XDR-S50 - Sony Audio Service Manual (repair manual). Page 8

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8
8
XDR-S50
XDR-S50
• WAVEFORM
— MICRO COMPUTER BOARD —
• NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
For schematic diagrams.
Note:
• All capacitors are in 
µ
F unless otherwise noted.  (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in 
 and 
1
/
4
 
W or less unless otherwise
specified.
f
: internal component.
C
: panel designation.
For printed wiring boards.
Note:
• X
: parts extracted from the component side.
• Y
: parts extracted from the conductor side.
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
   no mark : AUDIO (DAB)
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO (DAB)
• Abbreviation
SP: Singapore model
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
Q
C
These are omitted
E
B
E
These are omitted
C
B
C
These are omitted
B
E
Note: The components identified by mark 
0
 or dotted line
with mark 
0
 are critical for safety.
Replace only with part number specified.
1.4 Vp-p
32.768 kHz
1
  IC501 
qs
 (XT1)
0.5 V/DIV, 20 
µ
sec/DIV
3-2. CIRCUIT BOARDS LOCATION
JACK board
MICRO COMPUTER board
MAIN board
TU1
KEY board
Ver. 1.1
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