Read Sony CDX-747X Service Manual online
2
CDX-747X
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
Installation .......................................................................
4
Connections .....................................................................
4
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
5
3-2. Case (Upper T), Front Panel Assy ..................................
6
3-3. Mechanism Deck (MG-251B-137) .................................
6
3-4. JACK Board ....................................................................
7
3-5. MAIN Board, Slide Variable Resister
(Elevator Height Sensor) (RV202) .................................
7
3-6. ELJ Motor Assy (Elevator) (M104) ................................
8
3-7. Escutcheon (T) ................................................................
8
3-8. Chassis (U.S) Sub Assy ..................................................
9
3-9. Chassis Assy ....................................................................
9
3-10. RF Board ......................................................................... 10
3-11. Sled Motor Assy (251) (M101),
3-11. Sled Motor Assy (251) (M101),
Optical Pick-up (KSS-720A) .......................................... 10
3-12. LSW Board, Spindle Motor (S) Sub Assy (M102) ........ 11
3-13. ELJ Motor Assy (Chucking) (M103) ............................. 11
3-13. ELJ Motor Assy (Chucking) (M103) ............................. 11
4.
ASSEMBLY
4-1. Assembly Flow ................................................................ 12
4-2. Optical Pick-up Complete Assy ...................................... 12
4-3. Gear (Lomini)/(Load Cam) Assy .................................... 13
4-4. Operation Check ............................................................. 13
4-2. Optical Pick-up Complete Assy ...................................... 12
4-3. Gear (Lomini)/(Load Cam) Assy .................................... 13
4-4. Operation Check ............................................................. 13
5.
MECHANICAL ADJUSTMENT
.......................... 14
6.
ELECTRICAL CHECK
.......................................... 15
7.
DIAGRAMS
7-1. Block Diagram – SERVO Section – .............................. 17
7-2. Block Diagram
7-2. Block Diagram
– BUS CONTROL/POWER SUPPLY Section – ........... 18
7-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 19
7-4. Printed Wiring Boards – RF/LSW Boards – ................. 20
7-5. Schematic Diagram – RF/LSW Boards – ...................... 21
7-6. Printed Wiring Boards
7-5. Schematic Diagram – RF/LSW Boards – ...................... 21
7-6. Printed Wiring Boards
– MAIN Board (Component Side) – .............................. 22
7-7. Printed Wiring Boards
– MAIN (Conductor Side)/SWITCH Boards – .............. 23
7-8. Schematic Diagram – MAIN Board (1/3) – .................. 24
7-9. Schematic Diagram – MAIN Board (2/3) – .................. 25
7-10. Schematic Diagram
7-9. Schematic Diagram – MAIN Board (2/3) – .................. 25
7-10. Schematic Diagram
– MAIN (3/3)/SWITCH Boards – .................................. 26
7-11. Printed Wiring Boards – JACK Board – ........................ 27
7-12. Schematic Diagram – JACK Board – ............................. 27
7-13. IC Pin Function Description ........................................... 32
7-12. Schematic Diagram – JACK Board – ............................. 27
7-13. IC Pin Function Description ........................................... 32
8.
EXPLODED VIEWS
8-1. Case Section .................................................................... 35
8-2. Mechanism Deck Section-1 (MG-251B-137) ................ 36
8-3. Mechanism Deck Section-2 (MG-251B-137) ................ 37
8-4. Mechanism Deck Section-3 (MG-251B-137) ................ 38
8-5. Mechanism Deck Section-4 (MG-251B-137) ................ 39
8-2. Mechanism Deck Section-1 (MG-251B-137) ................ 36
8-3. Mechanism Deck Section-2 (MG-251B-137) ................ 37
8-4. Mechanism Deck Section-3 (MG-251B-137) ................ 38
8-5. Mechanism Deck Section-4 (MG-251B-137) ................ 39
9.
ELECTRICAL PARTS LIST
............................... 40
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
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