NW-S4 - Sony Audio Service Manual (repair manual). Page 2

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Network Walkman is trademark of Sony
Corporation.
OpenMG and its logo are trademarks of Sony
Corporation.
WALKMAN is a registered trademark of Sony
Corporation.
Microsoft, Windows, Windows NT, Windows
Media, Windows Millennium Edition and their
logos are trademarks or registered trademarks of
Microsoft Corporation in the United States and/or
other countries.
US and foreign patents licensed from Dolby
Laboratories.
All other trademarks and registered trademarks are
trademarks or registered trademarks of their
respective holders.

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3-1. Disassembly Flow .............................................................. 9
3-2. Lower Case Assy ................................................................ 9
3-3. Jack Flexible Module,

Jack (Small Type) (Water Proof) (J301) .......................... 10

3-4. MAIN Board .................................................................... 10
3-5. SUB Board ....................................................................... 11

4-1. Block Diagram ................................................................. 13
4-2. Note for Printed Wiring Boards and

Schematic Diagrams ........................................................ 14

4-3. Printed Wiring Board  – MAIN Board – ......................... 15
4-4. Schematic Diagram  – MAIN Board (1/2) – ................... 16
4-5. Schematic Diagram  – MAIN Board (2/2) – ................... 17
4-6. Printed Wiring Boards  – SUB Board – .......................... 18
4-7. Schematic Diagram  – SUB Board – ............................... 19
4-8. IC Pin Function Description ............................................ 21

5-1. Upper Case Assy .............................................................. 25
5-2. Board Assy ....................................................................... 26

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• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.