STR-DA9000ES - Sony Audio Service Manual (repair manual). Page 3

3

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Ω

µ

After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.

The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA

WT-540A. Follow the manufacturers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a VOM

or battery-operated AC voltmeter. The “limit” indication is 0.75
V, so analog meters must have an accurate low-voltage scale.
The Simpson 250 and Sanwa SH-63Trd are examples of a pas-
sive VOM that is suitable. Nearly all battery operated digital
multimeters that have a 2 V AC range are suitable.  (See Fig. A)

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

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5

Location of Controls .......................................................

9

3-1. Disassembly Flow ........................................................... 12
3-2. Case (Top)/(Side-L)/(Side-R) ......................................... 13
3-3. Bracket (J)/(P-B) ............................................................. 13
3-4. AMP Board Block ........................................................... 14
3-5. Tuner, COMPONENT/TRIGGER/DVI Board Block .... 14
3-6. S-VIDEO/VIDEO Board Block ..................................... 15
3-7. SUB Board, PREOUT Board, MAIN Board .................. 15
3-8. I. LINK Board, DIGITAL Board .................................... 16
3-9. MOTHER Board Section ................................................ 16
3-10. MOTHER Board ............................................................. 17

.............................................................. 18

......................... 21

6-1. Block Diagram  – AUDIO INPUT Section – ................. 23
6-2. Block Diagram  – A/D CONVERTER Section – ........... 24
6-3. Block Diagram

– DIGITAL INPUT, TUNER Section – .......................... 25

6-4. Block Diagram  – I. LINK Section – .............................. 26
6-5. Block Diagram  – DSP Section – ................................... 27
6-6. Block Diagram  – DIGITAL AUDIO Section – ............. 28
6-7. Block Diagram  – AUDIO OUTPUT Section – ............. 29
6-8. Block Diagram  – POWER AMP Section – ................... 30
6-9. Block Diagram  – VIDEO INPUT/OUT Section – ........ 31
6-10. Block Diagram  – COMPONENT VIDEO Section – .... 32
6-11. Block Diagram

– DVI, DISPLAY/CONTROL Section – ........................ 33

6-12. Block Diagram  – POWER SUPPLY Section – ............. 34
6-13. Note for Printed Wiring Boards

and Schematic Diagrams ................................................ 35

6-14. Printed Wiring Board

– DIGITAL Board (Component Side) – ......................... 36

6-15. Printed Wiring Board

– DIGITAL Board (Conductor Side) – ........................... 37

6-16. Schematic Diagram  – DIGITAL Board (1/11) – ........... 38
6-17. Schematic Diagram  – DIGITAL Board (2/11) – ........... 39
6-18. Schematic Diagram  – DIGITAL Board (3/11) – ........... 40
6-19. Schematic Diagram  – DIGITAL Board (4/11) – ........... 41
6-20. Schematic Diagram  – DIGITAL Board (5/11) – ........... 42
6-21. Schematic Diagram  – DIGITAL Board (6/11) – ........... 43
6-22. Schematic Diagram  – DIGITAL Board (7/11) – ........... 44
6-23. Schematic Diagram  – DIGITAL Board (8/11) – ........... 45
6-24. Schematic Diagram  – DIGITAL Board (9/11) – ........... 46
6-25. Schematic Diagram  – DIGITAL Board (10/11) – ......... 47
6-26. Schematic Diagram  – DIGITAL Board (11/11) – ......... 48
6-27. Schematic Diagram  – MAIN Board (1/3) – .................. 49
6-28. Schematic Diagram  – MAIN Board (2/3) – .................. 50
6-29. Schematic Diagram  – MAIN Board (3/3) – .................. 51
6-30. Printed Wiring Board

– MAIN Board (Component Side) – .............................. 52

6-31. Printed Wiring Board

– MAIN Board (Conductor Side) – ................................ 53

6-32. Printed Wiring Board

– SUB Board (Component Side) – ................................. 54

6-33. Printed Wiring Board

– SUB Board (Conductor Side) – ................................... 55