CDX-GT50UI - Sony Car Audio Service Manual (repair manual). Page 3

3

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

You can play CD-DA (also containing CD TEXT*), CD-R/CD-
RW (MP3/WMA/AAC files also containing Multi Session) and
ATRAC CD (ATRAC3 and ATRAC3plus format).

Type of discs

Label on the disc

CD-DA

MP3

WMA

AAC

ATRAC CD

* A CD TEXT disc is a CD-DA that includes information such as

disc, artist and track name.

........................................................

4

Location of Controls ........................................................

5

Connections .....................................................................

6

3-1.

Sub Panel (FL-U) Assy .................................................... 11

3-2.

CD Mechanism Block ..................................................... 11

3-3.

Main Board ...................................................................... 12

3-4.

Servo Board ..................................................................... 12

3-5.

Chassis (T) Sub Assy ....................................................... 13

3-6.

Roller Arm Assy .............................................................. 13

3-7.

Chassis (OP) Assy ........................................................... 14

........................................ 15

5-1.

Block Diagram –Main Section– ...................................... 19

5-2.

Block Diagram –Display Section– .................................. 20

5-3.

Printed Wiring Board –Main Section– ............................ 22

5-4.

Schematic Diagram –Main Section (1/4)– ...................... 24

5-5.

Schematic Diagram –Main Section (2/4)– ...................... 25

5-6.

Schematic Diagram –Main Section (3/4)– ...................... 26

5-7.

Schematic Diagram –Main Section (4/4)– ...................... 27

5-8.

Printed Wiring Board –Key Section– .............................. 28

5-9.

Schematic Diagram –Key Section– ................................. 29

6-1.

Main Section .................................................................... 35

6-2.

Front Panel Section ......................................................... 36

6-3.

CD Mechanism Section (MG-101U-188//Q) .................. 37

.................................. 38

Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be damaged

by heat.

TEST DISCS
Please use the following test discs for the check on the CD section.

YDES-18 (Part No. 3-702-101-01)
PATD-012 (Part No. 4-225-203-01)