Read Sony CDX-G1000U / CDX-G1000UE / CDX-G1001U / CDX-G1002U / CDX-G1050U / CDX-G1050UE / CDX-G1051U / CDX-G1070U / CDX-G1071U / CDX-G1080UM Service Manual online
(AEP and UK models)
models)
87.5 - 108.0 MHz (at 50 kHz step)
87.5 - 108.0 MHz (at 100 kHz step)
87.5 - 107.9 MHz (at 200 kHz step)
For Argentine models:
87.5 - 107.9 MHz
531 - 1,602 kHz (at 9 kHz step)
530 - 1,710 kHz (at 10 kHz step)
For Argentine models:
530 - 1,710 kHz
9,124.5 kHz or 9,115.5 kHz/4.5 kHz (at 9 kHz
step)
9,115 kHz or 9,125 kHz/5 kHz (at 10 kHz step)
For Argentine models:
9,115 kHz or 9,125 kHz/5 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
SW2: 9,500 – 18,135 kHz
(except for 10,140 – 11,575 kHz)
this model, has been issued in a separate volume.
Please refer to the service manual of the MG-101
series for the mechanism deck information.
•
aged by heat.
•
repairing.
circuit board (within 3 times).
or unsoldering.
REPLACE THESE COMPONENTS WITH SONY PARTS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Corporation.
or trademark of Microsoft Corporation in the
United States and/or other countries.
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
patents licensed from Fraunhofer IIS and
Thomson.
trademark is subject to Google Permissions.
files (tracks) per folder: 512
Power antenna (aerial)/Power amplifier
control terminal (REM OUT)
Antenna (aerial) input terminal
AUX input jack (stereo mini jack)
USB port
(7
(7
G1050UE/G1051U/G1070U/G1071U/G1080UM only)
Parts for installation and connections (1 set)
change without notice.
3-3. Sub
3-5. MAIN
4-2. Printed Wiring Boards - MAIN Section (2/2) - .............. 23
4-3. Schematic Diagram - MAIN Section (1/4) - ................... 24
4-4. Schematic Diagram - MAIN Section (2/4) - ................... 25
4-5. Schematic Diagram - MAIN Section (3/4) - ................... 26
4-6. Schematic Diagram - MAIN Section (4/4) - ................... 27
5-2. Chassis
BLOCK OR BASE UNIT
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
• Unleaded solder melts at a temperature about 40 °C higher
applied to the solder joint for a slightly longer time.
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
also be added to ordinary solder.
As for this unit, circuit on the MAIN board has been changed in the
midway of production. Repair after distinguishing each type unit
to doing the repair referring to the following.
Type B : IC1301/1304 no mount
OR SYSTEM CONTROLLER (IC501)
When the complete MAIN board or system controller (IC501) is
replaced, the destination setting is necessary.
Set destination according to the procedure below.
1. In the state of source off (the clock is displayed), enter the test
t [PAUSE 6] (press only the [PAUSE 6] button for two sec-
the destination setting mode by pressing the buttons in order
of the [
ample)
tion setting.
returns to the normal condition.
(Displayed characters/values in the following fi gure are example)
• Method of operation by main unit
(CDX-G1050U/G1050UE/G1051U/G1070U/G1071U/