ZS-E5 (serv.man2) - Sony Audio Service Manual (repair manual)

zs-e5 (serv.man2) service manual
Model
ZS-E5 (serv.man2)
Pages
28
Size
1.62 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
zs-e5-sm2.pdf
Date

Read Sony ZS-E5 (serv.man2) Service Manual online

SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
ZS-E5
SPECIFICATIONS
PERSONAL AUDIO SYSTEM
9-889-526-01
2009F0500-1
© 
2009.06
Singapore Model
Korean Model
Thai Model
Ver. 1.0  2009.06
Model Name Using Similar Mechanism
NEW
Optical Pick-up Name
DA11B3VFGP
CD player section
System
  Compact disc digital audio system
Laser diode properties
  Emission duration: Continuous
  Laser output: Less than 44.6 μW
  (This output is the value measurement at a distance of 200 mm from 
the objective lens surface on the optical pick-up block with 7 mm ap-
erture.)
Number of channels
 
2
Frequency response
  20 - 20 000 Hz +0.02/–0.1 dB
Wow and fl utter
  Below measurable limit
Radio section
Frequency range
  FM: 87.5 - 108 MHz
  AM: 530 - 1 710 kHz
Antennas
 FM: 
Telescopic 
antenna
  AM: Built-in ferrite bar antenna
General
Speaker
  Full range: 5 cm (2 inches) dia., 8 
, cone type (2)
Input
  AUDIO IN jack (stereo minijack)
Power output
  1 W + 1 W (at 8 
, 10% harmonic distortion)
Power requirements
 For 
player: 
  220 V AC, 60 Hz
  9 V DC, 6 R14 (size C) batteries
Power consumption 
 AC 
W
Battery life
 For 
player:
FM reception 
Sony R14P: approx. 35 h 
Sony alkaline LR14: approx. 55 h
CD playback 
Sony R14P: approx. 3 h
Sony alkaline LR14: approx. 14 h
Dimensions
  Approx. 271 × 122 × 271 mm  (w/h/d)
 (10 
3
/
4
 × 4 
7
/
8
 × 10 
3
/
4
 inches) (incl. projecting parts)
Mass
  Approx. 2.2 kg (4 lb. 12 oz) (incl. batteries)
Supplied accessory
  AC power cord (1)
Design and specifi cations are subject to change without notice.
ZS-E5
2
1. 
SERVICING  NOTES
  .............................................   3
2. DISASSEMBLY
2-1.   Disassembly Flow ...........................................................   4
2-2.   Cabinet (Bottom) Block ..................................................   4
2-3.   Cabinet (Top) Block ........................................................   5
2-4.   MAIN Board ...................................................................   5
2-5.   Optical Pick-Up Block (DA11B3VFGP) ........................   6
3. 
TEST  MODE
  ............................................................   7
4. ELECTRICAL 
 
ADJUSTMENTS 
 ........................  
8
5. DIAGRAMS
5-1.  Schematic Diagram - MAIN Section (1/2) - ...................   12
5-2.  Schematic Diagram - MAIN Section (2/2) - ...................   13
5-3.  Printed Wiring Boards - MAIN Section - .......................   14
5-4.  Printed Wiring Boards - PANEL Section - .....................   15
5-5.  Schematic Diagram - PANEL Section - ..........................   16
6. 
EXPLODED  VIEWS
6-1. Overall 
Section 
...............................................................  19
6-2.  Cabinet (Top) Section .....................................................   20
6-3.  Chassis (CD) Section ......................................................   21
6-4.  Cabinet (Bottom) Section ...............................................   22
7. 
ELECTRICAL  PARTS  LIST
  ..............................   23
TABLE  OF  CONTENTS
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
ZS-E5
3
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
ZS-E5
4
SECTION  2
DISASSEMBLY
•  This set can be disassembled in the order shown below.
2-1.   DISASSEMBLY  FLOW
2-2.  CABINET (BOTTOM) BLOCK
 (Page 
4)
2-3.  CABINET (TOP) BLOCK
 (Page 
5)
2-4. MAIN 
BOARD
 (Page 
5)
2-5.  OPTICAL PICK-UP BLOCK
 (DA11B3VFGP)
 (Page 
6)
SET
2 three screws 
 (BV 
B2.6)
2 two screws 
 (BV 
B2.6)
2 two screws 
 (BV 
B2.6)
2 two screws 
 (BV 
B2.6)
3 connector
 (CN305)
4 three connectors
 
(CN303, CN306, CN501)
1  lid (battery) sub assy
5  cabinet (bottom) block
Note: Follow the disassembly procedure in the numerical order given.
2-2.  CABINET (BOTTOM)  BLOCK
Note: This illustration sees the set from rear side.
Page of 28
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Here you can read online and download Sony ZS-E5 (serv.man2) Service Manual in PDF. ZS-E5 (serv.man2) service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony ZS-E5 (serv.man2) Audio. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.