Read Sony XDR-C706DBP Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
XDR-C706DBP
SPECIFICATIONS
DAB/FM CLOCK RADIO
9-889-980-02
2011C05-1
©
2011.03
AEP Model
UK Model
Australian Model
Ver. 1.1 2011.03
Time display
Model for Australia: 12-hour system (default)
Model for other countries/regions: 24-hour system (default)
Model for Australia: 12-hour system (default)
Model for other countries/regions: 24-hour system (default)
Frequency range
Band
Frequency
Channel step
DAB (Band-III)
174.928 MHz - 239.200 MHz
FM
87.5 MHz - 108 MHz
0.05 MHz
DAB (Band-III) frequency table
(MHz)
No.
Channel
Frequency
No.
Channel
Frequency
1
5A
174.928
20
9D
208.064
2
5B
176.640
21
10A
209.936
3
5C
178.352
22
10B
211.648
4
5D
180.064
23
10C
213.360
5
6A
181.936
24
10D
215.072
6
6B
183.648
25
11A
216.928
7
6C
185.360
26
11B
218.640
8
6D
187.072
27
11C
220.352
9
7A
188.928
28
11D
222.064
10
7B
190.640
29
12A
223.936
11
7C
192.352
30
12B
225.648
12
7D
194.064
31
12C
227.360
13
8A
195.936
32
12D
229.072
14
8B
197.648
33
13A
230.784
15
8C
199.360
34
13B
232.496
16
8D
201.072
35
13C
234.208
17
9A
202.928
36
13D
235.776
18
9B
204.640
37
13E
237.488
19
9C
206.352
38
13F
239.200
Speaker:
Approx. 6.6 cm dia. 4 Ω
Power output:
0.4 W (at 10 % harmonic distortion)
Power requirements:
230 V AC, 50 Hz
Dimensions:
Approx. 192.5 mm × 92.6 mm × 87.7 mm (w/h/d)
incl. projecting parts and controls
incl. projecting parts and controls
Mass:
Approx. 455 g
Design and specifications are subject to change without notice.
XDR-C706DBP
2
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
NOTE OF REPLACING THE CN1 ON THE MAIN
BOARD
CN1 on the MAIN board cannot exchange with single. When CN1
is damaged, exchange the entire mounted board.
BOARD
CN1 on the MAIN board cannot exchange with single. When CN1
is damaged, exchange the entire mounted board.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
SECTION 1
SERVICING NOTES
XDR-C706DBP
3
SECTION 2
DISASSEMBLY
•
This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. COVER
2-2. COVER
(Page 3)
2-3. CABINET (FRONT) ASSY
(Page 4)
2-4. CABINET (REAR)
(Page 4)
2-5. LCD BOARD
(Page 5)
2-6. KEY BOARD,
MAIN BOARD BLOCK, CHASSIS
(Page 5)
SET
1 three screws
3 four claws
2 three claws
4 cover
– Rear top side view –
XDR-C706DBP
4
2-3. CABINET (FRONT) ASSY
2-4. CABINET (REAR)
4 power unit
qa two screws
2 Remove two solders.
power unit cable
MAIN board
black
white
5 screw (B2.6)
9 screw
qd four rubber feet
0 button (snooze)
qs button (main)
qf cabinet (rear)
5 screw (B2.6)
8 chassis block
6
3
7
1 two cushions (SP)
– Rear side view –
1 five screws (B2.6)
2 claw
3
4 Remove three solders.
black
gray
brown
speaker (SP301)
5 cabinet (front) assy
– Rear top side view –