Read Sony ZS-Y2L Service Manual online
SERVICE MANUAL
PERSONAL AUDIO SYSTEM
AEP Model
UK Model
SPECIFICATIONS
ZS-Y2L
CD player section
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6
Wave length: 780 nm
Emission duration: Continuous
Laser output: Less than 44.6
µW
(This output is the value measured at a distance
of about 200 mm from the objective lens surface
on the optical pick-up block with 7 mm
aperture.)
of about 200 mm from the objective lens surface
on the optical pick-up block with 7 mm
aperture.)
Spindle speed
200 r/min (rpm) to 500 r/min (rpm)
(CLV)
(CLV)
Number of channels
2
Frequency response
20 - 20 000 Hz +1/–2 dB
Wow and flutter
Below measurable limit
Radio section
Frequency range
FM
87.5 - 108 MHz
MW
531 - 1 611 kHz (9 kHz step)
530 - 1 610 kHz (10 kHz step)
530 - 1 610 kHz (10 kHz step)
LW
153 - 279 kHz
IF
FM: 10.7 MHz
MW/LW: 450 kHz
MW/LW: 450 kHz
Aerials
FM: Telescopic aerial
MW/LW: Built-in ferrite bar aerial
MW/LW: Built-in ferrite bar aerial
General
Speaker
Main speaker: 8 cm ( 3
1
⁄
4
in.) dia., 3.2
Ω, cone
type (2)
Input
LINE IN jack (stereo minijack):
Minimum input level 330 mV
Minimum input level 330 mV
Outputs
Headphones jack (stereo minijack):
For 16 - 64
For 16 - 64
Ω impedance headphones
OPTICAL DIGITAL OUT (CD) (optical output
connector):
Wavelength 630 - 690 nm
Maximum power output
5 W
Power requirements
For Personal Audio System:
230 V AC, 50 Hz
9 V DC, 6 R14 (size C) batteries
For remote control:
3 V DC, 2 R03 (size AAA) batteries
230 V AC, 50 Hz
9 V DC, 6 R14 (size C) batteries
For remote control:
3 V DC, 2 R03 (size AAA) batteries
Power consumption
AC 16 W
Battery life
CD playback
Sony R14P: approx. 1.5 h
Sony alkaline LR14: approx. 8 h
Radio reception
Sony R14P: approx. 6 h
Sony alkaline LR14: approx. 20 h
Dimensions
Approx. 455
× 214 × 180 mm (w/h/d)
(18
× 8
1
/
2
× 7
1
/
8
inches) (incl. projecting parts)
Mass
Approx. 3.5 kg (7 lb. 11oz.) (incl. batteries)
Supplied accessories
Mains lead (1)
Remote control (1)
Remote control (1)
Design and specifications are subject to change
without notice.
without notice.
Ver. 1.0 2005.03
Model Name Using Similar Mechanism
ZS-Y3L
Optical Pick-up Block Name
KSM-213RAP
Optical Pick-up Name
KSS-213R
9-879-505-01
2005C0578-1
© 2005.03
© 2005.03
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
Published by Sony Engineering Corporation
2
ZS-Y2L
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
About CD-Rs/CD-RWs
This player can play CD-Rs/CD-RWs
recorded in the CD-DA format*, but
playback capability may vary depending on
the quality of the disc and the condition of
the recording device.
recorded in the CD-DA format*, but
playback capability may vary depending on
the quality of the disc and the condition of
the recording device.
* CD-DA is the abbreviation for Compact
Disc Digital Audio. It is a recording
standard used for Audio CDs.
standard used for Audio CDs.
TABLE OF CONTENTS
1.
SERVICING NOTES
................................................
3
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1.
Disassembly Flow ...........................................................
6
3-2.
Cabinet (Rear) Assy .........................................................
7
3-3.
Cabinet (Upper) ...............................................................
7
3-4.
Chassis Section ................................................................
8
3-5.
CD Block Section ............................................................
8
3-6.
LCD Board ......................................................................
9
4.
ELECTRICAL ADJUSTMENTS
.......................... 10
5.
DIAGRAMS
5-1.
Block Diagram – CD Servo Section – ............................ 15
5-2.
Block Diagram – TUNER Section – .............................. 16
5-3.
Block Diagram – MAIN Section – ................................. 17
5-4.
Printed Wiring Board – CD Board – .............................. 18
5-5.
Schematic Diagram – CD Board –
............................. 19
5-6.
Printed Wiring Board – TU Board – ............................... 20
5-7.
Schematic Diagram – TU Board – ................................. 21
5-8.
Printed Wiring Boards – MAIN Section – ..................... 23
5-9.
Schematic Diagram – MAIN Section (1/2) – ................. 24
5-10. Schematic Diagram – MAIN Section (2/2) – ................. 25
5-11. Printed Wiring Boards – KEY Section – ........................ 26
5-12. Schematic Diagram – KEY Section – ............................ 27
5-13. Printed Wiring Boards – POWER Section – .................. 28
5-14. Schematic Diagram – POWER Section – ...................... 29
5-11. Printed Wiring Boards – KEY Section – ........................ 26
5-12. Schematic Diagram – KEY Section – ............................ 27
5-13. Printed Wiring Boards – POWER Section – .................. 28
5-14. Schematic Diagram – POWER Section – ...................... 29
6.
EXPLODED VIEWS
6-1.
Cabinet Rear Section ....................................................... 34
6-2.
Cabinet Front Section ...................................................... 35
6-3.
Chassis Section ................................................................ 36
6-4.
Lid CD Section ................................................................ 37
6-5.
Optical Pick-up Section (KSM-213RAP) ....................... 38
7.
ELECTRICAL PARTS LIST
.................................. 39
3
ZS-Y2L
SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S418. (push switch type)
The following checking method for the laser diode is operable.
•
diode is prohibited unless the upper lid is closed while turning ON
the S418. (push switch type)
The following checking method for the laser diode is operable.
•
Method
Emission of the laser diode is visually checked.
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. Push the S418 as shown in Fig.1.
2. Push the S418 as shown in Fig.1.
Note:
Do not push the detection lever strongly, or it may be bent or damaged.
3. Press the
u
button.
4. Check the object lens for confirming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 2
times along with inward motion for the focus search.
Fig.1 Method to push the S418
2
1
S418
4
ZS-Y2L
MAIN board
H/P board
TU board
HARNESS SETTING