Read Sony SCD-XE680 Service Manual online
2
SCD-XE680
TABLE OF CONTENTS
1.
SERVICING NOTES
...............................................
3
2.
GENERAL
...................................................................
5
3.
DISASSEMBLY
3-1. Disassembly Flow ...........................................................
7
3-2. Case (408226) .................................................................
8
3-3. Front Panel Section .........................................................
8
3-4. AUDIO Board, MAIN Board ..........................................
9
3-5. Mechanism Deck (CDM66B-DVBU6B) .......................
9
3-6. Base Unit (DVBU-6B) .................................................... 10
4.
TEST MODE
.............................................................. 11
5.
DIAGRAMS
5-1. Block Diagram – RF/SERVO Section – ........................ 18
5-2. Block Diagram – SERVO Section – .............................. 19
5-3. Block Diagram – MAIN Section – ................................ 20
5-4. Block Diagram – AUDIO Section – .............................. 21
5-5. Block Diagram – DISPLAY/KEY CONTROL/
5-2. Block Diagram – SERVO Section – .............................. 19
5-3. Block Diagram – MAIN Section – ................................ 20
5-4. Block Diagram – AUDIO Section – .............................. 21
5-5. Block Diagram – DISPLAY/KEY CONTROL/
POWER SUPPLY Section – ........................................... 22
5-6. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
5-7. Schematic Diagram – RF Board – ................................. 24
5-8. Printed Wiring Boards – RF/LOADING Boards – ....... 25
5-9. Printed Wiring Board
5-8. Printed Wiring Boards – RF/LOADING Boards – ....... 25
5-9. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 26
5-10. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 27
5-11. Schematic Diagram
– MAIN (1/5)/LOADING Boards – .............................. 28
5-12. Schematic Diagram – MAIN Board (2/5) – .................. 29
5-13. Schematic Diagram – MAIN Board (3/5) – .................. 30
5-14. Schematic Diagram – MAIN Board (4/5) – .................. 31
5-15. Schematic Diagram – MAIN Board (5/5) – .................. 32
5-16. Schematic Diagram
5-13. Schematic Diagram – MAIN Board (3/5) – .................. 30
5-14. Schematic Diagram – MAIN Board (4/5) – .................. 31
5-15. Schematic Diagram – MAIN Board (5/5) – .................. 32
5-16. Schematic Diagram
– AUDIO/HEADPHONE Boards – ................................ 33
5-17. Printed Wiring Board
– AUDIO Board (Component Side) – ............................ 34
5-18. Printed Wiring Boards – AUDIO (Conductor Side)/
HEADPHONE Boards – ................................................. 35
5-19. Printed Wiring Boards – DISPLAY/KEY Boards – ...... 36
5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 37
5-21. Printed Wiring Boards
5-20. Schematic Diagram – DISPLAY/KEY Boards – .......... 37
5-21. Printed Wiring Boards
– POWER/POWER SW/PT Boards – ............................ 38
5-22. Schematic Diagram
– POWER/POWER SW/PT Boards – ............................ 39
5-23. IC Pin Function Description ........................................... 47
6.
EXPLODED VIEWS
6-1. Case Section .................................................................... 59
6-2. Front Panel Section ......................................................... 60
6-3. Chassis Section ............................................................... 61
6-4. CD Mechanism Deck Section
6-2. Front Panel Section ......................................................... 60
6-3. Chassis Section ............................................................... 61
6-4. CD Mechanism Deck Section
(CDM66B-DVBU6B) ..................................................... 62
6-5. Base Unit Section (DVBU-6B) ....................................... 63
7.
ELECTRICAL PARTS LIST
............................... 64
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
This appliance is classified as a CLASS 1 LASER
product.
This label is located on the rear exterior.
product.
This label is located on the rear exterior.
The following caution label is located inside the unit.
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