Read Sony TA-SB500WR2 Service Manual online
SERVICE MANUAL
SURROUND AMPLIFIER
SPECIFICATIONS
TA-SB500WR2
Ver. 1.1 2007.07
9-887-591-02
2007G05-1
© 2007.07
© 2007.07
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation
Published by Sony Techno Create Corporation
US Model
•
TA-SB500WR2 is the surround amplifier
section in DAV-HDX267W/HDX501W.
section in DAV-HDX267W/HDX501W.
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
DISTORTION:
With 3 ohms loads, both
channels driven, from
120 Hz - 20,000 Hz; rated
60 watts per channel
minimum RMS power,
with no more than 0.7 %
total harmonic distortion
from 250 milli watts to
rated output.
channels driven, from
120 Hz - 20,000 Hz; rated
60 watts per channel
minimum RMS power,
with no more than 0.7 %
total harmonic distortion
from 250 milli watts to
rated output.
Amplifier section
Surround mode (reference) RMS output power
SL/SR* : 100 W
(per channel at 3 ohms, 1
kHz, 10 % THD)
(per channel at 3 ohms, 1
kHz, 10 % THD)
* Depending on the sound field setting and the source,
there may be no sound output.
Power requirements:
120 V AC, 60 Hz
Power consumption
On: 40 W
Dimensions (approx.)
65
×
89
×
253 mm
(2
5
/
8
×
3
5
/
8
×
10 inches)
(w/h/d)
65
65
×
89
×
345 mm
(2
5
/
8
3
×
5
/
8
×
13
5
/
8
inches)
(w/h/d) incl. speaker cord
cover
cover
Mass (approx.)
1.3 kg (2 lb 14 oz)
1.4 kg (3 lb 2 oz) incl.
speaker cord cover
1.4 kg (3 lb 2 oz) incl.
speaker cord cover
Design and specifications are subject to change
without notice.
without notice.
2
TA-SB500WR2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
Ω
0.15
µ
F
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
TABLE OF CONTENTS
1.
GENERAL
...................................................................
3
2.
DISASSEMBLY
2-1.
Disassembly Flow ...........................................................
4
2-2.
Wire Cover ......................................................................
4
2-3.
Top Panel .........................................................................
5
2-4.
Side Panel, Front Panel Block .........................................
5
2-5.
DIAT POWER Board ......................................................
6
2-6.
DIAT AMP Board ............................................................
6
3.
DIAGRAMS
3-1.
Block Diagram ................................................................
7
3-2.
Printed Wiring Board – DIAT AMP Section (1/2) – .......
9
3-3.
Printed Wiring Boards – DIAT AMP Section (2/2) – ...... 10
3-4.
Schematic Diagram – DIAT AMP Section (1/4) – .......... 11
3-5.
Schematic Diagram – DIAT AMP Section (2/4) – .......... 12
3-6.
Schematic Diagram – DIAT AMP Section (3/4) – .......... 13
3-7.
Schematic Diagram – DIAT AMP Section (4/4) – .......... 14
3-8.
Printed Wiring Boards – POWER SUPPLY Section – .... 15
3-9.
Schematic Diagram – POWER SUPPLY Section – ........ 16
4.
EXPLODED VIEWS
4-1.
Panel Section ................................................................... 23
4-2.
DIAT AMP/DIAT POWER Boards Section .................... 24
5.
ELECTRICAL PARTS LIST
................................ 25
3
TA-SB500WR2
SECTION 1
GENERAL
This section is extracted from
instruction manual.
instruction manual.
LOCATION OF CONTROLS
Surround amplifier
A
POWER (ON/OFF)
B
POWER/ON LINE indicator
C
DIR-R1 jack
D
SURROUND L SPEAKER jack
E
SURROUND R SPEAKER jack
DIR-R1
SPEAKER
SURROUND L
SURROUND R
POWER
POWER ON-LINE
Front panel
Rear panel
TA-SB500WR2
4
Note:
Follow the disassembly procedure in the numerical order given.
2-2. WIRE COVER
•
This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
SECTION 2
DISASSEMBLY
2-2. WIRE COVER
(Page 4)
2-3. TOP PANEL
(Page 5)
2-4. SIDE PANEL,
FRONT PANEL BLOCK
(Page 5)
(Page 5)
2-5. DIAT POWER BOARD
(Page 6)
2-6. DIAT AMP BOARD
(Page 6)
SET
4
wire cover
3
two claws
2
wire (A) holder
1
screw (B3
×
8)