Read Sony SA-WFS3 / SS-FS3 Service Manual online
SA-WFS3/SS-FS3
3
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
• JIG
When disassembling the set, use the following jig (for speaker
When disassembling the set, use the following jig (for speaker
removal).
Part No. J-2501-238-A JIG FOR SPEAKER REMOVAL
NOTE OF CONFIRMING THE BOARDS (SA-WFS3)
Protecting is generated when energizing with the heat sink de-
tached. Fix the heat sink to the MAIN board by using the screw
and the nut without fail when you confi rm the board.
Protecting is generated when energizing with the heat sink de-
tached. Fix the heat sink to the MAIN board by using the screw
and the nut without fail when you confi rm the board.
CONFIRMING THE POWER BOARD (SA-WFS3)
The POWER board can be confi rmed by removing the bottom
plate of the active subwoofer.
The POWER board can be confi rmed by removing the bottom
plate of the active subwoofer.
NOTE THE IC3511 AND IC3513 ON THE HDMI BOARD
REPLACING (SA-WFS3)
IC3511 and IC3513 on the HDMI board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted
board.
REPLACING (SA-WFS3)
IC3511 and IC3513 on the HDMI board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted
board.
NOTE OF REPLACING THE IC340 AND IC400 ON
THE MAIN BOARD AND THE COMPLETE MAIN
BOARD (SA-WFS3)
When IC340 and IC400 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(OIL COMPOUND G777) (Part No. J-2501-335-A ) between the
main board and the heat sink.
Spread the compound referring to the fi gure below.
THE MAIN BOARD AND THE COMPLETE MAIN
BOARD (SA-WFS3)
When IC340 and IC400 on the MAIN board and the complete
MAIN board are replaced, it is necessary to spread the compound
(OIL COMPOUND G777) (Part No. J-2501-335-A ) between the
main board and the heat sink.
Spread the compound referring to the fi gure below.
oil compound G777
(J-2501-335-A)
(J-2501-335-A)
IC340
IC400
– MAIN Board (Component Side) –
CAPACITOR ELECTORICAL DISCHARGE
PROCESSING (SA-WFS3)
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C903) to
discharge the capacitor (C903).
PROCESSING (SA-WFS3)
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C903) to
discharge the capacitor (C903).
C903
800
:/2 W
– POWER Board (Conductor Side) –
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