Read Sony NW-E10 / NW-E7 Service Manual online
2
NW-E7/E10
Specifications ............................................................................... 1
1. SERVICING NOTES
....................................................... 3
2. GENERAL
.......................................................................... 9
3. DISASSEMBLY
3-1. Case ............................................................................... 11
3-2. Battery, Nickel Hydrogen ............................................. 12
3-3. Main Board ................................................................... 12
3-2. Battery, Nickel Hydrogen ............................................. 12
3-3. Main Board ................................................................... 12
4. DIAGRAMS
4-1. Block Diagrams ............................................................ 13
4-2. Printed Wiring Boards (Main Section) ......................... 14
4-3. Schematic Diagram (Main Section (1/2)) ..................... 15
4-4. Schematic Diagram (Main Section (2/2)) ..................... 16
4-2. Printed Wiring Boards (Main Section) ......................... 14
4-3. Schematic Diagram (Main Section (1/2)) ..................... 15
4-4. Schematic Diagram (Main Section (2/2)) ..................... 16
5. EXPLODED VIEW
5-1. Main Section ................................................................. 19
5-2. Case Section .................................................................. 20
5-2. Case Section .................................................................. 20
6. ELECTRICAL PARTS LIST
....................................... 21
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°
C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
• Replacement of TMS320DA150GGU120 (IC601) used in the set requires
a special tool.
z
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
• Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
may also be added to ordinary solder.
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USABLE FORMAT
Use ISO9660 Level 1 format.
Ver 1.1 2002.01
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