Read Sony STR-DA5300ES (serv.man2) Service Manual online
STR-DA5300ES
2
2
STR-DA5300ES
•
Note for Printed Wiring Boards and Schematic Diagrams
•
DSP board is multi-layer printed board.
However, the patterns of intermediate-layers have not been
included in this diagrams.
However, the patterns of intermediate-layers have not been
included in this diagrams.
•
Indication of transistor
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
•
Voltages are dc with respect to ground under no-signal
(detuned) conditions.
no mark : TUNER
(detuned) conditions.
no mark : TUNER
•
Voltages are taken with a VOM (Input impedance 10 MW).
Voltage variations may be noted due to normal produc-
tion tolerances.
Voltage variations may be noted due to normal produc-
tion tolerances.
F
: AUDIO (ANALOG)
J
: AUDIO (DIGITAL)
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
cannot be measured, because its lead layout is different
from that of conventional IC.
•
Abbreviation
CH
CH
: Chinese model
CND : Canadian model
ECE
ECE
: Russian and Ukrainian models
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
Lead layout of conventional IC
CSP (chip size package)
•
Lead Layouts
2.
DIAGRAMS
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
surface
Ver. 1.2
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