SA-WFS3, SS-FS3 - Sony Audio Service Manual (repair manual). Page 3

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SA-WFS3/SS-FS3
3
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
• JIG
  When disassembling the set, use the following jig (for speaker 
removal).
  Part No. J-2501-238-A  JIG FOR SPEAKER REMOVAL
 
 
NOTE  OF  CONFIRMING  THE  BOARDS (SA-WFS3)
Protecting is generated when energizing with the heat sink de-
tached. Fix the heat sink to the MAIN board by using the screw 
and the nut without fail when you confi rm the board.
CONFIRMING  THE  POWER  BOARD (SA-WFS3)
The POWER board can be confi rmed by removing the bottom 
plate of the active subwoofer.
NOTE  THE  IC3511  AND  IC3513  ON  THE  HDMI  BOARD  
REPLACING (SA-WFS3)
IC3511 and IC3513 on the HDMI board cannot exchange with sin-
gle. When these parts are damaged, exchange the entire mounted 
board.
NOTE  OF  REPLACING  THE  IC340  AND  IC400  ON  
THE  MAIN  BOARD  AND  THE  COMPLETE  MAIN  
BOARD (SA-WFS3)
When IC340 and IC400 on the MAIN board and the complete 
MAIN board are replaced, it is necessary to spread the compound 
(OIL COMPOUND G777) (Part No. J-2501-335-A ) between the 
main board and the heat sink.
Spread the compound referring to the fi gure below.
oil compound G777
(J-2501-335-A)
IC340
IC400
– MAIN Board (Component Side) –
CAPACITOR  ELECTORICAL  DISCHARGE  
PROCESSING (SA-WFS3)
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C903) to 
discharge the capacitor (C903).
C903
800 
:/2 W
– POWER Board (Conductor Side) –
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