SRS-BTV25 - Sony Audio Service Manual (repair manual)

2012J33-1

© 

2012.10

Speaker system
 

Woofer: 56 mm, magnetically shielded

 

Tweeter: 20 mm

Enclosure type
 Bass 

reflex

Impedance
 

Woofer: 6 Ω

 

Tweeter: 6 Ω

Reference output power
 

13 W (10% T.H.D., 1 kHz, 6 Ω)

Input 

Stereo mini jack × 1

Input impedance
 

4.7 kΩ (at 1 kHz)

Communication System
 

Bluetooth Specification version 2.1 + EDR 
(Enhanced Data Rate)

Output 

Bluetooth Specification Power Class 2

Maximum communication range
 

Line of sight approx. 10 m*

1

Frequency band
 

2.4 GHz band (2.4000 GHz - 2.4835 GHz)

Modulation method
 FHSS
Compatible 

Bluetooth Profiles*

2

 

A2DP (Advanced Audio Distribution Profile)

 

AVRCP 1.3 (Audio Video Remote Control 
Profile)

Supported Codec*

3

 SBC*

4

Supported content protection method
 SCMS-T
Transmission range (A2DP)
 

20 Hz - 20,000 Hz (Sampling frequency 44.1 
kHz)

*1  The actual range will vary depending on factors such 

as obstacles between devices, magnetic fields around a 
microwave oven, static electricity, reception sensitivity, 
aerial’s performance, operating system, software 
application, etc.

*2 

Bluetooth standard profiles indicate the purpose of 

Bluetooth communication between devices.

*3  Codec: Audio signal compression and conversion 

format

*4 Subband Codec

USB jack 
 

Type A (for charging the battery of a connected 
device) (5 V, 500 mA)

Power 

DC 13 V

Rated power consumption
 12 

W

Operating temperature
 

5 ºC - 35 ºC

Power voltage
 

100 V - 240 V AC

Dimensions (w/h/d)
 

Approximately 145 mm × 145 mm × 145 mm

Mass 

Approximately 500 g

Supplied accessories
 

AC adaptor (AC-E1320D1) (1)

 AC 

power cord (1)

 Reference 

Guide 

(1)

Design and specifications are subject to change without 
notice.

The 

®

 word mark and logos are owned by the 

Bluetooth SIG, Inc. and any use of such marks by Sony 
Corporation is under license.
Other trademarks and trade names are those of their 
respective owners.

 .............................................  

3

2-1. Disassembly 

Flow 

...........................................................   4

2-2.  Bottom Cover Block .......................................................   5
2-3.  Ornament (SV/left) Block ...............................................   6
2-4.  Front Cabinet Block ........................................................   7
2-5. BT 

Board 

.........................................................................   8

2-6. Pillar 

Baffl e Block ..........................................................   9

2-7. Baffl e Block ....................................................................   10
2-8.  Loudspeaker (5.6 cm) (Woofer) (SP1) ............................   11
2-9. Panel 

Top 

Block 

..............................................................  12

2-10.  Loudspeaker (20 mm) Block (Tweeter) (SP2) ................   13
2-11.  Loudspeaker (20 mm) (Tweeter) (SP2) 

(Except Korean Model) ..................................................   14

2-12.  Loudspeaker (20 mm) (Tweeter) (SP2) 

(Korean Model) ...............................................................   15

2-13.  MAIN Board (Except Korean Model) ............................   16
2-14.  MAIN Board (Korean Model) ........................................   17

 ............................................................   17

4-1. Block 

Diagram 

................................................................  18

4-2.  Printed Wiring Boards - KEY Section - ..........................   20
4-3.  Schematic Diagram - KEY Section - ..............................   20
4-4.  Printed Wiring Boards - MAIN Section - .......................   21
4-5.  Schematic Diagram - MAIN Section (1/4) - ...................   22
4-6.  Schematic Diagram - MAIN Section (2/4) - ...................   23
4-7.  Schematic Diagram - MAIN Section (3/4) - ...................   24
4-8.  Schematic Diagram - MAIN Section (4/4) - ...................   25

5-1.  Escutcheon, Bottom Cover Section ................................   30
5-2. Ornament 

Section 

...........................................................  31

5-3.  Front Cabinet Section .....................................................   32
5-4. Baffl e Section ..................................................................   33
5-5.  Top Panel Section ...........................................................   34
5-6. Pillar 

Section 

...................................................................  35

5-7.  Bottom Frame Section ....................................................   36

 ..............................   37

Accessories are given in the last of the electrical parts list.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

 When connecting or disconnecting the AC power cord 

(mains lead), turn off the system beforehand. 
Otherwise, it may cause malfunction.

 Use only the supplied AC adaptor. To avoid damaging 

the system, do not use any other AC adaptor.

Polarity of the plug

 Plug the AC power cord (mains lead) into a nearby wall 

outlet (mains). In the case of a problem, unplug it from 
the wall outlet (mains) immediately.

 Do not place the AC adaptor on a bookshelf or in a 

confined place, such as a cabinet.

 To avoid fire or electric shock, do not use the AC 

adaptor in a place near liquid or subject to moisture. 
Furthermore, do not place liquid-filled vessels, such as 
vases, etc., on the AC adaptor.

 The supplied AC adaptor and AC power cord (mains 

lead) are only for this system. Do not use them with any 
other device.

 In system protect mode, all indicators flash, and the 

system buttons will not work. To exit this mode, 
disconnect the AC power cord (mains lead) from the 
wall outlet (mains), then connect again. Make sure all 
indicators are off, and turn on the system. If the system 
detects a problem (indicators flashing repeatedly, no 
sound from connected device, etc.), there may be a 
malfunction. In this case, immediately disconnect the 
AC power cord (mains lead) and seek repair.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTE  THE  IC101,  IC304  AND  Q901  ON  THE  MAIN  
BOARD  REPLACING
IC101, IC304 and Q901 on the MAIN board cannot exchange 
with single. When these parts are damaged, exchange the complete 
mounted board.

NOTE  THE  BT  BOARD  REPLACING
When the BT board is defective, exchange the complete mounted 
board.

NOTE  THE  JACK  BOARD  REPLACING
When the JACK board is defective, exchange the BATTERY 
HOLDER (SV) ASSY (for Black) or the BOTTOM FRAME (SV) 
ASSY (for White).

NOTE  THE  USB  BOARD  REPLACING
When the USB board is defective, exchange the BATTERY 
HOLDER (SV) ASSY (for Black) or the BOTTOM FRAME (SV) 
ASSY (for White).

•  This set can be disassembled in the order shown below.