Read Sony CDC-R237 Service Manual online
1
Ver 1.0 2003. 02
Model Name Using Similar Mechanism
NEW
CD Drive Mechanism Type
MG-930B-185
Optical Pick-up Name
OPTIMA-752B2
SERVICE MANUAL
AEP Model
UK Model
CDC-R237
RADIO SECTION
(FM)
Frequency Range: 87.5 MHz – 108 MHz
Intermediate frequency: 10.7 MHz
Usable Sensitivity: 12.7 dBf
50 dB Quieting Sensitivity: 17.2 dBf
IF Rejection: 100 dB
Frequency Response: 30 Hz – 15,000 Hz
S/N Ratio: 67 dB
Stereo Separation: 35 dB at 1 kHz
Alternate Channel Selectivity: 98 dB
Capture Ratio: 3 dB
Intermediate frequency: 10.7 MHz
Usable Sensitivity: 12.7 dBf
50 dB Quieting Sensitivity: 17.2 dBf
IF Rejection: 100 dB
Frequency Response: 30 Hz – 15,000 Hz
S/N Ratio: 67 dB
Stereo Separation: 35 dB at 1 kHz
Alternate Channel Selectivity: 98 dB
Capture Ratio: 3 dB
(MW)
Frequency Range: 531 kHz – 1,602 kHz
Intermediate frequency: 10.71 MHz/450 kHz
Usable Sensitivity: 30 µV (30 dB)
Intermediate frequency: 10.71 MHz/450 kHz
Usable Sensitivity: 30 µV (30 dB)
(LW)
Frequency Range: 144 kHz – 288 kHz (1 kHz/9 kHz step)
Intermediate frequency: 10.71 MHz/450 kHz
Usable Sensitivity: 30 µV (30 dB)
Intermediate frequency: 10.71 MHz/450 kHz
Usable Sensitivity: 30 µV (30 dB)
SPECIFICATIONS
CD SECTION
Frequency Response: 17 Hz – 20 kHz +0/–3 dB
Dynamic Range: More than 92 dB
Channel Separation: More than 60 dB
S/N Ratio: More than 92 dB
Wow/Flutter: Unmeasurable
Dynamic Range: More than 92 dB
Channel Separation: More than 60 dB
S/N Ratio: More than 92 dB
Wow/Flutter: Unmeasurable
AUDIO SECTION
Max. Power Output: 45 W
× 4 channels
AUX Input
Input sensitivity (load impedance) AUX: 300 mV (10 k
Ω)
• The CD section have no adjustment.
Sony Corporation
e Vehicle Company
Published by Sony Engineering Corporation
9-877-041-01
2003B0400-1
© 2003. 02
– Continued on next page –
FM/MW/LW COMPACT DISC PLAYER
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CDC-R237
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
GENERAL
Power-Supply Voltage: 14.4 V (11 to 16 V allowable),
DC, negative ground
Load Impedance: 4
Ω
Tone Control: Bass ±10 dB at 100 Hz,
Treble ±10 dB at 10 kHz
Preamp Output Voltage (load impedance): 2.2 V (10 k
Ω)
Installed size: 182 (W)
× 53 (H) × 155 (D) mm
Supplied Accessory: Carrying case (1)
• Specifications and external appearance are subject
to change without notice due to product improvement.
SERVICE NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission, ob-
serve from more than 30 cm away from the objective lens.
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures other
than those specified herein may result in hazardous radiation
exposure.
than those specified herein may result in hazardous radiation
exposure.
This compact disc player is classified as a CLASS 1 LASER
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
product. The CLASS 1 LASER PRODUCT label is located on the
exterior.
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TABLE OF CONTENTS
1. GENERAL
Connections ............................................................................. 4
2. DISASSEMBLY
2-1. Sub Panel Assy .................................................................... 7
2-2. CD Mechanism Block ......................................................... 7
2-3. Main Board Section ............................................................ 8
2-4. Main Board ......................................................................... 8
2-5. Heat Sink (CT) .................................................................... 9
2-6. Sub Board ............................................................................ 9
2-7. Servo Board ....................................................................... 10
2-8. Floating Block Assy .......................................................... 10
2-9. Lever Assy (CD Up Holder) .............................................. 11
2-10. Lever (CD Roller) Sub Assy ............................................. 11
2-11. Lever Assy (CD Holder) ................................................... 12
2-12. Motor (Sled) Sub Assy ...................................................... 12
2-13. Pick-up Sub Assy .............................................................. 13
2-2. CD Mechanism Block ......................................................... 7
2-3. Main Board Section ............................................................ 8
2-4. Main Board ......................................................................... 8
2-5. Heat Sink (CT) .................................................................... 9
2-6. Sub Board ............................................................................ 9
2-7. Servo Board ....................................................................... 10
2-8. Floating Block Assy .......................................................... 10
2-9. Lever Assy (CD Up Holder) .............................................. 11
2-10. Lever (CD Roller) Sub Assy ............................................. 11
2-11. Lever Assy (CD Holder) ................................................... 12
2-12. Motor (Sled) Sub Assy ...................................................... 12
2-13. Pick-up Sub Assy .............................................................. 13
3. ELECTRICAL ADJUSTMENT
.................................... 14
4. DIAGRAMS
4-1. IC Pin Descriptions ........................................................... 15
4-2. Block Diagram –CD Section– ........................................... 19
4-3. Block Diagram –Main Section– ........................................ 20
4-4. Block Diagram –Front Section– ........................................ 21
4-5. Circuit Boards Location .................................................... 21
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
4-7. Schematic Diagram –CD Mechanism Section– ................ 24
4-8. Printed Wiring Board –Main Section– .............................. 25
4-9. Schematic Diagram –Main Section (1/2)– ........................ 26
4-10. Schematic Diagram –Main Section (2/2)– ........................ 27
4-11. Printed Wiring Boards –Front Section– ............................ 28
4-12. Schematic Diagram –Front Section– ................................ 29
4-13. IC Block Diagrams ............................................................ 30
4-2. Block Diagram –CD Section– ........................................... 19
4-3. Block Diagram –Main Section– ........................................ 20
4-4. Block Diagram –Front Section– ........................................ 21
4-5. Circuit Boards Location .................................................... 21
4-6. Printed Wiring Boards –CD Mechanism Section– ............ 22
4-7. Schematic Diagram –CD Mechanism Section– ................ 24
4-8. Printed Wiring Board –Main Section– .............................. 25
4-9. Schematic Diagram –Main Section (1/2)– ........................ 26
4-10. Schematic Diagram –Main Section (2/2)– ........................ 27
4-11. Printed Wiring Boards –Front Section– ............................ 28
4-12. Schematic Diagram –Front Section– ................................ 29
4-13. IC Block Diagrams ............................................................ 30
5. EXPLODED VIEWS
5-1. Chassis Section ................................................................. 32
5-2. Front panel Section ........................................................... 33
5-3. CD Mechanism Section (1) ............................................... 34
5-4. CD Mechanism Section (2) ............................................... 35
5-2. Front panel Section ........................................................... 33
5-3. CD Mechanism Section (1) ............................................... 34
5-4. CD Mechanism Section (2) ............................................... 35
6. ELECTRICAL PARTS LIST
........................................ 36
CDC-R237
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CDC-R237
SECTION 1
GENERAL
This section is extracted
from instruction manual.
from instruction manual.