Read Sony CDX-GT522U / CDX-GT527U Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
SPECIFICATIONS
9-893-575-01
2012J33-1
©
2012.10
E Model
CDX-GT522U
Indian Model
CDX-GT527U
Ver. 1.0 2012.10
Model Name Using Similar Mechanism
CDX-GT520U/GT525U
Mechanism Type
MG-101CA-188
Optical Pick-up Name
DAX-25A
• The tuner and CD sections have no adjustments.
Photo: CDX-GT522U
E, Korean and Indian models
FM/AM COMPACT DISC PLAYER
Saudi Arabia model
FM/MW/SW COMPACT DISC PLAYER
CDX-GT522U/GT527U
Tu
(E, Korean and Indian models)
ner section
FM
Tuning range:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 108.0 MHz (at 100 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
87.5 – 108.0 MHz (at 100 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
FM tuning step
50 kHz/100 kHz/200 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range:
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
530 – 1,710 kHz (at 10 kHz step)
AM tuning step
9 kHz/10 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
(at 9 kHz step)
9,115 kHz or 9,125 kHz/5 kHz
(at 10 kHz step)
(at 9 kHz step)
9,115 kHz or 9,125 kHz/5 kHz
(at 10 kHz step)
Sensitivity: 26 μV
CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
USB Player section
Interface: USB (Full-speed)
Maximum current: 1 A
Maximum current: 1 A
Power amplifier section
Output: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W u 4 (at 4 ohms)
Speaker impedance: 4 – 8 ohms
Maximum power output: 52 W u 4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front, rear/sub
switchable)
Power antenna (aerial)/Power amplifier
control terminal (REM OUT)
switchable)
Power antenna (aerial)/Power amplifier
control terminal (REM OUT)
Inputs:
Remote controller input terminal
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
USB port
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
USB port
Power requirements: 12 V DC car battery
(negative ground (earth))
Dimensions: Approx. 178 u 50 u 177 mm
(7
1
/
8
u 2 u 7 in) (w/h/d)
Mounting dimensions: Approx. 182 u 53 u 160 mm
(7
1
/
4
u 2
1
/
8
u 6
5
/
16
in) (w/h/d)
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories:
Supplied accessories:
Remote commander: RM-X211
Parts for installation and connections (1 set)
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
without notice.
Tuner section
FM
Tuning range:
87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
MW
Tuning range:
531 – 1,602 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
Sensitivity: 26 μV
SW
Tuning range:
SW1: 2,940 – 7,735 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
ensitivity: 26 μV
(Saudi Arabia model)
CDX-GT522U/GT527U
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Android is a trademark of Google Inc. Use
of this trademark is subject to Google
Permissions.
of this trademark is subject to Google
Permissions.
ZAPPIN and Quick-BrowZer are
trademarks of Sony Corporation.
trademarks of Sony Corporation.
Windows Media is either a registered
trademark or trademark of Microsoft
Corporation in the United States and/or
other countries.
trademark or trademark of Microsoft
Corporation in the United States and/or
other countries.
This product contains technology subject
to certain intellectual property rights of
Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate
license(s) from Microsoft.
to certain intellectual property rights of
Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate
license(s) from Microsoft.
MPEG Layer-3 audio coding technology
and patents licensed from Fraunhofer IIS
and Thomson.
and patents licensed from Fraunhofer IIS
and Thomson.
CDX-GT522U/GT527U
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up
semi-fixed resistor
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
1.
SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 7
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 13
3-2. Mini Fuse (Blade Type) (10A/32V) (FU1), Cover ......... 13
3-3. Sub Panel Block .............................................................. 14
3-4. CD Mechanism Deck (MG-101CA-188) ....................... 14
3-5. MAIN
3-3. Sub Panel Block .............................................................. 14
3-4. CD Mechanism Deck (MG-101CA-188) ....................... 14
3-5. MAIN
Board
................................................................... 15
3-6. SERVO
Board
................................................................. 15
3-7. Chassis (T) Sub Assy ...................................................... 16
3-8. Roller
3-8. Roller
Arm
Assy
.............................................................. 16
3-9. Chassis
(OP)
Assy
........................................................... 17
3-10. Chucking Arm Sub Assy ................................................. 17
3-11. Sled Motor Assy .............................................................. 18
3-12. Optical Pick-up Section .................................................. 19
3-13. Optical Pick-up ............................................................... 19
3-11. Sled Motor Assy .............................................................. 18
3-12. Optical Pick-up Section .................................................. 19
3-13. Optical Pick-up ............................................................... 19
4. DIAGRAMS
4-1. Block Diagram - SERVO Section - ................................ 21
4-2. Block Diagram - MAIN Section - ................................... 22
4-3. Block
4-2. Block Diagram - MAIN Section - ................................... 22
4-3. Block
Diagram
- PANEL, POWER SUPPLY Section - ........................... 23
4-4. Schematic Diagram - MAIN Section (1/5) - ................... 25
4-5. Schematic Diagram - MAIN Section (2/5) - ................... 26
4-6. Schematic Diagram - MAIN Section (3/5) - ................... 27
4-7. Schematic Diagram - MAIN Section (4/5) - ................... 28
4-8. Schematic Diagram - MAIN Section (5/5) - ................... 29
4-9. Printed
4-5. Schematic Diagram - MAIN Section (2/5) - ................... 26
4-6. Schematic Diagram - MAIN Section (3/5) - ................... 27
4-7. Schematic Diagram - MAIN Section (4/5) - ................... 28
4-8. Schematic Diagram - MAIN Section (5/5) - ................... 29
4-9. Printed
Wiring
Board
- MAIN Section (1/2) (Former type) - ............................ 30
4-10. Printed Wiring Boards
- MAIN Section (2/2) (Former type) - ............................ 31
4-11. Printed Wiring Board
- MAIN Section (1/2) (New type) - ................................ 32
4-12. Printed Wiring Boards
- MAIN Section (2/2) (New type) - ................................ 33
4-13. Printed Wiring Board - KEY Board (Suffi x-11) - ........... 34
4-14. Printed Wiring Board - KEY Board (Suffi x-21) - ........... 35
4-15. Schematic Diagram - KEY Board - ................................ 36
4-14. Printed Wiring Board - KEY Board (Suffi x-21) - ........... 35
4-15. Schematic Diagram - KEY Board - ................................ 36
5.
EXPLODED VIEWS
5-1. Main
Section
................................................................... 46
5-2. Front Panel Section ......................................................... 47
5-3. CD Mechanism Deck Section (MG-101CA-188) .......... 48
5-3. CD Mechanism Deck Section (MG-101CA-188) .......... 48
6.
ELECTRICAL PARTS LIST
.............................. 49
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
Note: Refer to the servicing notes “MAIN AND KEY
BOARDS DISCRIMINATION” (page 6) for how to
distinguish New type and Former type of the MAIN
board, Suffi x-11 and Suffi x-21 of the KEY board.
distinguish New type and Former type of the MAIN
board, Suffi x-11 and Suffi x-21 of the KEY board.
CDX-GT522U/GT527U
4
NOTE THE MAIN BOARD OR SYSTEM CONTROLLER
(IC501) REPLACING
When the MAIN board or system controller (IC501) is replaced,
the destination setting is necessary.
(IC501) REPLACING
When the MAIN board or system controller (IC501) is replaced,
the destination setting is necessary.
1. Destination Setting
Set destination according to the procedure below.
Set destination according to the procedure below.
1-1. Setting the Destination Code
1. In the state of source off (the clock is displayed), enter the test
1. In the state of source off (the clock is displayed), enter the test
mode by pressing the buttons in order of the [SHUF 4] t [5]
t [PAUSE 6] (press only the [PAUSE 6] button for two sec-
t [PAUSE 6] (press only the [PAUSE 6] button for two sec-
onds).
2. In the state in which the system controller version is displayed
on the liquid crystal display (refer to following fi gure), enter
the destination setting mode by pressing the buttons in order
of the [
the destination setting mode by pressing the buttons in order
of the [
> M
SEEK+] t [SEEK–
m
.
] t [PUSH EN-
TER/MENU].
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
System controller version
SHUF
3. Input the alphanumeric character of 12 digits of “F XXXXXX”
displayed on the liquid crystal display, and execute the destina-
tion setting.
tion setting.
Note: Refer to following “1-3. Entering the Destination Code” for opera-
tion method.
4. The resetting operation is executed by pressing the [
OFF
SOURCE] button for 1 second after the setting ends, and the
unit returns to the normal condition.
unit returns to the normal condition.
1-2. Display in Destination Setting Mode
(Displayed characters/values in the following fi gure are example)
(Displayed characters/values in the following fi gure are example)
Destination code
12 digit
OP5 OP4 OP3 OP2 OP1 OP0
SHUF
1-3. Entering the Destination Code
• Method of operation by main unit
• Method of operation by main unit
1. Rotate the control dial, and select the alphanumeric character
of “0 to F”.
2. The digit advances by pressing the [PUSH ENTER/MENU] or
[
> M
SEEK+] button.
The digit returns by pressing the [ MODE] or [SEEK–
m
.
] button.
3. The setting is completed by pressing the [PUSH ENTER/
MENU] button, and the initialization operation is done.
• Method of operation by remote commander
OFF
PTY
DSPL/
SCRL
SOUND
SOURCE
MODE
ATT
VOL
+
–
+
–
MENU
ENTER
1. Press the [ ] or [ ] button, and select the alphanumeric char-
acter of “0 to F”.
2. The digit advances by pressing the [
] button.
The digit returns by pressing the [
] button.
3. The setting is completed by pressing the [ENTER] button, and
the initialization operation is done.
1-4. Destination Code
Model
Destination OP5 OP4 OP3 OP2 OP1 OP0
CDX-GT522U
E, Korean
0
0
B
8
0
0
Saudi Arabia
0
0
B
8
0
4
CDX-GT527U
Indian
0
0
B
8
0
0
2. Confi rmation After Destination Setting
Execute the following operation after completing the destination
setting, and confi rm a correct destination was set.
Execute the following operation after completing the destination
setting, and confi rm a correct destination was set.
Destination setting checking method:
1. In the state of source off (the clock is displayed on the liquid
1. In the state of source off (the clock is displayed on the liquid
crystal display), enter the test mode by pressing the buttons in
order of the [SHUF 4] t [5] t [PAUSE 6] (press only the
order of the [SHUF 4] t [5] t [PAUSE 6] (press only the
[PAUSE 6] button for two seconds).
2. In the state in which the system controller version is displayed
on the liquid crystal display (refer to following fi gure), enter
the destination setting value display mode by pressing the [
the destination setting value display mode by pressing the [
SCRL DSPL] button.
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
System controller version
SHUF
3. Confi rm the alphanumeric character of 12 digits in liquid crys-
tal display is an value correctly input.
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
Destination code
12 digit
OP5 OP4 OP3 OP2 OP1 OP0
SHUF
4. The resetting operation is executed by pressing the [
OFF
SOURCE] button for 1 second after the confi rming ends, and
the unit returns to the normal condition.
the unit returns to the normal condition.