XDR-S55DAB - Sony Audio Service Manual (repair manual). Page 8

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XDR-S55DAB
XDR-S55DAB
8
8
For Schematic Diagrams.
Note:
•  All capacitors are in 
μF unless otherwise noted.  (p: pF)
  50 WV or less are not indicated except for electrolytics 
and tantalums.
•  All resistors are in 
Ω and 
1
/
4
 W or less unless otherwise 
specifi ed.
•      f : 
internal 
component.
•  C : panel designation.
THIS  NOTE  IS  COMMON  FOR  PRINTED  WIRING  BOARDS  AND  SCHEMATIC  DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•  A  : B+ Line.
•  Voltages and waveforms are dc with respect to ground 
under no-signal (detuned) conditions.
  no mark :  AUDIO  (DAB)
•  Voltages are taken with VOM (Input impedance 10 M
Ω).
  Voltage variations may be noted due to normal production 
tolerances.
•  Waveforms are taken with a oscilloscope.
  Voltage variations may be noted due to normal production 
tolerances.
•  Circled numbers refer to waveforms.
• Signal path.
  F  
AUDIO 
(DAB/FM)
• Abbreviation
 SP  : 
Singapore 
model
For Printed Wiring Boards.
Note:
•  X  : Parts extracted from the component side.
•  Y  : parts extracted from the conductor side.
• 
 : Pattern from the side which enables seeing.
  (The other layers' patterns are not indicated.)
• Waveforms
– MICRO COMPUTER Board –
Caution:
Pattern face side:
(SIDE B)
Parts face side: 
(SIDE A)
Parts on the pattern face side seen from   
the pattern face are indicated.
Parts on the parts face side seen from   
the parts face are indicated.
1.4 Vp-p
32.768 kHz
IC501
RT (XT1)
0.5 V/DIV, 20 
μsec/DIV
3-2.  CIRCUIT  BOARDS  LOCATION
JACK board 
MICRO COMPUTER board 
MAIN board 
TU1
KEY board 
REG board 
Note:  The components identifi ed by mark 0 or dotted 
line with mark 0 are critical for safety. 
 
Replace only with part number specifi ed.
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