Read Sony CDX-CA680N Service Manual online
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Ver 1.0 2003. 07
Model Name Using Similar Mechanism
CDX-CA680X
CD Drive Mechanism Type
MG-393XC-121//Q
Optical Pick-up Name
KSS-721A
SERVICE MANUAL
Thai Model
CDX-CA680N
FM/AM COMPACT DISC PLAYER
• The tuner and CD sections have no adjustments.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-961-054-01
2003G04-1
© 2003. 07
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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
CDX-CA680N
TEST DISCS
This set can playback CD-R and CD-ROM discs. The following
test discs should be used to check the capability:
test discs should be used to check the capability:
CD-R test disc TCD-R082LMT (Part No. J-2502-063-1)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
CD-RW test disc TCD-W082L (Part No. J-2502-063-2)
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
EXTENSION CABLE AND SERVICE POSITION
When repairing or servicing this set, connect the jig (extension cable)
as shown below.
as shown below.
• Connect the MAIN board (CNP301) and the SERVO board (CN1)
with the extension cable (Part No. J-2502-011-1).
CDX-CA680N
MAIN BOARD
CNP301
CNP301
J-2502-011-1
SERVO BOARD
CN1
CN1
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TABLE OF CONTENTS
1. DISASSEMBLY
1-1. Sub Panel Assy .................................................................... 5
1-2. CD Mechanism Block ......................................................... 6
1-3. Main Board ......................................................................... 6
1-4. Heat Sink ............................................................................. 7
1-5. Chassis (T.U) Assy .............................................................. 7
1-6. Disc in Board ...................................................................... 8
1-7. Servo Board ......................................................................... 8
1-8. Shaft Roller Assy ................................................................ 9
1-9. Floating Block Assy ............................................................ 9
1-10. Optical Pick-up Block ....................................................... 10
1-2. CD Mechanism Block ......................................................... 6
1-3. Main Board ......................................................................... 6
1-4. Heat Sink ............................................................................. 7
1-5. Chassis (T.U) Assy .............................................................. 7
1-6. Disc in Board ...................................................................... 8
1-7. Servo Board ......................................................................... 8
1-8. Shaft Roller Assy ................................................................ 9
1-9. Floating Block Assy ............................................................ 9
1-10. Optical Pick-up Block ....................................................... 10
2. DIAGRAMS
2-1. IC Pin Description ............................................................. 11
2-2. Block Diagram –CD Section– ........................................... 12
2-3. Block Diagram –Tuner Section– ....................................... 13
2-4. Block Diagram –Display Section– .................................... 14
2-5. Circuit Boards Location .................................................... 15
2-6. Printed Wiring Boards –CD Mechanism Section– ............ 16
2-7. Schematic Diagram –CD Mechanism Section– ................ 18
2-8. Printed Wiring Board –Main Section– .............................. 19
2-9. Schematic Diagram –Main Section (1/2)– ........................ 20
2-10. Schematic Diagram –Main Section (2/2)– ........................ 21
2-11. Printed Wiring Board –Relay Section– ............................. 22
2-12. Printed Wiring Board –Key Section– ................................ 23
2-13. Schematic Diagram –Key Section– ................................... 24
2-14. IC Block Diagrams ............................................................ 25
2-2. Block Diagram –CD Section– ........................................... 12
2-3. Block Diagram –Tuner Section– ....................................... 13
2-4. Block Diagram –Display Section– .................................... 14
2-5. Circuit Boards Location .................................................... 15
2-6. Printed Wiring Boards –CD Mechanism Section– ............ 16
2-7. Schematic Diagram –CD Mechanism Section– ................ 18
2-8. Printed Wiring Board –Main Section– .............................. 19
2-9. Schematic Diagram –Main Section (1/2)– ........................ 20
2-10. Schematic Diagram –Main Section (2/2)– ........................ 21
2-11. Printed Wiring Board –Relay Section– ............................. 22
2-12. Printed Wiring Board –Key Section– ................................ 23
2-13. Schematic Diagram –Key Section– ................................... 24
2-14. IC Block Diagrams ............................................................ 25
3. EXPLODED VIEWS
3-1. Chassis Section ................................................................. 27
3-2. Main Board Section .......................................................... 28
3-3. Front Panel Section ........................................................... 29
3-4. CD Mechanism Section (1) ............................................... 30
3-5. CD Mechanism Section (2) ............................................... 31
3-6. CD Mechanism Section (3) ............................................... 32
3-2. Main Board Section .......................................................... 28
3-3. Front Panel Section ........................................................... 29
3-4. CD Mechanism Section (1) ............................................... 30
3-5. CD Mechanism Section (2) ............................................... 31
3-6. CD Mechanism Section (3) ............................................... 32
4. ELECTRICAL PARTS LIST
........................................ 33
CDX-CA680N