Read Sony MHC-VX333 (serv.man2) Service Manual online
3
HCD-VX333
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
MODEL
E, EA, IA, JE, SP, TW models
TH model
PARTS No.
4-234-091-3s
4-234-091-9s
• Abbreviation
MY
: Malaysia model.
SP
: Singapore model.
TH
: Thai model.
EA
: Saudi Arabia model.
PARTS No.
1. SERVICE NOTE
······························································· 4
2. GENERAL
·········································································· 5
3. DISASSEMBLY
································································ 7
4. TEST MODE
···································································· 13
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
······································································ 19
6-1. Circuit Board Location ················································ 19
6-2. Block Diagrams Tuner/CD Section ···························· 21
6-2. Block Diagrams Tuner/CD Section ···························· 21
Main Section ······························································· 22
Video CD Section ························································ 23
Video CD Section ························································ 23
6-3. Printed Wiring Board –Main Board– ························· 24
6-4. Schematic Diagram –Main Board (1/4)– ··················· 25
6-5. Schematic Diagram –Main Board (2/4)– ··················· 26
6-6. Schematic Diagram –Main Board (3/4)– ··················· 27
6-7. Schematic Diagram –Main Board (4/4)– ··················· 28
6-8. Printed Wiring Board –BD Board– ···························· 29
6-9. Schematic Diagram –BD Board– ······························· 30
6-10. Printed Wiring Board –Power AMP Board– ·············· 31
6-11. Schematic Diagram –Power AMP Board– ················· 32
6-12. Printed Wiring Board –Panel Section– ······················· 33
6-13. Schematic Diagram –Panel Section– ························· 34
6-14. Printed Wiring Board –Key Board– ··························· 35
6-15. Schematic Diagram –Key Board– ······························ 36
6-16. Printed Wiring Board –Video CD Board– ·················· 37
6-17. Schematic Diagram –Video CD Board (1/2)– ············ 38
6-18. Schematic Diagram –Video CD Board (2/2)– ············ 39
6-19. Printed Wiring Board –Driver Section– ····················· 40
6-20. Schematic Diagram –Driver Section– ························ 41
6-21. Printed Wiring Board –Trans Section– ······················· 42
6-22. Schematic Diagram –Trans Section– ························· 43
6-23. IC Pin Function Description ········································ 44
6-24. IC Block Diagrams ······················································ 48
6-4. Schematic Diagram –Main Board (1/4)– ··················· 25
6-5. Schematic Diagram –Main Board (2/4)– ··················· 26
6-6. Schematic Diagram –Main Board (3/4)– ··················· 27
6-7. Schematic Diagram –Main Board (4/4)– ··················· 28
6-8. Printed Wiring Board –BD Board– ···························· 29
6-9. Schematic Diagram –BD Board– ······························· 30
6-10. Printed Wiring Board –Power AMP Board– ·············· 31
6-11. Schematic Diagram –Power AMP Board– ················· 32
6-12. Printed Wiring Board –Panel Section– ······················· 33
6-13. Schematic Diagram –Panel Section– ························· 34
6-14. Printed Wiring Board –Key Board– ··························· 35
6-15. Schematic Diagram –Key Board– ······························ 36
6-16. Printed Wiring Board –Video CD Board– ·················· 37
6-17. Schematic Diagram –Video CD Board (1/2)– ············ 38
6-18. Schematic Diagram –Video CD Board (2/2)– ············ 39
6-19. Printed Wiring Board –Driver Section– ····················· 40
6-20. Schematic Diagram –Driver Section– ························ 41
6-21. Printed Wiring Board –Trans Section– ······················· 42
6-22. Schematic Diagram –Trans Section– ························· 43
6-23. IC Pin Function Description ········································ 44
6-24. IC Block Diagrams ······················································ 48
7. EXPLODED VIEWS
7-1. Main Section ······························································· 52
7-2. Front Panel Section ····················································· 53
7-3. Main Board Section ····················································· 54
7-4. CD Mechanism Deck Section ····································· 55
7-2. Front Panel Section ····················································· 53
7-3. Main Board Section ····················································· 54
7-4. CD Mechanism Deck Section ····································· 55
8. ELECTRICAL PARTS LIST
······································· 56
JE
: Tourist model.
IA
: Indonesian model.
TW
: Taiwan model.
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