Read Sony CDX-GT527EE / CDX-GT570 / CDX-GT570S Service Manual online
SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
E Model
CDX-GT570/GT570S
Russian Model
CDX-GT527EE
9-887-812-04
2007L04-1
© 2007.12
© 2007.12
Ver. 1.3 2007.12
SPECIFICATIONS
CD player section
Signal-to-noise ratio
120 dB
Frequency response
10 – 20,000 Hz
Wow and flutter
Below measurable limit
Tuner section
FM
FM
Tuning range
CDX-GT527EE:
FM1/FM2: 87.5 – 108.0 MHz
(at 50 kHz step)
FM3: 65 – 74 MHz (at 30 kHz step)
CDX-GT570/GT570S:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
(except EA model)
FM1/FM2: 87.5 – 108.0 MHz
(at 50 kHz step)
FM3: 65 – 74 MHz (at 30 kHz step)
CDX-GT570/GT570S:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
(except EA model)
FM tuning interval
CDX-GT570/GT570S:
50 kHz/200 kHz switchable
(except EA model)
50 kHz/200 kHz switchable
(except EA model)
Antenna (aerial) terminal
External antenna (aerial) connector
Intermediate frequency 10.7 MHz/450 kHz
Usable sensitivity
Usable sensitivity
9 dBf
Selectivity
75 dB at 400 kHz
Signal-to-noise ratio
67 dB (stereo), 69 dB (mono)
Harmonic distortion at 1 kHz
0.5% (stereo), 0.3% (mono)
Separation
35 dB at 1 kHz
Frequency response
30 – 15,000 Hz
MW/LW (CDX-GT527EE)
Tuning range
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal
External antenna (aerial) connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
MW: 30 µV, LW: 40 µV
• The tuner and CD sections have no adjustments.
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-101TC-188//Q
Optical Pick-up Name
DAX-25A
– Continued on next page –
FM/MW/LW COMPACT DISC PLAYER
CDX-GT527EE
FM/MW/SW COMPACT DISC PLAYER
CDX-GT570/GT570S
Photo: CDX-GT570
CDX-GT527EE/GT570/
GT570S
2
CDX-GT527EE/GT570/GT570S
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.
optical pick-up block.
Never turn the semi-fixed resistor located at the side of optical pick-
up block.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
other than those specified herein may result in hazardous
radiation exposure.
MW (CDX-GT570/GT570S)
Tuning range
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
(except EA model)
530 – 1,710 kHz (at 10 kHz step)
(except EA model)
MW tuning interval
9 kHz/10 kHz switchable
(except EA model)
(except EA model)
Antenna (aerial) terminal
External antenna (aerial) connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
SW (CDX-GT570/GT570S)
Tuning range
SW1: 2,940 – 7,735 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal
External antenna (aerial) connector
Intermediate frequency 10.7 MHz/450 kHz
Sensitivity
Sensitivity
30 µV
Power amplifier section
Outputs
Speaker outputs (sure seal connectors)
Speaker impedance
4 – 8 ohms
Maximum power output
52 W
×
4 (at 4 ohms)
General
Outputs
Audio outputs terminal (front, rear/sub
switchable) (CDX-GT527EE)
Audio outputs terminal (front/rear)
(CDX-GT570/GT570S)
Subwoofer output terminal (mono)
(CDX-GT570/GT570S)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
switchable) (CDX-GT527EE)
Audio outputs terminal (front/rear)
(CDX-GT570/GT570S)
Subwoofer output terminal (mono)
(CDX-GT570/GT570S)
Power antenna (aerial) relay control terminal
Power amplifier control terminal
Inputs
Telephone ATT control terminal
(CDX-GT527EE)
BUS control input terminal
BUS audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
(CDX-GT527EE)
BUS control input terminal
BUS audio input terminal
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
Tone controls
Low: ±10 dB at 60 Hz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Mid: ±10 dB at 1 kHz (XPLOD)
High: ±10 dB at 10 kHz (XPLOD)
Power requirements
12 V DC car battery (negative ground (earth))
Dimensions
Approx. 178
×
50
×
180 mm
(7
1/8
×
2
×
7
1/8
in.) (w/h/d)
Mounting dimensions
Approx. 182
×
53
×
162 mm
(7
1/4
×
2
1/8
×
6
1/2
in.) (w/h/d)
Mass
Approx. 1.2 kg (2 lb. 11 oz.)
Supplied accessories
Card remote commander: RM-X151
Parts for installation and connections (1 set)
Parts for installation and connections (1 set)
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
patents licensed from Fraunhofer IIS and Thomson.
Design and specifications are subject to change without
notice.
notice.
• Abbreviation
EA: Saudi Arabia model
optical pick-up
semi-fixed resistor
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SERVICE NOTES
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
3
CDX-GT527EE/GT570/GT570S
•
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
This label is located on the bottom of the chassis.
This compact disc player is classified as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged
• Notice that the minus side of a tantalum capacitor may be damaged
by heat.
TEST DISCS
Please use the following test discs for the check on the CD section.
YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)
PATD-012 (Part No. 4-225-203-01)
• CD playback
You can play CD-DA (also containing CD TEXT) and CD-R/
CD-RW (MP3/WMA files).
CD-RW (MP3/WMA files).
Type of discs
Label on the disc
CD-DA
MP3
WMA
Ver. 1.2
4
CDX-GT527EE/GT570/GT570S
TABLE OF CONTENTS
1.
SERVICE NOTE
........................................................
5
2.
GENERAL
Location of controls and basic operations
(CDX-GT527EE) ............................................................
(CDX-GT527EE) ............................................................
6
Connections (CDX-GT527EE) .......................................
6
Location of controls and basic operations
(CDX-GT570/GT570S) ...................................................
(CDX-GT570/GT570S) ...................................................
8
Connections (CDX-GT570/GT570S) ..............................
8
3.
DISASSEMBLY
3-1.
Sub (AUX) Panel Assy .................................................... 11
3-2.
CD Mechanism Block ..................................................... 11
3-3.
MAIN Board .................................................................... 12
3-4.
SERVO Board .................................................................. 12
3-5.
Chassis (T) Sub Assy ....................................................... 13
3-6.
Roller Arm Assy .............................................................. 13
3-7.
Chassis (OP) Assy ........................................................... 14
3-8.
Chucking Arm Sub Assy ................................................. 14
3-9.
Sled Motor Assy .............................................................. 15
3-10. Optical Pick-up Section ................................................... 16
3-11. Optical Pick-up ................................................................ 16
3-11. Optical Pick-up ................................................................ 16
4.
DIAGNOSIS FUNCTION
........................................ 17
5.
DIAGRAMS
5-1.
Block Diagram –Main Section– ...................................... 21
5-2.
Block Diagram –Display Section– .................................. 22
5-3.
Printed Wiring Board –Main Section– ............................ 23
5-4.
Schematic Diagram –Main Section (1/3)– ...................... 24
5-5.
Schematic Diagram –Main Section (2/3)– ...................... 25
5-6.
Schematic Diagram –Main Section (3/3)– ...................... 26
5-7.
Printed Wiring Board –Sub Section– .............................. 27
5-8.
Schematic Diagram –Sub Section– ................................. 27
5-9.
Printed Wiring Board –Display Section– ........................ 28
5-10. Schematic Diagram –Display Section– ........................... 29
6.
EXPLODED VIEWS
6-1.
Main Section .................................................................... 33
6-2.
Front Panel Section ......................................................... 34
6-3.
CD Mechanism Section (MG-101TC-188//Q) ................ 35
7.
ELECTRICAL PARTS LIST
.................................. 36
