STR-KIV300 - Sony Audio Service Manual (repair manual)

2014I81-1

© 

2014.09

•  STR-KIV300 is the amplifi er, HDMI, USB, Bluetooth, NFC and FM tuner section in HT-IV300.

Amplifi er Section
POWER OUTPUT (rated)
Front L/Front R: 

75 W + 75 W (at 3 ohms, 1 kHz, 1% THD)

POWER OUTPUT (reference)
Front L/Front R/Surround L/Surround R:
 

125 W (per channel at 3 ohms, 1 kHz)

Center: 

250 W (at 6 ohms, 1 kHz)

Subwoofer: 

250 W (at 6 ohms, 80 Hz)

Inputs (Analog)
AUDIO IN 

Sensitivity: 1.6 V/500 mV

Inputs (Digital)
TV (Audio Return Channel/OPTICAL)
 

Supported formats: LPCM 2CH (up to 48 kHz), 

 

Dolby Digital, DTS

HDMI Section
Connector 

Type A (19 pin)

(USB) port: 

Type A (For connecting USB memory, memory card reader, digital still 

camera, and digital video camera)

Wireless LAN Section
Standards Compliance 

IEEE 802.11 a/b/g/n

Frequency band 

2.4 GHz, 5 GHz

Bluetooth Section
Communication system  Bluetooth Specification version 3.0
Output 

Bluetooth Specification Power Class 2

Maximum communication range
 

Line of sight approx. 10m

1)

Frequency band 

2.4 GHz

Modulation method 

FHSS (Freq Hopping Spread Spectrum)

Compatible Bluetooth profiles

2)

 

A2DP 1.2 (Advanced Audio Distribution Profile)

 

AVRCP 1.3 (Audio Video Remote Control Profile)

Supported Codecs

3)

 SBC

4)

, AAC

Transmission range (A2DP)
 

20 Hz – 20,000 Hz (Sampling frequency 44.1 kHz, 48 kHz)

1)

The actual range will vary depending on factors such as obstacles between devices, 

magnetic fields around a microwave oven, static 
  electricity, cordless phone, reception sensitivity, antenna’s performance, operating system, 
software application, etc.

2)

Bluetooth standard profiles indicate the purpose of Bluetooth  communication between 

devices.

3)

Codec: Audio signal compression and conversion format

4)

Subband Codec

FM Tuner Section
System 

PLL quartz-locked digital synthesizer

Tuning range 

87.5 MHz - 108.0 MHz (50 kHz step)

Antenna (aerial) 

FM wire antenna (aerial)

General
Power requirements 

220 V – 240 V AC, 50/60 Hz

Power consumption 

On: 100 W

 Standby: 

0.3 

W

Dimensions (w/h/d) (approx.)
 

249 mm × 62.5 mm × 229.5 mm incl. projecting parts

Mass (approx.) 

1.6 kg

Design and specifications are subject to change without notice.

•  This system incorporates with Dolby* Digital and Dolby Pro Logic adaptive 

matrix surround decoder and the DTS** Digital Surround System.

 

*  Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, and 
the double-D symbol are trademarks of Dolby Laboratories.

 

** For DTS patents, see http://patents.dts.com. Manufactured under license 
from DTS Licensing Limited. DTS, DTS-HD, the Symbol, & DTS and the 
Symbol together are registered trademarks of DTS, Inc. © DTS, Inc. All Rights 
Reserved.

•  This system incorporates High-Defi nition Multimedia Interface (HDMI™) tech-

nology. 

 

The terms HDMI and HDMI High-Defi nition Multimedia Interface, and the 
HDMI Logo are trademarks or registered trademarks of HDMI Licensing LLC 
in the United States and other countries.

•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD/Progressive” and the “AVCHD/Progressive” logo are trademarks of 

Panasonic Corporation and Sony Corporation.

• 

, “XMB”, and “xross media bar” are trademarks of Sony Corporation and 

Sony Computer Entertainment Inc.

•  “PlayStation” is a registered trademark of Sony Computer Entertainment Inc.
• Wi-Fi

®

, Wi-Fi Protected Access

®

 and Wi-Fi Alliance

®

 are registered trademarks 

of Wi-Fi Alliance.

•  Wi-Fi CERTIFIED™, WPA™, WPA2™, Wi-Fi Protected Setup™, Miracast™ 

and Wi-Fi CERTIFIED Miracast™ are trademarks of Wi-Fi Alliance.

•  The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the 

United States and in other countries.

•  Android™ is a trademark of Google Inc.
•  Google Play™ is a trademark of Google Inc.
•  “Xperia” is a trademark of Sony Mobile Communications AB.
• The 

®

 word mark and logos are registered trademarks owned by Blue-

tooth SIG, Inc. and any use of such marks by Sony Corporation is under license. 
Other trademarks and trade names are those of their respective owners.

•  MPEG Layer-3 audio coding technology and patents licensed from Fraunhofer 

IIS and Thomson.

•  Windows Media is either a registered trademark or trademark of Microsoft Cor-

poration in the United States and/or other countries.

 

This product is protected by certain intellectual property rights of Microsoft Cor-
poration. Use or distribution of such technology outside of this product is pro-
hibited without a license from Microsoft or an authorized Microsoft subsidiary. 
Content owners use Microsoft

®

 PlayReady™ content access technology to pro-

tect their intellectual property, including copyrighted content. This device uses 
PlayReady technology to access PlayReady protected content and/or WMDRM 
protected content. If the device fails to properly enforce restrictions on content 
usage, content owners may require Microsoft to revoke the device’s ability to 
consume PlayReady protected content. Revocation should not affect unprotected 
content or content protected by other content access technologies. Content own-
ers may require you to upgrade PlayReady to access their content. If you decline 
an upgrade, you will not be able to access content that requires the upgrade.

•  All other trademarks are trademarks of their respective owners.
•  Other system and product names are generally trademarks or registered trade-

marks of the manufacturers. ™ and ® marks are not indicated in this document.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 

WT-540A. Follow the manufacturers’ instructions to use these 
instruments.

2.  A battery-operated AC milliammeter. The Data Precision 245 

digital multimeter is suitable for this job.

3.  Measuring the voltage drop across a resistor by means of a 

VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

 ..............................................   4

2-1. Disassembly 

Flow 

...........................................................   6

2-2. Case, 

Top 

.........................................................................   7

2-3. Front 

Panel 

Assy 

.............................................................   7

2-4.  DISPLAY Board, TOUCH SENSOR Board, 

RC-S801/A5 (WW) ........................................................   8

2-5.  Card WLAN/BT COMBO, USB Board  ........................   8
2-6.  IO-TUNER Board, DC Fan, 

Shield Plate (Power Cord) ..............................................   9

2-7. MB1306 

Board 

...............................................................   9

2-8. AMP 

Board 

.....................................................................  10

2-9.  SWITCHING REGULATOR (SWR1) ...........................   10

 .............................................................   11

 ..........................................   19

 ...........................................   20

6-1. Block 

Diagram 

- HDMI/MEMORY/USB/NETWORK Section - ...........   23

6-2.  Block Diagram - AUDIO/AMP Section - .......................   24
6-3. Block 

Diagram 

- DISPLAY/POWER SUPPLY Section - ........................   25

6-4. Printed 

Wiring 

Board 

- MB1306 Board (Component Side) -  ...........................   28

6-5. Printed 

Wiring 

Board 

- MB1306 Board (Conductor Side) - ..............................   29

6-6.  Schematic Diagram - MB1306 Board (1/7) - .................   30
6-7.  Schematic Diagram - MB1306 Board (2/7) - .................   31
6-8.  Schematic Diagram - MB1306 Board (3/7) - .................   32
6-9.  Schematic Diagram - MB1306 Board (4/7) - .................   33
6-10.  Schematic Diagram - MB1306 Board (5/7) - .................   34
6-11.  Schematic Diagram - MB1306 Board (6/7) - .................   35
6-12.  Schematic Diagram - MB1306 Board (7/7) - .................   36
6-13. Printed Wiring Board 

- AMP Board (Component Side) - ..................................   37

6-14. Printed Wiring Board 

- AMP Board (Conductor Side) - ....................................   38

6-15.  Schematic Diagram - AMP Board (1/3) - .......................   39
6-16.  Schematic Diagram - AMP Board (2/3) - .......................   40
6-17.  Schematic Diagram - AMP Board (3/3) - .......................   41
6-18.  Printed Wiring Board - DISPLAY Board - .....................   42
6-19.  Schematic Diagram - DISPLAY Board - ........................   43
6-20.  Printed Wiring Board - TOUCH SENSOR Board - ........   44
6-21.  Schematic Diagram - TOUCH SENSOR Board - ..........   44
6-22.  Printed Wiring Board - USB Board - ..............................   44
6-23.  Schematic Diagram - USB Board - .................................   44
6-24.  Printed Wiring Board - IO-TUNER Board - ...................   45
6-25.  Schematic Diagram - IO-TUNER Board - .....................   46

7-1. Case 

Section 

....................................................................  67

7-2.  Front Panel Section .........................................................   68
7-3.  Chassis Bottom Section ..................................................   69
7-4. Chassis 

Section 

...............................................................  70

  ..............................   71

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  OF  REPLACING  THE  IC101, IC102, IC103, IC501 
and IC6301 ON  THE  MB1306  BOARD
IC101, IC102, IC103, IC501 and IC6301 on the MB1306 board 
cannot exchange with single. When these parts on the MB1306 
board are damaged, exchange the entire mounted board.

NOTE  OF  REPLACING  THE  IC102  AND  IC103  ON  
THE  MB1306  BOARD
Replacement of IC102 and IC103 on the MB1306 board used in 
this unit requires a special tool.

NOTE OF REPLACING THE IC4001 ON THE IO-TUNER 
BOARD
IC4001 on the IO-TUNER board cannot exchange with single. 
When these parts on the IO-TUNER board are damaged, exchange 
the entire mounted board.

NOTE OF REPLACING THE IC7501 ON THE TOUCH 
SENSOR BOARD
IC7501 on the TOUCH SENSOR board cannot exchange with 
single. When these parts on the TOUCH SENSOR board are dam-
aged, exchange the entire mounted board.

 NOTE  OF  REPLACING  MB1306  BOARD  OR  WLAN/
BT  COMBO  CARD 
When the MB1306 board or WLAN/BT COMBO card are re-
placed, please execute the below service mode.
1.  Please update FW to M23.R.0098
2.  Whenever replace MB1306 board or WLAN/BT COMBO 

CARD please execute “Reset to Factory Default Settings” 
from XMB.

Procedure:
[Home menu 

→ Setup → Resetting → Reset to Factory Default 

Settings 

→ All Settings]

Next, go to service menu and execute “[1] Bluetooth Enable” and 
“[3] Write Bluetooth device address to Registry”.
Finally check one touch NFC listening function at normal power 
on.

Note: The operation in this mode must use a remote commander 
and TV monitor.

1.  Connect this unit with TV monitor.
2.  Press the [

?/1

] button to turn the power on.

3.  Press button in order of the [

x

] 

→ [DISPLAY] → [

X

] 

→ [M] on 

the remote commander.
 (Make the interval when each button is pressed within two 
seconds)

4.  Enter the SVC service mode. The OSD menu on TV monitor 

can be operated by remote commander.

5.  Press [

m

] and Enter Diag.

6.  Press [

,

] and Enter Bluetooth Device Test (Screen 1).

7.  Enter [1] Bluetooth Enable, wait until the display show 

“ Status : Bluetooth Enable Successful ” (Screen 2).

8.  Enter [3] Write Bluetooth device address to Registry, wait until 

the display show “Bluetooth Device Address” and “Status : 
Write Successfull” (Screen 3).

9.  Press the [RETURN] button on the remote commander to 

select “Wireless LAN Test”. (Screen 4)

10.  Press the [

] button on the remote commander to select 

“[5] Write P2P address to Registry”.

11.  Press the [

] button on the remote commander, wait until the 

display show “Status: Write Successful!” (Screen 5).

12.  Press the [

m

] button on the remote commander to select 

“[6] P2P Registry Check”.

13.  Press the [

] button on the remote commander to check the 

P2P devise address is the same as shown in Screen 5.
(Displayed chracters/values in the following fi gure are ex-
ample)

14. Press the [

?/1

] button to power off.

 Diag

 Diag

Diag