NW-E8P - Sony Audio Service Manual (repair manual). Page 2

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2
NW-E8P
Specifications ............................................................................... 1
1. SERVICING NOTE
.......................................................... 2
2. GENERAL
.......................................................................... 3
3. DISASSEMBLY
3-1. Driver ASSY (SP2), Arm Lid (R), Holder Lid (R) ......... 6
3-2. Main Board, Power Board, LCD Unit ............................ 6
3-3. Driver ASSY (SP1), Arm Lid (L), Holder Lid (L) ......... 7
4. TEST MODE
...................................................................... 8
5. DIAGRAMS
5-1. Block Diagrams ............................................................ 10
5-2. Printed Wiring Boards (Main Section) ......................... 11
5-3. Schematic Diagram (Main Section (1/2)) ..................... 12
5-4. Schematic Diagram (Main Section (2/2)) ..................... 13
5-5. Printed Wiring Boards (Power Section) ........................ 14
5-6. Schematic Diagram (Power Section) ............................ 15
6. EXPLODED VIEW
6-1. L-CH Section ................................................................ 17
6-2. R-CH Section ................................................................ 18
7. ELECTRICAL PARTS LIST
....................................... 19
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°
C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
• Replacement of CXD9644GG (IC710) used in the set requires a special
tool.
z
  UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
z
  USABLE FORMAT
Use ISO9660 Level 1 format.
SECTION 1
SERVICING NOTE
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