Read Sony CDX-715 (serv.man2) Service Manual online
SERVICE MANUAL
CDX-715
US Model
Canadian Model
AEP Model
UK Model
E Model
SUPPLEMENT-1
File this supplement with the service manual.
(ENG-98014)
Subject: Mechanism Deck Modification (MG-250C-137)
TABLE OF CONTENTS
1.
NEW/FORMER DISCRIMINATION
....................
2
2.
DIAGRAMS
2-1. Printed Wiring Board
– MAIN Section – MAIN Board (Component side) ......
3
– MAIN Section – MAIN Board (Conductor side) ........
5
2-2. Schematic Diagram
– MAIN Section – MAIN Board (1/2) ...........................
7
– MAIN Section – MAIN Board (2/2) ...........................
9
2-3. Printed Wiring Board – JACK Section – ....................... 11
2-4. Schematic Diagram – JACK Section – .......................... 12
2-4. Schematic Diagram – JACK Section – .......................... 12
3.
EXPLODED VIEWS
................................................ 13
4.
ELECTRICAL PARTS LIST
............................... 17
– 2 –
1. NEW/FORMER DISCRIMINATION
The mechanism deck was changed from MG-250B-137 to
MG-250C-137.
At the same time, main and jack boards were been changed.
This supplement contains only new type mechanism deck,
main and jack boards.
MG-250C-137.
At the same time, main and jack boards were been changed.
This supplement contains only new type mechanism deck,
main and jack boards.
7Y187A
B: MG-250B-137
C: MG-250C-137
C: MG-250C-137
CDX-715
– 3 –
– 4 –
D301
F-4
D302
F-4
D303
F-4
D304
E-2
D305
E-2
D306
E-6
D307
G-4
D308
F-4
D309
E-2
D310
E-3
D311
F-5
D312
E-3
D313
C-2
D314
F-3
IC101
B-6
IC102
D-5
IC201
E-7
IC202
D-8
IC301
F-3
IC302
F-5
IC304
G-4
IC401
B-5
IC402
C-5
IC403
B-4
IC601
E-5
Q201
E-8
Q301
G-4
Q302
G-4
Q303
F-4
Q304
B-2
Q601
C-3
Q602
C-3
Q610
D-3
Q620
C-3
2. DIAGRAMS
2-1.
2-1.
PRINTED WIRING BOARD – MAIN Section – MAIN Board (Component Side)
• Semiconductor
Location
(Component Side)
(Component Side)
Ref. No.
Location
CDX-715
– 5 –
– 6 –
– MAIN Section – MAIN Board (Conductor Side)
IC303
E-8
IC305
D-8
Q305
C-8
• Semiconductor
Location
(Conductor Side)
(Conductor Side)
Ref. No.
Location
Note on Printed Wiring Board:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
•
r
: Through hole.
•
¢
: internal component.
• b
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Abbreviation
G
: German
TW
: Taiwan
