SA-CRW33, SA-W33, SS-CN33, SS-F33H, SS-SR33 - Sony Audio Service Manual (repair manual). Page 2

1-1.   Disassembly Flow ...........................................................   3
1-2.   Grille Frame Assy (SA-W33) .........................................   4
1-3.   Rear Cover Block (SA-W33) ..........................................   5
1-4.   CONTROL Board (SA-W33) .........................................   5
1-5.   Grille Frame Assy (SS-CN33) ........................................   6
1-6.   Grille Frame Assy (SS-SR33) .........................................   6
1-7.   Loudspeaker (10 cm) (SS-F33H) ....................................   7

2-1.  Printed Wiring Boards (SA-W33)  ..................................   10
2-2. Schematic 

Diagram 

 

- MAIN/LED Boards (SA-W33) - ..................................   11

2-3. Schematic 

Diagram 

 

- CONTROL Board (SA-W33) - ....................................   12

3-1. SA-W33 

..........................................................................  13

3-2. SS-CN33 

.........................................................................  14

3-3. SS-F33H 

..........................................................................  15

3-4. SS-SR33 

..........................................................................  16

  ..............................   17

Accessories are given in the last of the electrical parts list.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

• JIG
  When disassembling the set, use the following jig (for speaker 

removal).

  Part No. J-2501-238-A  JIG FOR SPEAKER REMOVAL