ZS-R100CP - Sony Audio Service Manual (repair manual)

2012A33-1

© 

2012.01

Model Name Using Similar Mechanism

ZS-E5

Optical Pick-up Block Name

DA11B3VFGP

System

 

Compact disc digital audio system

Laser diode properties

 

 Emission duration: Continuous 
Laser output: Less than 44.6 μW 
(This output is the value measured at a 
distance of about 200 mm from the objective 
lens surface on the optical pick-up block with 
7 mm aperture.)

Number of channels

 

2

Frequency response

 

20 Hz - 20,000 Hz +1/–2 dB

Wow and flutter 

 

Below measurable limit

Frequency range

FM: 87.5 MHz - 108 MHz

AM:  531 kHz - 1,602 kHz

IF

FM: 128 kHz

AM: 45 kHz

Antennas

FM: Telescopic antenna

AM:  Built-in ferrite bar antenna (Internal 

antenna) 
AM loop antenna (supplied)

Supported bit rate

 

MP3 (MPEG 1 Audio Layer-3):

 

32 kbps - 320 kbps, VBR

 WMA:

 

48 kbps - 192 kbps, VBR

 

AAC (MPEG 4-AAC-LC Layer-3):

 

16 kbps - 320 kbps, VBR

Sampling frequencies

 

MP3 (MPEG 1 Audio Layer-3): 

 32/44.1/48 

kHz 

 WMA: 
 8/11.025/16/22.05/32/44.1/48 

kHz 

 AAC 

(MPEG4-AAC-LC): 

 8/11.025/12/16/22.05/24/32/44.1/48 

kHz 

 

 (USB) port 

 USB-A 

(Full 

Speed)

Speaker

 

 Full range: 8 cm (3 

1

/

4

 in) dia., 6 Ω, cone type 

(2)

Input

 

AUDIO IN Jack (stereo minijack)

 

   (USB) port: Type A, maximum current 
500 mA 
SD card slot

Outputs

 Headphones 

jack (stereo minijack)

 

For 16 Ω - 68 Ω impedance headphones

Power output

 

 1.5 W + 1.5 W (at 6 Ω, 10 % harmonic 
distortion)

Power requirements

 For 

player: 

 

230 V AC, 50 Hz 

 For 

clock’s 

batteries: 

 

 4.5 V DC, 3 R6 (size AA) batteries (not 
supplied)

Power consumption

 

AC 13 W

Dimensions

 

 Approx. 349.4 mm × 148.9 mm × 214 mm 
(w/h/d)  
(13 

7

/

8

 inches × 5 

7

/

8

 inches × 8 

1

/

2

 inches) 

(incl. projecting parts)

Mass

 

Approx. 2.8 kg (6 lb 3 oz) (incl. batteries)

Supplied accessories

 

AC power cord (1)*

1

 

AM loop antenna (1)

 

Operating Instructions (1)

 Warranty 

card 

(1)

*

1

  The supplied AC power cord is only for this 

system. Do not use with any other device.

Design and specifications are subject to change 
without notice.

  .............................................   3

2-1. Disassembly 

Flow 

...........................................................   4

2-2. Cabinet 

(Upper) 

Assy 

......................................................   5

2-3. CD 

Block 

Assy 

................................................................   6

2-4.  Optical Pick-up Block (DA11B3VFGP) (OP1) ..............   7
2-5. Spring 

(CD) 

.....................................................................   7

2-6.  Cabinet (Rear) Assy, Fuse (F901, F902) .........................   8
2-7. Antenna 

Terminal 

............................................................   8

2-8. POWER 

Board 

................................................................   9

2-9.  Chassis (Center) Sub Assy ..............................................   10
2-10. MAIN Board ...................................................................   11
2-11.  Box (R SP) Sub Assy, Box (L SP) ..................................   12
2-12.  Chassis (Net) Block ........................................................   12
2-13. USB Board ......................................................................   13
2-14.  Loudspeaker (8 cm) (SP101, SP201) ..............................   14
2-15.  LCD Board Block ...........................................................   15
2-16. Wire Setting ....................................................................   15

TEST  MODE 

 ............................................................   16

ADJUSTMENTS 

 ........................   18

5-1.  Block Diagram - CD/USB/SD Section - .........................   20
5-2.  Block Diagram - MAIN Section - ...................................   21
5-3. Block 

Diagram 

- PANEL/POWER SUPPLY Section - ............................   22

5-4.  Schematic Diagram - CD Board (1/2) - ..........................   24
5-5.  Schematic Diagram - CD Board (2/2) - ..........................   25
5-6.  Printed Wiring Board - CD Board - ................................   26
5-7.  Printed Wiring Board - TU Board - ................................   27
5-8.  Schematic Diagram - TU Board - ...................................   27
5-9. Printed 

Wiring 

Board 

- MAIN Board (Component Side) - ................................   28

5-10. Printed Wiring Board 

- MAIN Board (Conductor Side) - ..................................   29

5-11.  Schematic Diagram - MAIN Board (1/2) - .....................   30
5-12.  Schematic Diagram - MAIN Board (2/2) - .....................   31
5-13.  Printed Wiring Boards - PANEL Section - .....................   32
5-14.  Schematic Diagram - PANEL Section - ..........................   33
5-15. Printed Wiring Board 

- RELAY Board (Former Type) - ....................................   34

5-16.  Printed Wiring Board - RELAY Board (New Type) - .....   34
5-17.  Schematic Diagram - RELAY Board - ............................   34
5-18.  Printed Wiring Boards - TOP PANEL Section - .............   35
5-19.  Schematic Diagram - TOP PANEL Section -..................   35
5-20.  Printed Wiring Boards - POWER SUPPLY Section - ....   36
5-21.  Schematic Diagram - POWER SUPPLY Section - .........   36

6-1. Overall 

Section 

...............................................................  46

6-2.  Cabinet (Upper) Section .................................................   47
6-3.  Cabinet (Rear) Section ....................................................   48
6-4.  Cabinet (Front) Section ...................................................   49
6-5.  Chassis (Center) Section .................................................   50
6-6.  USB Board Section  ........................................................   51
6-7.  LCD Board Section  ........................................................   52

  ..............................   53

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer IIS and 

Thomson.

  SD, SDHC, and SDXC logos are trademarks of SD-3C, LLC.
  Windows Media is either a registered trademark or trademark of Microsoft Corporation in 

the United States and/or other countries.

 This product contains technology subject to certain intellectual property rights of Microsoft.

Use or distribution of this technology outside of this product is prohibited without the 
appropriate license(s) from Microsoft.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

NOTE  OF  REPLACING  THE  IC501  AND  IC702  ON  
THE  CD  BOARD
IC501 and IC702 on the CD board cannot exchange with single. 
When these parts are damaged, exchange the complete mounted 
board.

NOTE  OF  REPLACING  THE  IC001  ON  THE  TU BOARD
IC001 on the TU board cannot exchange with single. When this 
part is damaged, exchange the complete mounted board.

NOTE  OF  REPLACING  THE  IC801  ON  THE  MAIN 
BOARD
IC801 on the MAIN board cannot exchange with single. When this 
part is damaged, exchange the complete mounted board.

RELAY  BOARD  DISCRIMINATION
In this unit, the RELAY board has been changed in the midway of 
production.
Repair after distinguishing each type unit to doing the repair refer-
ring to the following.

•  This set can be disassembled in the order shown below.