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NWZ-A826/A826K/A828/A828K/A829/A829K
NWZ-A826/A826K/A828/A828K/A829/A829K
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19
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω and
1
/
4
W or less unless otherwise
specifi ed.
• C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
(In addition to this, the necessary note is printed in each block.)
• A : B+ Line.
• Power voltages is dc 3.7 V and fed with regutated dc pow-
• Power voltages is dc 3.7 V and fed with regutated dc pow-
er supply fron CN901 pin 1 and 2 on the MAIN board.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAY BACK
• Waveforms is taken with a oscilloscope.
Voltage variations may be noted due to normal production
• Waveforms is taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Voltages are taken with VOM (Input impedance 10 M
Ω).
• Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
F
:
AUDIO
L
:
VIDEO
• The voltage and waveform of CSP (chip size package)
cannot be measured, decause its lead layout is different
form that of conventional IC.
form that of conventional IC.
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
•
• X : Parts extracted from the component side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• MAIN and SW boards are mulyi-layer printed board.
However, the patterns of intermediate-layers have not been
However, the patterns of intermediate-layers have not been
included in diagrams.
• Indication of transistor.
C
B
These are omitted.
E
Q
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
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