................................................   7

3-3.  Panel (Sub) Block ...........................................................   8
3-4.  CD Mechanism Deck (MG-101CA-188) .......................   8
3-5. MAIN 

Board 

...................................................................   9

3-6. SERVO 

Board 

.................................................................   9

3-7.  Chassis (T) Sub Assy ......................................................   10
3-8. Roller 

Arm 

Assy 

..............................................................  10

3-9. Chassis 

(OP) 

Assy 

...........................................................  11

3-10.  Chucking Arm Sub Assy .................................................   11
3-11. Sled Motor Assy ..............................................................  12
3-12.  Optical Pick-up Section ..................................................   13
3-13. Optical Pick-up ...............................................................   13

4-1.  Block Diagram - SERVO Section - ................................   14
4-2.  Block Diagram - MAIN Section - ...................................   15
4-3. Block 

Diagram 

- PANEL, POWER SUPPLY Section - ...........................   16

4-4.  Printed Wiring Board - MAIN Section (1/2) - ................   18
4-5.  Printed Wiring Boards - MAIN Section (2/2) - ..............   19
4-6.  Schematic Diagram - MAIN Section (1/4) - ...................   20
4-7.  Schematic Diagram - MAIN Section (2/4) - ...................   21
4-8.  Schematic Diagram - MAIN Section (3/4) - ...................   22
4-9.  Schematic Diagram - MAIN Section (4/4) - ...................   23
4-10.  Printed Wiring Board - SUB Board - ..............................   24
4-11.  Schematic Diagram - SUB Board - .................................   24
4-12.  Printed Wiring Board - KEY Board -..............................   25
4-13.  Schematic Diagram - KEY Board - ................................   26

5-1. Main 

Section 

...................................................................  36

5-2.  Front Panel Section .........................................................   37
5-3.  CD Mechanism Deck Section (MG-101CA-188) ..........   38

 ..............................   39

Accessories are given in the last of the electrical parts list.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
Never look into the laser diode emission from right above when 
checking it for adjustment. It is feared that you will lose your sight.

If the optical pick-up block is defective, please replace the whole 
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical 
pick-up block.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  FOR  REPLACEMENT  OF  THE  USB  CONNEC-
TOR (CN971)  AND  THE  AUX  JACK (J901)
To replace the USB connector and the AUX jack requires align-
ment.
1.  Insert the USB connector and the AUX jack into the front pan-

el.

2.  Place the KEY board on the front panel and align the terminals 

of the USB connector and the AUX jack with the holes in the 
KEY board.

3.  Solder four terminals of the connector and three terminals of 

the jack.

TEST  DISCS
Use following TEST DISC when this set confi rms the operation 
and checks it.

Part No.

   

Description

3-702-101-01 

DISC (YEDS-18), TEST (for CD)

4-225-203-01 

DISC (PATD-012), TEST (for CD)

NOTE  FOR  REPLACEMENT  OF  THE  SERVO  BOARD
When repairing, the complete SERVO board should be replaced 
since any parts in the SERVO board cannot be repaired.

NOTE  FOR  REPLACEMENT  OF  THE  SENSOR  BOARD
When SENSOR board is defective, exchange the MECHANICAL 
BLOCK (11CA) ASSY.

The unit may not function properly if the 
connectors between the unit and the front 
panel are not clean. In order to prevent this, 
detach the front panel and clean the 
connectors with a cotton swab. Do not apply 
too much force. Otherwise, the connectors 
may be damaged.

t For safety, turn off the ignition before cleaning 

the connectors, and remove the key from the 
ignition switch.

t Never touch the connectors directly with your 

fingers or with any metal device.

EXTENSION  CABLE  AND  SERVICE  POSITION
When repairing or servicing this set, connect the jig cable (exten-
sion cable (CD mecha)) as shown below.

•  Connect the MAIN board (CN700) and the SERVO board 

(CN401) with the jig cable.

Jig cable:
Part No. 

Description

A-1818-424-A EXTENSION CABLE (CD MECHA)