Read Sony SRS-NWM10 (serv.man2) Service Manual online
SRS-NWM10
3
3
SRS-NWM10
2.
DIAGRAMS
•
Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
surface
•
Lead Layouts
Lead layout of conventional IC CSP (chip size package)
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
C
: panel designation.
•
A
: B+ Line.
•
Power voltage is dc 4.5V and fed with regulated dc power
supply from battery terminal.
supply from battery terminal.
•
Voltages are dc with respect to ground under no-signal
conditions.
no mark : POWER ON
conditions.
no mark : POWER ON
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
tion tolerances.
•
Signal path.
F
: AUDIO
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
cannot be measured, because its lead layout is different
from that of conventional IC.
•
IC Block Diagram
– CONTROL Board –
IC401 NJM2870F45 (TE2)
5
VIN
4
VOUT
2
GND
3
NOISE
BYPASS
1
CONTROL
BANDGAP
REFERENCE
THERMAL
PROTECTION
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