Read Sony NAS-C5E Service Manual online
NAS-C5E
NAS-C5E
12
12
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• f : internal component.
• C : panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : parts extracted from the conductor side.
• f : internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Parts face side:
(SIDE A)
Pattern face side:
(SIDE B)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• Lead layouts
surface
CSP (Chip Size Package)
Lead layout of conventional IC
Note: The components identifi ed by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Caution:
Parts face side:
(Conductor Side)
Pattern face side:
(Component Side)
Parts on the parts face side seen from
the pattern face are indicated.
Parts on the pattern face side seen from
the parts face are indicated.
• MAIN board is multi-layer printed board.
However, the patterns of intermediate-layers have not
been included in diagrams.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
N : WIRELESS LAN
F
: AUDIO
O : USB
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead is different from
that of conventional IC.
• Waveforms
– MAIN Board –
– LCD Board –
22.8 μs
3.6 Vp-p
IC3301 R (LRCK)
2 V/DIV, 10 μs/DIV
IC3301 RB (MCLK)
2 V/DIV, 50 ns/DIV
88.5 ns
4.3 Vp-p
IC3301 RT (SCLK)
2 V/DIV, 200 ns/DIV
352 ns
3.8 Vp-p
IC4002 (OSCOUT)
500 mV/DIV, 20 μs/DIV
30.4 μs
1 Vp-p
44.2 ns
3 Vp-p
X4003
1 V/DIV, 20 ns/DIV
RB
X101
500 mV/DIV, 50 ns/DIV
125 ns
1.2 Vp-p
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