NW-MS77DR - Sony Audio Service Manual (repair manual). Page 2

2

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.

• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

z

Use ISO9660 Level 1 format.

• IC401 (microcomputer), IC451 (frash RAM) on Main board

cannot be replaced individually.
Replace it with Main board assembly for service.

• IC461, 463 (frash RAM) on NAND board cannot be replaced

individually.
Replace it with NAND board assembly for service.

• When exchanging NAND board sub ASSY (for service),

SL701 of the B-side may be open.
In this case, please perform the solder bridge of SL701.

Specifications ............................................................................ 1

................................................ 3

................................................................... 3

............................................................... 4

4-1.

Disassembly Frow ........................................................... 5

4-2.

Case (U) Sub Assy, Play Unit .......................................... 5

4-3.

Lcd Board ........................................................................ 6

4-4.

Button (MS) Assy, Chassis (R) Assy ............................... 6

4-5.

NI-MH Battery, Power Board .......................................... 7

4-6.

Nand Board, Main Board ................................................ 7

5-1.

Block Diagrams ............................................................... 9

5-2.

Schematic Diagram – Main Section (1/2)– ..................... 10

5-3.

Schematic Diagram – Main Section (2/2)– ..................... 11

5-4.

Printed Wiring Boards – Main Section– .......................... 12

5-5.

Schematic Diagram – Lcd Section– ................................ 13

5-6.

Printed Wiring Boards – Lcd Section– ............................ 14

5-7.

Schematic Diagram – Nand Section– .............................. 15

5-8.

Printed Wiring Boards– Nand Section– .......................... 16

5-9.

Schematic Diagram – Power Section– ............................ 17

5-10. Printed Wiring Boards– Power Section– ......................... 18

6-1.

Case Section .................................................................... 20

6-2.

Chassis Section ................................................................ 21

.................................. 22

• Keep the temperature of the soldering iron around 270

°C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

OpenMG and its logo are trademarks of Sony Corporation.
SonicStage and its logo are trademarks of Sony Corporation.
“MagicGate Memory Stick” is trademark of Sony Corporation.

“Memory Stick” and 

 

  are trademarks of Sony Corporation.

“Memory Stick Duo” and 

 are trademarks of Sony

Corporation.
“MagicGate” and 

 are trademarks of Sony Corporation.

ATRAC, ATRAC3, ATRAC3plus and their logos are trademarks
of Sony Corporation.
Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United
States and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
In this manual, TM and R marks are not specified.