Read Sony ZS-RS70BT / ZS-RS70BTB Service Manual online
ZS-RS70BT/RS70BTB
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE IC801 ON THE MAIN BOARD
IC801 on the MAIN board cannot replace with single. When this
part is damaged, replace the complete mounted board.
IC801 on the MAIN board cannot replace with single. When this
part is damaged, replace the complete mounted board.
TEST DISCS
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Use following TEST DISC (for CD) when this unit confi rms the
operation and checks it.
Part No.
Description
3-702-101-01 DISC
(YEDS-18),
TEST
4-225-203-01 DISC
(PATD-012),
TEST
CHUCK PLATE JIG ON REPAIRING
On repairing CD section, playing a disc without the CD lid, use
CHUCK PLATE JIG.
On repairing CD section, playing a disc without the CD lid, use
CHUCK PLATE JIG.
Note: The optical pick-up block has been changed in the midway of produc-
tion. It is not necessary for the optical pick-up block after change to use
the CHUCK PLATE JIG.
the CHUCK PLATE JIG.
Part No.
Description
X-4918-255-1
CHUCK PLATE JIG
NEW/FORMER DISCRIMINATION OF OPTICAL PICK-UP
BLOCK OR CD LID
The optical pick-up block has been changed in the midway of pro-
duction. In addition, the CD lid has also been changed along with
that, and the chucking plate has been deleted.
When replacing the optical pick-up block or CD lid, be sure to
open the CD lid and check the presence or absence of the chucking
plate on the bottom side of CD lid, and replace those after distin-
guishing the new/former.
BLOCK OR CD LID
The optical pick-up block has been changed in the midway of pro-
duction. In addition, the CD lid has also been changed along with
that, and the chucking plate has been deleted.
When replacing the optical pick-up block or CD lid, be sure to
open the CD lid and check the presence or absence of the chucking
plate on the bottom side of CD lid, and replace those after distin-
guishing the new/former.
With chucking plate
: Former type
(Former optical pick-up)
Without chucking plate : New type
(New optical pick-up)
Open the CD lid.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the S801 (push switch type).
The following checking method for the laser diode is operable.
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning on
the S801 (push switch type).
The following checking method for the laser diode is operable.
• Method
Emission of the laser diode is visually checked.
1. Open the CD lid.
2. Press the [POWER] (Except AEP, East European, Russian
Emission of the laser diode is visually checked.
1. Open the CD lid.
2. Press the [POWER] (Except AEP, East European, Russian
and UK models)/[OPERATE] (AEP, East European, Russian
and UK models) button to turn the power on.
and UK models) button to turn the power on.
3. Press the [CD] button to select CD function.
4. Push the S801 as shown in Fig.1.
4. Push the S801 as shown in Fig.1.
Note: Do not push the detection lever strongly, or it may be bent or
damaged.
5. Check the object lens for confi rming normal emission of the
laser diode. If not emitting, there is a trouble in the automatic
power control circuit or the optical pick-up.
power control circuit or the optical pick-up.
In this operation, the object lens will move up and down 4
times along with inward motion for the focus search.
times along with inward motion for the focus search.
S801
Fig. 1. Method to push the S801
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Ver. 1.4
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