Read Sony PCM-D50 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
PCM-D50
SPECIFICATIONS
LINEAR PCM RECORDER
9-887-869-06
2010I04-1
©
2010.09
US Model
Canadian Model
AEP Model
UK Model
E Model
Chinese Model
Ver. 1.5 2010.09
Recording media
Built-in flash memory 4 GB, “Memory Stick” (not supplied), Linear PCM
Stereo recording
Stereo recording
Maximum recordable time (Approximate)
The total maximum recordable time (approximate) of all the folders is as follows.
The total maximum recordable time (approximate) of all the folders is as follows.
Built-in flash memory (4 GB)
Sampling frequency/
quantifying bit number
quantifying bit number
Maximum
recordable time *
recordable time *
22.05 kHz 16 bit
12 hrs 55 min.
44.10 kHz 16 bit
6 hrs 25 min.
44.10 kHz 24 bit
4 hrs 15 min.
48.00 kHz 16 bit
5 hrs 55 min.
48.00 kHz 24 bit
3 hrs 55 min.
96.00 kHz 16 bit
2 hrs 55 min.
96.00 kHz 24 bit
1 hr 55 min.
“Memory Stick PRO-HG Duo”
Sampling frequency/
quantifying bit number
quantifying bit number
Maximum recordable time *
1 GB
2 GB
4 GB
22.05 kHz 16 bit
3 hrs 5 min.
6 hrs 25 min.
12 hrs 50 min.
44.10 kHz 16 bit
1 hr 30 min.
3 hrs 10 min.
6 hrs 25 min.
44.10 kHz 24 bit
1 hr 0 min.
2 hrs 5 min.
4 hrs 15 min.
48.00 kHz 16 bit
1 hr 25 min.
2 hrs 55 min.
5 hrs 55 min.
48.00 kHz 24 bit
55 min.
1 hr 55 min.
3 hrs 55 min.
96.00 kHz 16 bit
40 min.
1 hr 25 min.
2 hrs 55 min.
96.00 kHz 24 bit
25 min.
55 min.
1 hr 55 min.
* The maximum recordable time varies depending on recording conditions.
- Continued on next page -
Capacity
Part of the memory capacity is allocated to data management.
Actual usable capacity: Approx. 3.83 GB (4,116,611,072 bytes)
Actual usable capacity: Approx. 3.83 GB (4,116,611,072 bytes)
PCM-D50
2
Linear PCM
Quantization: 16-bit linear, 24-bit
linear
Frequency range (Input from the LINE
IN (OPT) jack when recording/
playing back) (0 to –2 dB):
Fs 22.05 kHz: 20 to 10,000 Hz
Fs 44.10 kHz: 20 to 20,000 Hz
Fs 48.00 kHz: 20 to 22,000 Hz
Fs 96.00 kHz: 20 to 40,000 Hz
linear
Frequency range (Input from the LINE
IN (OPT) jack when recording/
playing back) (0 to –2 dB):
Fs 22.05 kHz: 20 to 10,000 Hz
Fs 44.10 kHz: 20 to 20,000 Hz
Fs 48.00 kHz: 20 to 22,000 Hz
Fs 96.00 kHz: 20 to 40,000 Hz
MP3 compatible bit rates, sampling
frequencies
frequencies
MPEG Ver. 1 Layer 3:
32, 44.1, 48 kHz
32 to 320 kbps, VBR
MPEG Ver. 2 Layer 3:
16, 22.05, 24 kHz
32 to 160 kbps, VBR
32, 44.1, 48 kHz
32 to 320 kbps, VBR
MPEG Ver. 2 Layer 3:
16, 22.05, 24 kHz
32 to 160 kbps, VBR
Signal-to-noise ratio (S/N) (Input from the
LINE IN (OPT) jack when recording/playing
back)
LINE IN (OPT) jack when recording/playing
back)
93 dB or above (1 kHz IHF-A)
(for 24 bit)
(for 24 bit)
Total harmonic distortion (Input from the
LINE IN (OPT) jack)
LINE IN (OPT) jack)
22.05 kHz 16 bit, 44.10 kHz 16/24 bit:
0.01% or below (1 kHz, 22 kHz LPF)
48.00 kHz 16/24 bit, 96.00 kHz
16/24 bit: 0.01% or below
(1 kHz, 22 kHz LPF)
0.01% or below (1 kHz, 22 kHz LPF)
48.00 kHz 16/24 bit, 96.00 kHz
16/24 bit: 0.01% or below
(1 kHz, 22 kHz LPF)
Wow and flutter
Below measurable limit (less than
±0.001% W.PEAK)
±0.001% W.PEAK)
Input/output
m (microphone) jack (stereo mini jack)
Input impedance: 22k
:
Rated input level: 2.5mV
Minimum input level: 0.7mV
Minimum input level: 0.7mV
i
(headphone) jack (stereo mini jack)
Rated output level: 400mV
Maximum output level:
25mW + 25mW or more
Load impedance: 16
Maximum output level:
25mW + 25mW or more
Load impedance: 16
:
LINE IN (OPT) jack
Input impedance: 40k
:
Rated input level: 2.0V
Minimum input level: 450mV
Input level: –24.5 to –14.5 dBm
(for optical digital input)
Absorption wavelength:
630 to 690 nm
(for optical digital input)
Minimum input level: 450mV
Input level: –24.5 to –14.5 dBm
(for optical digital input)
Absorption wavelength:
630 to 690 nm
(for optical digital input)
LINE OUT (OPT) jack
Output impedance:
1 k
1 k
: for European model/
220
: for other models
Rated output level: 1.7V
Load impedance: 22k
Load impedance: 22k
:
Output level: –21 to –15 dBm
(for optical digital output)
Emission wavelength: 630 to 690 nm
(for optical digital output)
(for optical digital output)
Emission wavelength: 630 to 690 nm
(for optical digital output)
DC IN 6V jack
USB connector (Hi-speed USB, Mass
USB connector (Hi-speed USB, Mass
Storage Class)
Memory Stick slot
General
Power requirements
DC IN 6V
Four LR6 (size AA) alkaline batteries
(supplied)
Four nickel metal hydride
rechargeable batteries NH-AA (not
supplied)
Four LR6 (size AA) alkaline batteries
(supplied)
Four nickel metal hydride
rechargeable batteries NH-AA (not
supplied)
Power consumption
0.75 W
Dimensions
Approx. 72.0 × 154.5 × 32.7 mm
(2
(2
7
/
8
× 6
1
/
8
× 1
5
/
16
inches) (w/h/d)
(not including projecting parts and
controls)
controls)
Mass 365 g (12.88 oz) (including batteries)
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Supplied accessories
Design and specifications are subject to change
without notice.
without notice.
Ver. 1.5
PCM-D50
3
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONET WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COM- POSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
PCM-D50
4
1. GENERAL
..................................................................
5
2. DISASSEMBLY
2-1. Panel (Front) Assy .......................................................... 11
2-2. Ornamental Belt (Upper) Assy ....................................... 11
2-3. Backlight Board .............................................................. 12
2-4. Power Board ................................................................... 12
2-5. REC VOL Assy, HP VOL Assy ...................................... 13
2-6. DA Board ........................................................................ 13
2-7. AD Board, MIC001, MIC002 ......................................... 14
2-8. System Board .................................................................. 14
3.
TEST MODE
............................................................ 15
4. DIAGRAMS
4-1. Block Diagram - AD Section - ....................................... 20
4-2. Block Diagram - DA Section - ....................................... 21
4-3. Block Diagram - Power Section - .................................. 22
4-4. Printed Wiring Board - AD Section (1/2) - .................... 23
4-5. Printed Wiring Board - AD Section (2/2) - .................... 24
4-6. Schematic Diagram - AD Section (1/3) - ....................... 25
4-7. Schematic Diagram - AD Section (2/3) - ....................... 26
4-8. Schematic Diagram - AD Section (3/3) - ....................... 27
4-9. Printed Wiring Board - DA Section (1/2) - .................... 28
4-10. Printed Wiring Board - DA Section (2/2) - .................... 29
4-11. Printed Wiring Boards
- Backlight/HP Volume/REC VOL Flexible Section - .... 30
4-12. Schematic Diagram - DA Section - ................................ 31
4-13. Printed Wiring Board - System Section (1/2) - .............. 32
4-14. Printed Wiring Board - System Section (2/2) - .............. 33
4-15. Schematic Diagram - System Section (1/5) - ................. 34
4-16. Schematic Diagram - System Section (2/5) - ................. 35
4-17. Schematic Diagram - System Section (3/5) - ................. 36
4-18. Schematic Diagram - System Section (4/5) - ................. 37
4-19. Schematic Diagram - System Section (5/5) - ................. 38
4-20. Printed Wiring Board - Power Section (1/2) - ............... 39
4-21. Printed Wiring Board - Power Section (2/2) - ............... 40
4-22. Schematic Diagram - Power Section (1/4) - .................. 41
4-23. Schematic Diagram - Power Section (2/4) - .................. 42
4-24. Schematic Diagram - Power Section (3/4) - .................. 43
4-25. Schematic Diagram - Power Section (4/4) - .................. 44
5.
EXPLODED VIEWS
5-1. Front Panel Section ......................................................... 64
5-2. LCD Section ................................................................... 65
5-3. VOL Section ................................................................... 66
5-4. MIC Section .................................................................... 67
5-5. Rear Panel Section .......................................................... 68
6.
ELECTRICAL PARTS LIST
.............................. 69
TABLE OF CONTENTS