NW-E305, NW-E307 - Sony Audio Service Manual (repair manual). Page 2

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2
NW-E305/E307
TABLE OF CONTENTS
1.
GENERAL
...................................................................
4
2.
DISASSEMBLY
2-1.
Disassembly Flow ...........................................................
5
2-2.
Window, Case (Upper), USB Lid ....................................
6
2-3.
Case (Lower) ...................................................................
6
2-4.
MAIN Board ....................................................................
7
2-5.
HEADPHONE Board ......................................................
8
2-6.
SWITCH FLEXIBLE Board,
Organic EL Indicator Module .........................................
8
2-7.
Lithium Battery ...............................................................
9
2-8.
Release Plate ....................................................................
9
2-9.
Spring (Lock) And Lock Spring (Out) ............................ 10
2-10. USB Guide Assy .............................................................. 11
2-11. Spring (Arm A) And Spring (Arm B) .............................. 12
2-12. Chassis Assy .................................................................... 12
2-13. USB Board ...................................................................... 13
3.
TEST MODE
............................................................... 14
4.
DIAGRAMS
4-1.
Block Diagram ................................................................ 16
4-2.
Printed Wiring Board  – MAIN Board (Side A) – ........... 17
4-3.
Printed Wiring Board  – MAIN Board (Side B) – ........... 18
4-4.
Schematic Diagram  – MAIN Board (1/4) – ................... 19
4-5.
Schematic Diagram  – MAIN Board (2/4) – ................... 20
4-6.
Schematic Diagram  – MAIN Board (3/4), USB Board,
HEADPHONE Board – ................................................... 21
4-7.
Schematic Diagram  – MAIN Board (4/4) – ................... 22
4-8.
Printed Wiring Boards  – HEADPHONE Board,
USB Board – ................................................................... 23
5.
EXPLODED VIEWS
5-1.
Overall Section-1 ............................................................. 31
5-2.
Overall Section-2 ............................................................. 32
5-3.
Chassis Section ................................................................ 33
6.
ELECTRICAL PARTS LIST
.................................. 34
Microsoft, Windows and Windows Media are trademarks or
registered trademarks of Microsoft Corporation in the United States
and/or other countries.
US and foreign patents licensed from Dolby Laboratories.
All other trademarks and registered trademarks are trademarks or
registered trademarks of their respective holders.
Charging the Battery
• Charge the battery in an ambient temperature of between 5 to
35 
°C (67 to 95 °F)
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 
°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
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