SA-WMS367 - Sony Audio Service Manual (repair manual). Page 2

2

1.5 k

Ω

0.15 

µ

F

AC
voltmeter
(0.75 V)

To Exposed Metal
Parts on Set

Earth Ground

SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.

LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA

WT-540A. Follow the manufacturers’ instructions to use these
instruments.

2. A battery-operated AC milliammeter. The Data Precision 245

digital multimeter is suitable for this job.

3. Measuring the voltage drop across a resistor by means of a

VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL  OR
IN  SUPPLEMENTS  PUBLISHED  BY  SONY.

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE  DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

Location of Controls ................................................................ 3

2-1.   Note for Printed Wiring Boards and
         Schematic Diagrams ............................................................ 3
2-2.   Circuit Boards Location ...................................................... 3
2-3.   Printed Wiring Boards – Main Section – ............................ 4
2-4.   Schematic Diagram – Main Section – ................................. 5
2-5.   Printed Wiring Boards – Control Section – ......................... 6
2-6.   Schematic Diagram – Control Section – ............................. 7
2-7.   IC Block Diagram ............................................................... 8

3-1.   Front Section ....................................................................... 9
3-2.   Rear Section ...................................................................... 10

......................................... 11

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.