STR-DB895D - Sony Audio Service Manual (repair manual)

AEP Model

UK Model

– Continued on next page –

2005H05-1
© 2005.08

Power Output
Rated Power Output at Stereo Mode
(8 ohms 20 Hz – 20 kHz, THD 0.09%)

100 W + 100 W

1)

(8 ohms 1 kHz, THD 0.7%)

110 W + 110 W

1)

(8 ohms 1 kHz, THD 10%)

135 W + 135 W

1)

Reference Power Output

1)

(8 ohms 20 Hz – 20 kHz, THD 0.09%)
FRONT

2)

:

CENTER

2)

:

SURR

2)

:

SURR BACK

2)

:

(8 ohms 1 kHz, THD 0.7%)
FRONT

2)

:

CENTER

2)

:

SURR

2)

:

SURR BACK

2)

:

(8 ohms 1 kHz, THD 10%)
FRONT

2)

:

CENTER

2)

:

SURR

2)

:

SURR BACK

2)

:

1) Measured under the following conditions:

2) Depending on the sound field settings and the 

source, there may be no sound output.

Frequency response

Inputs (Analog)

3) INPUT SHORT.

4) Weighted network, input level.

Inputs (Digital)

Outputs (Analog)

Outputs (Digital)

Equalizer

230 V AC, 50 Hz

PHONO

RIAA equalization curve
±0.5 dB

MULTI CH IN, SA-CD/
CD, MD/TAPE, DVD, 
TV/SAT, VIDEO 1, 2, 3

10 Hz – 100 kHz
+0.5/–2 dB (when 
ANALOG DIRECT is 
selected)

PHONO

Sensitivity: 2.5 mV
Impedance: 50 k ohms
S/N

3)

: 86 dB

(A, 2.5 mV

4)

)

MULTI CH IN, SA-CD/
CD, MD/TAPE, DVD, 
TV/SAT, VIDEO 1, 2, 3

Sensitivity: 150 mV
Impedance: 50 k ohms
S/N

3)

: 96 dB

(A, 150 mV

4)

)

DVD, SA-CD/CD 
(Coaxial)

Sensitivity: –
Impedance: 75 ohms
S/N: 100 dB 
(A, 20 kHz LPF)

DVD, TV/SAT, 
MD/TAPE, VIDEO 3 
(Optical)

Sensitivity: –
Impedance: –
S/N: 100 dB
(A, 20 kHz LPF)

MD/TAPE (OUT), 
VIDEO 1, 2
(AUDIO OUT)

Voltage: 150 mV
Impedance: 2.2 k ohms

SUB WOOFER

Voltage: 2 V
Impedance: 1 k ohm

MD/TAPE (Optical)

Sensitivity: –

Gain levels

±10 dB, 1 dB step

100 W/ch
100 W/ch
100 W/ch
100 W/ch

110 W/ch
110 W/ch
110 W/ch
110 W/ch

135 W/ch

135 W/ch
135 W/ch
135 W/ch

This receiver incorporates Dolby* Digital and Pro
Logic Surround and the DTS** Digital Surround
System.
* Manufactured under license from Dolby

Laboratories.
“Dolby”, “Pro Logic”, “Surround EX”, and the
double-D symbol are trademarks of Dolby
Laboratories.

** “DTS”, “DTS-ES”, “Neo:6” and “DTS 96/24” are

trademarks of Digital Theater Systems, Inc.

2

Frequency range
Band-III:

174.928 (5A) – 
239.200 (13F) MHz

L-Band:

1452.960 (LA) – 
1490.624 (LW) MHz
For details, see “DAB 
frequency table” on 
page 66.

Antenna

DAB wire antenna

Antenna terminals

75 ohms, unbalanced

Sensitivity

–99 dBm

Signal-to-noise ratio

97 dB

THD+N

0.009% (1 kHz)

Channel separation

87 dB (1 kHz)

Selectivity

40 dB (at adjacent channel)

Frequency response

+0.5/–0.5 dB 
(5 Hz – 20 kHz)

Tuning range

87.5 - 108.0 MHz

Antenna

FM wire antenna

Antenna terminals

75 ohms, unbalanced

Intermediate frequency

10.7 MHz

Sensitivity
Mono:

18.3 dBf, 2.2 

µV/75 ohms

Stereo:

38.3 dBf, 22.5 

µV/75 ohms 

Useable sensitivity

11.2 dBf, 1 

µV/75 ohms

S/N
Mono:
Stereo:
Harmonic distortion at 1 kHz
Mono:
Stereo:
Separation

45 dB at 1 kHz

Frequency response

30 Hz – 15 kHz, 
+0.5/–2 dB

Selectivity

60 dB at 400 kHz

Tuning range
With 9-kHz tuning scale

531 – 1,602 kHz

Antenna

Loop antenna

Intermediate frequency

450 kHz

Usable sensitivity

50 dB/m (at 1,000 kHz or 
999 kHz)

S/N

54 dB (at 50 mV/m)

Harmonic distortion

0.5% (50 mV/m, 400 Hz)

Selectivity
At 9 kHz:

35 dB

Inputs/Outputs
Video:

1 Vp-p, 75 ohms

S-video:

Y: 1 Vp-p, 75 ohms
C: 0.286 Vp-p, 75 ohms

COMPONENT VIDEO:

Y: 1 Vp-p, 75 ohms
P

B

/C

B

/B-Y: 0.7 Vp-p, 

75 ohms
P

R

/C

R

/R-Y: 0.7 Vp-p, 

75 ohms
80 MHz HD Pass Through

Power requirements
Power consumption

Power consumption (during standby mode)

0.3 W

Dimensions (w/h/d) (Approx.)

397 

× 160.5 × 430 mm

including projecting parts 
and controls

Mass (Approx.)

13.5 kg

FM wire antenna (1)
AM loop antenna (1)
DAB wire antenna (1)
Remote commander RM-AAP002 (1) 
R6 (size-AA) batteries (2)
AC power cord (1)

Design and specifications are subject to change 
without notice.

230 V AC, 50/60 Hz
290 W

76 dB
70 dB

0.3%
0.5%

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

 0

0

3

7-1.

Overall Section ................................................................ 74

7-2.

Back Panel Section .......................................................... 75

7-3.

Main Board Section ......................................................... 76

7-4.

Heat Sink Section ............................................................ 77

7-5.

Chassis Section ................................................................ 78

7-6.

Front Panel Section ......................................................... 79

7-7.

Panel Base Section .......................................................... 80

................................ 81

...............................................

4

...................................................................

6

3-1.

Disassembly Flow ...........................................................

7

3-2.

Case .................................................................................

7

3-3.

COMP-V Board ...............................................................

8

3-4.

Back Panel Block ............................................................

8

3-5.

DIGITAL Board, A/V SYNC Board ...............................

9

3-6.

STAY-3/AU-IN/DAB INTERFACE Board .....................

9

3-7.

STAY-5/VIDEO-AU/VIDEO/S-VIDEO/
SPK-A/SPK-B Board ...................................................... 10

3-8.

MAIN Board Block ......................................................... 10

3-9.

MAIN Board .................................................................... 11

.............................................................. 12

......................... 13

6-1.

Block Diagram – TUNER, VIDEO Section – ................. 15

6-2.

Block Diagram – AUDIO DSP Section – ........................ 16

6-3.

Block Diagram – AUDIO CONTROL Section – ............ 17

6-4.

Block Diagram – AUDIO AMP Section – ....................... 18

6-5.

Block Diagram – DISPLAY,
KEY CONTROL Section – ............................................. 19

6-6.

Block Diagram – POWER SUPPLY Section – ............... 20

6-7.

Printed Wiring Board
– DIGITAL Board (Component Side) – .......................... 22

6-8.

Printed Wiring Board
– DIGITAL Board (Conductor Side) – ............................ 23

6-9.

Schematic Diagram – DIGITAL Board (1/4) – ............... 24

6-10. Schematic Diagram – DIGITAL Board (2/4) – ............... 25
6-11. Schematic Diagram – DIGITAL Board (3/4) – ............... 26
6-12. Schematic Diagram – DIGITAL Board (4/4) – ............... 27
6-13. Printed Wiring Board – DAB INTERFACE Board – ...... 28
6-14. Schematic Diagram – DAB INTERFACE Board – ......... 29
6-15. Printed Wiring Board – A/V SYNC Board – .................. 30
6-16. Schematic Diagram – A/V SYNC Board – ..................... 31
6-17. Printed Wiring Boards – VIDEO Section – ..................... 32
6-18. Schematic Diagram – VIDEO Section – ......................... 33
6-19. Printed Wiring Boards – S-VIDEO Section – ................. 34
6-20. Schematic Diagram – S-VIDEO Section – ..................... 35
6-21. Printed Wiring Board – COMP-V Board – ..................... 36
6-22. Schematic Diagram – COMP-V Board – ........................ 37
6-23. Printed Wiring Board – AU-IN Board – .......................... 38
6-24. Schematic Diagram – AU-IN Board – ............................. 39
6-25. Printed Wiring Board – MAIN Board – .......................... 40
6-26. Schematic Diagram – MAIN Board (1/3) – .................... 41
6-27. Schematic Diagram – MAIN Board (2/3) – .................... 42
6-28. Schematic Diagram – MAIN Board (3/3) – .................... 43
6-29. Printed Wiring Board – A CLASS Board – ..................... 44
6-30. Printed Wiring Boards – STAY Section – ....................... 45
6-31. Schematic Diagram – A CLASS Section (1/2) – ............ 46
6-32. Schematic Diagram – A CLASS Section (2/2) – ............ 47
6-33. Printed Wiring Boards – SPEAKER Section – ............... 48
6-34. Schematic Diagram – SPEAKER Section – .................... 49
6-35. Printed Wiring Boards – DISPLAY Section – ................. 50
6-36. Schematic Diagram – DISPLAY Section – ..................... 51
6-37. Printed Wiring Boards – DC Section – ........................... 52
6-38. Schematic Diagram – DC Section – ................................ 53
6-39. Printed Wiring Board – AC Board – ................................ 54
6-40. Schematic Diagram – AC Board – .................................. 55

4

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40 °C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 

°C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.