Read Sony STR-DH550 / STR-DH750 Service Manual online
SERVICE MANUAL
Published by Sony EMCS (Malaysia) PG Tec
Sony Corporation
MULTI CHANNEL AV RECEIVER
US Model
Canadian Model
AEP Model
UK Model
Australian Model
STR-DH550/DH750
E Model
STR-DH550
Brazillian Model
Mexican Model
Taiwan Model
STR-DH750
Ver. 1.2 2015.04
STR-DH550/DH750
9-890-636-03
2015D80-1
©
2015.04
Photo: STR-DH750
SPECIFICATIONS
– Continued on next page –
This receiver incorporates Dolby* Digital and Pro
Logic Surround and the DTS** Digital Surround
System.
*
Logic Surround and the DTS** Digital Surround
System.
*
Manufactured under license from Dolby
Laboratories. Dolby, Pro Logic, Surround EX,
and the double-D symbol are trademarks of Dolby
Laboratories.
Laboratories. Dolby, Pro Logic, Surround EX,
and the double-D symbol are trademarks of Dolby
Laboratories.
**
For DTS patents, see http://patents.dts.com.
Manufactured under license from DTS Licensing
Limited. DTS, DTS-HD, the Symbol, & DTS and
the Symbol together are registered trademarks, and
DTS-HD Master Audio is a trademark of DTS, Inc.
© DTS, Inc. All Rights Reserved.
Manufactured under license from DTS Licensing
Limited. DTS, DTS-HD, the Symbol, & DTS and
the Symbol together are registered trademarks, and
DTS-HD Master Audio is a trademark of DTS, Inc.
© DTS, Inc. All Rights Reserved.
This receiver incorporates High-Definition Multimedia
Interface (HDMI™) technology. The terms HDMI and
HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks
of HDMI Licensing LLC in the United States and
other countries.
Interface (HDMI™) technology. The terms HDMI and
HDMI High-Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered trademarks
of HDMI Licensing LLC in the United States and
other countries.
iPhone, iPod, iPod classic, iPod nano, and iPod touch
are trademarks of Apple Inc., registered in the U.S.
and other countries. App Store is a service mark of
Apple Inc.
are trademarks of Apple Inc., registered in the U.S.
and other countries. App Store is a service mark of
Apple Inc.
All other trademarks and registered trademarks are
of their respective holders. In this manual, ™ and ®
marks are not specified.
of their respective holders. In this manual, ™ and ®
marks are not specified.
“Made for iPod” and “Made for iPhone” mean that
an electronic accessory has been designed to connect
specifically to iPod or iPhone, respectively, and
has been certified by the developer to meet Apple
performance standards.
Apple is not responsible for the operation of this
device or its compliance with safety and regulatory
standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
an electronic accessory has been designed to connect
specifically to iPod or iPhone, respectively, and
has been certified by the developer to meet Apple
performance standards.
Apple is not responsible for the operation of this
device or its compliance with safety and regulatory
standards. Please note that the use of this accessory
with iPod or iPhone may affect wireless performance.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
trademark of Microsoft Corporation in the United
States and/or other countries.
This product is protected by certain intellectual property
rights of Microsoft Corporation. Use or distribution of
such technology outside of this product is prohibited
without a license from Microsoft or an authorized
Microsoft subsidiary.
rights of Microsoft Corporation. Use or distribution of
such technology outside of this product is prohibited
without a license from Microsoft or an authorized
Microsoft subsidiary.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
licensed from Fraunhofer IIS and Thomson.
“x.v.Color (x.v.Colour)” and “x.v.Color (x.v.Colour)”
logo are trademarks of Sony Corporation.
logo are trademarks of Sony Corporation.
“BRAVIA” is a trademark of Sony Corporation.
“PlayStation” is a registered trademark of Sony Com-
puter Entertainment Inc.
puter Entertainment Inc.
“WALKMAN” and “WALKMAN” logo are registered
trademarks of Sony Corporation.
trademarks of Sony Corporation.
MICROVAULT is a trademark of Sony Corporation.
MHL, Mobile High-Definition Link and the MHL
Logo are trademarks or registered trademarks of MHL
Licensing, LLC.
Logo are trademarks or registered trademarks of MHL
Licensing, LLC.
The Bluetooth® word mark and logos are registered
trademarks owned by Bluetooth SIG, Inc. and any use
of such marks by Sony Corporation is under license.
Other trademarks and trade names are those of their
respective owners.
trademarks owned by Bluetooth SIG, Inc. and any use
of such marks by Sony Corporation is under license.
Other trademarks and trade names are those of their
respective owners.
© 2013 CSR plc and its group companies. The aptX®
mark and the aptX logo are trade marks of CSR plc or
one of its group companies and may be registered in
one or more jurisdictions.
mark and the aptX logo are trade marks of CSR plc or
one of its group companies and may be registered in
one or more jurisdictions.
The N Mark is a trademark or registered trademark
of NFC Forum, Inc. in the United States and in other
countries.
of NFC Forum, Inc. in the United States and in other
countries.
Android™ is a trademark of Google Inc.
Google Play™ is a trademark of Google Inc.
AUDIO POWER
SPECIFICATIONS
SPECIFICATIONS
POWER OUTPUT AND TOTAL
HARMONIC DISTORTION:
(USA model only)
With 6 ohm loads, both channels driven, from
20 – 20,000 Hz; rated 90 watts per channel minimum
RMS power, with no more than 0.09% total harmonic
distortion from 250 milliwatts to rated output.
HARMONIC DISTORTION:
(USA model only)
With 6 ohm loads, both channels driven, from
20 – 20,000 Hz; rated 90 watts per channel minimum
RMS power, with no more than 0.09% total harmonic
distortion from 250 milliwatts to rated output.
Amplifier section
Mexico model
Minimum RMS Output Power
Mexico model
Minimum RMS Output Power
1)
(6 ohms, 20 Hz – 20 kHz, THD 0.09%)
90 W + 90 W
Stereo Mode Output Power
1)
(6 ohms, 1 kHz, THD 1%)
100 W + 100 W
Surround Mode Output Power
1) 2)
(6 ohms, 1 kHz, THD 0.9%)
140 W per channel
India model
Minimum RMS Output Power
Minimum RMS Output Power
1)
(6 ohms, 20 Hz – 20 kHz, THD 0.09%)
80 W + 80 W
Stereo Mode Output Power
1)
(6 ohms, 1 kHz, THD 1%)
90 W + 90 W
Surround Mode Output Power
1) 2)
(6 ohms, 1 kHz, THD 0.9%)
115 W per channel
Other models
Minimum RMS Output Power
Minimum RMS Output Power
1)
(6 ohms, 20 Hz – 20 kHz, THD 0.09%)
90 W + 90 W
Stereo Mode Output Power
1)
(6 ohms, 1 kHz, THD 1%)
105 W + 105 W
Surround Mode Output Power
1) 2)
(6 ohms, 1 kHz, THD 0.9%)
145 W per channel
1)
Measured under the following conditions:
Area
Power requirements
US, CND,
TW
TW
120 V AC, 60 Hz
MX
127 V AC, 60 Hz
AUS, AEP,
UK
UK
230 V AC, 50 Hz
BR
220 V AC, 60 Hz
E12
240 V AC, 50 Hz
2)
Reference power output for front, center, surround,
surround back and front high speakers. Depending
on the sound fi eld settings and the source, there
may be no sound output.
on the sound fi eld settings and the source, there
may be no sound output.
Frequency response
Analog
Analog
10 Hz – 100 kHz, +0.5/–2 dB (with
sound
fi eld and equalizer bypassed)
Input
Analog
Analog
Sensitivity: 500 mV/50 kilohms
S/N
3)
: 105 dB (A, 500 mV
4)
)
Digital
(Coaxial)
Impedance: 75 ohms
S/N: 100 dB (A, 20 kHz LPF)
Digital
(Optical)
S/N: 100 dB (A, 20 kHz LPF)
Output (Analog)
SUBWOOFER
SUBWOOFER
Voltage: 2 V/1 kilohm
Equalizer
Gain
Gain
levels
±10 dB, 1 dB step
3)
INPUT SHORT (with sound fi eld and equalizer
bypassed).
bypassed).
4)
Weighted network, input level.
FM tuner section
Tuning range
Tuning range
87.5 MHz – 108.0 MHz
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals
75 ohms, unbalanced
AM tuner section
Tuning range
Tuning range
Area
Tuning scale
10 kHz step
9 kHz step
US, CND,
MX, BR
MX, BR
530 kHz –
531 kHz –
1,710 kHz
1,710 kHz
AUS, AEP,
UK, TW, E12
UK, TW, E12
–
531 kHz –
1,602
kHz
Antenna (aerial)
Loop antenna (aerial)
Video section
Inputs/Outputs
Video:
Inputs/Outputs
Video:
1 Vp-p, 75 ohms
STR-DH550/DH750
2
1)
Supports YUV 4:2:0 / 8 bit format only.
2)
Supports 8 bit format only.
3)
These formats are also supported by an MHL connection.
MHL section
Supported MHL version
Supported MHL version
Incorporates MHL 2
Maximum current
900
900
mA
iPhone/iPod section
DC 5V 1.0 A MAX
DC 5V 1.0 A MAX
USB works with iPhone 5s, iPhone 5c, iPhone 5, iPhone 4s,
iPhone 4, iPhone 3GS, iPhone 3G, iPod touch (2nd through
5th generation), iPod classic, and iPod nano (3rd through 7th
generation).
iPhone 4, iPhone 3GS, iPhone 3G, iPod touch (2nd through
5th generation), iPod classic, and iPod nano (3rd through 7th
generation).
Bluetooth technology works with iPhone 5s, iPhone 5c, iPhone
5, iPhone 4s, iPhone 4, iPhone 3GS, and iPod touch (4th and 5th
generation).
5, iPhone 4s, iPhone 4, iPhone 3GS, and iPod touch (4th and 5th
generation).
You can use “SongPal” app with this receiver via Bluetooth.
USB section
Supported format*
Supported format*
MP3 (MPEG 1 Audio Layer-3):
32 kbps – 320 kbps, VBR
WMA:
48 kbps – 192 kbps
AAC:
48 kbps – 320 kbps
WAV:
8 kHz – 48 kHz, 16 bit PCM
* Compatibility with all encoding/writing software, recording
devices and recording media cannot be guaranteed.
devices and recording media cannot be guaranteed.
Transfer speed
Full-speed
Supported USB device
Full-speed
Supported USB device
Mass Storage Class
Maximum current
500
500
mA
Bluetooth section
Communication system
Communication system
Bluetooth Specification version 3.0
Output
Bluetooth Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (33 feet)
1)
Frequency band
2.4 GHz band (2.4000 GHz – 2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread Spectrum)
Compatible Bluetooth profiles
2)
A2DP (Advanced Audio Distribution Profile)
AVRCP 1.3 (Audio Video Remote Control Profile)
Supported Codecs
3)
SBC
4)
, AAC, aptX
Transmission range (A2DP)
20 Hz – 20,000 Hz (Sampling frequency 44.1 kHz)
1)
The actual range will vary depending on factors such as
obstacles between devices, magnetic fields around a microwave
oven, static electricity, cordless phone, reception sensitivity,
antenna’s performance, operating system, software application,
etc.
obstacles between devices, magnetic fields around a microwave
oven, static electricity, cordless phone, reception sensitivity,
antenna’s performance, operating system, software application,
etc.
2)
Bluetooth standard profiles indicate the purpose of Bluetooth
communication between devices.
communication between devices.
3)
Codec: Audio signal compression and conversion format
4)
Subband Codec
General
Power requirements
Power requirements
Area
Power requirements
US, CND, TW
120 V AC, 60 Hz
MX
127 V AC, 60 Hz
AUS
230 V AC, 50 Hz
AEP, UK, E12
230 V AC, 50/60 Hz
BR
127/220 V AC, 60 Hz
E12
220 V – 240 V AC, 50/60 Hz
Power consumption
240 W (Except DH550 : AEP, UK, US, CND, AUS, E12)
200 W (DH550 : AEP, UK, US, CND, AUS, E12)
Power consumption (during standby mode)
0.3 W (When “Control for HDMI”, “Pass Through” and
“Bluetooth Standby” are set to “Off”.)
0.5 W (When “Control for HDMI” is set to “On”, “Pass
Through” and “Bluetooth Standby” are set to “Off”.)
Dimensions (width/height/depth) (Approx.)
430 mm × 156 mm × 329.4 mm
(17 in × 6 1/4 in × 13 in) including projecting parts and
controls
Mass (Approx.)
E12 model:
Mass (Approx.)
E12 model:
8.0kg (17 lb 11 oz)
Other models:
7.6kg (16 lb 13 oz)
Design and specifications are subject to change without notice.
HDMI Video
Input/Output (HDMI Repeater block)
Format
2D
3D
Frame packing
Side-by-Side
(Half)
Over-Under
(Top-and-Bottom)
4096 × 2160p @ 59.94/60 Hz
a
1)
–
–
–
4096 × 2160p @ 50 Hz
a
1)
–
–
–
3840 × 2160p @ 59.94/60 Hz
a
1)
–
–
–
3840 × 2160p @ 50 Hz
a
1)
–
–
–
4096 × 2160p @ 23.98/24 Hz
a
2)
–
–
–
3840 × 2160p @ 29.97/30 Hz
a
2)
–
–
–
3840 × 2160p @ 25 Hz
a
2)
–
–
–
3840 × 2160p @ 23.98/24 Hz
a
2)
–
–
–
1920 × 1080p @ 59.94/60 Hz
a
–
a
a
1920 × 1080p @ 50 Hz
a
–
a
a
1920 × 1080p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 25 Hz
a
3)
a
a
3)
a
3)
1920 × 1080p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1920 × 1080i @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 59.94/60 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 50 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 29.97/30 Hz
a
3)
a
a
3)
a
3)
1280 × 720p @ 23.98/24 Hz
a
3)
a
a
3)
a
3)
720 × 480p @ 59.94/60 Hz
a
3)
–
–
–
720 × 576p @ 50 Hz
a
3)
–
–
–
640 × 480p @ 59.94/60 Hz
a
3)
–
–
–
Supplied accessories
• Quick Setup Guide (1)
• Reference Guide (1)
• Remote control (RM-AAU190) (1)
• R6 (size AAA) batteries (2)
• FM wire antenna (aerial) (1)
• AM loop antenna (aerial) (1)
• Optimizer microphone (ECM-AC2) (1)
Design and specifications are subject to change
without notice.
without notice.
•
Halogenated flame retardants are not used
in the certain printed wiring boards.
in the certain printed wiring boards.
Abbreviation
AUS : Australian model
BR :
AUS : Australian model
BR :
Brazilian
model
CND : Canadian model
E12 : 220 – 240V AC area in E model
MX :
E12 : 220 – 240V AC area in E model
MX :
Mexican
model
TW :
Taiwan
model
Ver. 1.1
STR-DH550/DH750
3
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
Notes on chip component replacement
•
•
Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Case
(Entry)
.................................................................... 5
2-2. Front Panel Section ......................................................... 6
2-3. Back Panel Section ......................................................... 7
2-4. MAIN Board Section ...................................................... 8
2-5. MAIN
2-3. Back Panel Section ......................................................... 7
2-4. MAIN Board Section ...................................................... 8
2-5. MAIN
Board
................................................................... 9
3.
TEST MODE
............................................................ 10
4.
FM TUNER CHECK
............................................. 13
5. DIAGRAMS
5-1. Block Diagram - ANALOG AUDIO Section - ............... 15
5-2. Block Diagram - DIGITAL Section - ............................. 16
5-3. Block Diagram - AMP Section - ..................................... 17
5-4. Block Diagram - ANALOG VIDEO/USB Section - ...... 18
5-5. Block Diagram - DIGITAL VIDEO Section - ................ 19
5-6. Block Diagram - DISPLAY/POWER Section - .............. 20
5-7. Printed
5-2. Block Diagram - DIGITAL Section - ............................. 16
5-3. Block Diagram - AMP Section - ..................................... 17
5-4. Block Diagram - ANALOG VIDEO/USB Section - ...... 18
5-5. Block Diagram - DIGITAL VIDEO Section - ................ 19
5-6. Block Diagram - DISPLAY/POWER Section - .............. 20
5-7. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 22
5-8. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 23
5-9. Schematic Diagram - MAIN Board (1/7) - ..................... 24
5-10. Schematic Diagram - MAIN Board (2/7) - ..................... 25
5-11. Schematic Diagram - MAIN Board (3/7) - ..................... 26
5-12. Schematic Diagram - MAIN Board (4/7) - ..................... 27
5-13. Schematic Diagram - MAIN Board (5/7) - ..................... 28
5-14. Schematic Diagram - MAIN Board (6/7) - ..................... 29
5-15. Schematic Diagram - MAIN Board (7/7) - ..................... 30
5-16. Printed Wiring Board
5-10. Schematic Diagram - MAIN Board (2/7) - ..................... 25
5-11. Schematic Diagram - MAIN Board (3/7) - ..................... 26
5-12. Schematic Diagram - MAIN Board (4/7) - ..................... 27
5-13. Schematic Diagram - MAIN Board (5/7) - ..................... 28
5-14. Schematic Diagram - MAIN Board (6/7) - ..................... 29
5-15. Schematic Diagram - MAIN Board (7/7) - ..................... 30
5-16. Printed Wiring Board
- HDMI Board (Component Side) - ................................ 31
5-17. Printed Wiring Board
- HDMI Board (Conductor Side) - .................................. 32
5-18. Schematic Diagram - HDMI Board - .............................. 33
5-19. Printed Wiring Board
5-19. Printed Wiring Board
- STANDBY DCDC Board (Component Side) - ............ 34
5-20. Printed Wiring Board
- STANDBY DCDC Board (Conductor Side) - .............. 35
5-21. Schematic Diagram - STANDBY DCDC Board - .......... 36
5-22. Printed Wiring Board - PANEL Section - ....................... 37
5-23. Schematic Diagram - PANEL Section - .......................... 38
5-24. Printed Wiring Board - FRONT JACK Board - .............. 39
5-25. Schematic Diagram - FRONT JACK Board - ................ 39
5-26. Printed Wiring Board - TUNER1 Board - ...................... 39
5-27. Schematic Diagram - TUNER1 Board - ......................... 40
5-28. Printed Wiring Board - POWER KEY Board -............... 41
5-29. Schematic Diagram - POWER KEY Board - ................. 41
5-30. Printed Wiring Board - HEADPHONE Board - ............. 42
5-31. Schematic Diagram - HEADPHONE Board - ................ 42
5-22. Printed Wiring Board - PANEL Section - ....................... 37
5-23. Schematic Diagram - PANEL Section - .......................... 38
5-24. Printed Wiring Board - FRONT JACK Board - .............. 39
5-25. Schematic Diagram - FRONT JACK Board - ................ 39
5-26. Printed Wiring Board - TUNER1 Board - ...................... 39
5-27. Schematic Diagram - TUNER1 Board - ......................... 40
5-28. Printed Wiring Board - POWER KEY Board -............... 41
5-29. Schematic Diagram - POWER KEY Board - ................. 41
5-30. Printed Wiring Board - HEADPHONE Board - ............. 42
5-31. Schematic Diagram - HEADPHONE Board - ................ 42
6.
EXPLODED VIEWS
6-1. Case (Entry) Section ....................................................... 57
6-2. Front Panel Section ......................................................... 58
6-3. Back Panel Section ......................................................... 59
6-4. Chassis
6-2. Front Panel Section ......................................................... 58
6-3. Back Panel Section ......................................................... 59
6-4. Chassis
Section
............................................................... 60
7.
ELECTRICAL PARTS LIST
.............................. 61
TABLE OF CONTENTS
STR-DH550/DH750
4
MODEL IDENTIFICATION
–BACK PANEL–
–BACK PANEL–
Part No.
Model
Part No.
DH550: US, Canadian
4-487-917-0[]
DH550: AEP, UK
4-487-917-1[]
DH550: Australian
4-487-917-2[]
DH550: 220 – 240 V AC area in E model
4-487-917-3[]
DH750: US, Canadian
4-448-923-0[]
DH750: AEP, UK
4-448-923-1[]
DH750: Australian
4-448-923-2[]
DH750: Taiwan
4-448-923-3[]
DH750: Mexican
4-448-923-4[]
DH750: Brazillian
4-448-923-6[]
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
•
Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
SPECIAL COMPONENT NOTICE
The components identified by mark
The components identified by mark
9 contain confidential
information.
Strictly follow the instructions whenever the components are
repaired and/or replaced.
Strictly follow the instructions whenever the components are
repaired and/or replaced.
NOTICE POUR COMPOSANTS SPÉCIAUX
Les composants identifiés par la marque
Les composants identifiés par la marque
9 contiennent des
informations confidentielles.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
Suivre scrupuleusement les instructions chaque fois qu’un compo-
sant est remplacé et / ou réparé.
SECTION 1
SERVICING NOTES
NOTE OF REPLACING THE IC2402 AND IC2900 ON
THE MAIN BOARD
IC2402 and IC2900 on the MAIN board cannot exchange with
single. When these parts on the MAIN board are damaged,
exchange the entire mounted board.
THE MAIN BOARD
IC2402 and IC2900 on the MAIN board cannot exchange with
single. When these parts on the MAIN board are damaged,
exchange the entire mounted board.
NOTE OF REPLACING THE IC3514 ON THE HDMI
BOARD
IC3514 on the HDMI board cannot exchange with single. When
this part on the HDMI board is damaged, exchange the entire
mounted board.
BOARD
IC3514 on the HDMI board cannot exchange with single. When
this part on the HDMI board is damaged, exchange the entire
mounted board.
NOTE OF REPLACING THE IC902 (DH750) ON THE
STANDBY DCDC BOARD
IC902 (DH750) on the STANDBY DCDC board cannot exchange
with single. When this part on the STANDBY DCDC board is
damaged, exchange the entire mounted board.
STANDBY DCDC BOARD
IC902 (DH750) on the STANDBY DCDC board cannot exchange
with single. When this part on the STANDBY DCDC board is
damaged, exchange the entire mounted board.
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• Main
Board
C930,
C931
– MAIN BOARD (Conductor side) –
(To both ends of each capacitor)
800
:/2 W
C930
C931
Ver. 1.1