SRF-HM01V - Sony Audio Service Manual (repair manual). Page 2

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2-1. Disassembly Flow ...........................................................

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2-2. MICROCOMPUTER Board ...........................................

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2-3. MAIN Board ...................................................................

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2-4. BATTERY Board ............................................................

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2-5. Putting the Sheet (A) .......................................................

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4-1. Block Diagram  – TUNER Section – .............................

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4-2. Block Diagram  – MAIN Section – ................................ 10
4-3. Note for Printed Wiring Boards

and Schematic Diagrams ................................................ 11

4-4. Printed Wiring Board

– MAIN Board (Component Side) – .............................. 12

4-5. Printed Wiring Board

– MAIN Board (Conductor Side) – ................................ 13

4-6. Printed Wiring Board  – BATTERY Board – ................. 14
4-7. Schematic Diagram  – BATTERY/MAIN Boards – ...... 15
4-8. Printed Wiring Board

  – MICROCOMPUTER Board (Component Side) – .... 16

4-9. Printed Wiring Board

  – MICROCOMPUTER Board (Conductor Side) – ...... 17

4-10. Schematic Diagram

  – MICROCOMPUTER Board – ................................... 18

4-11. IC Pin Function Description ........................................... 20

5-1. Cabinet (R) Section ......................................................... 21
5-2. Board Section .................................................................. 22
5-3. Cabinet (L) Section ......................................................... 23

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• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.