MHC-VX33 (serv.man2) - Sony Audio Service Manual (repair manual). Page 3

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This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.

Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

• Keep the temperature of soldering iron around 270˚C

during repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

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7-1. Circuit Board Location ················································· 23
7-2. Block Diagrams ···························································· 25
7-3. Printed Wiring Board    BD Section ····························· 28
7-4. Schematic Diagram    BD Section ································ 29
7-5. Printed Wiring Board    Main Section ·························· 30
7-6. Schematic Diagram    Main Section (1/3) ···················· 31
7-7. Schematic Diagram    Main Section (2/3) ···················· 32
7-8. Schematic Diagram    Main Section (3/3) ···················· 33
7-9. Printed Wiring Board    Power AMP Section ··············· 34
7-10. Schematic Diagram    Power AMP Section ················ 35
7-11. Printed Wiring Board    Panel Section ························ 36
7-12. Schematic Diagram    Panel Section ··························· 37
7-13. Printed Wiring Board    Leaf SW Section ··················· 38
7-14. Schematic Diagram    Leaf SW Section ····················· 39
7-15. Printed Wiring Board    Driver Section ······················· 40
7-16. Schematic Diagram    Driver Section ························· 41
7-17. Printed Wiring Board    Video CD Section ················· 42
7-18. Schematic Diagram    Video CD Section (1/2) ··········· 43
7-19. Schematic Diagram    Video CD Section (2/2) ··········· 44
7-20. Printed Wiring Board    Power Section ······················· 45
7-21. Schematic Diagram    Power Section ·························· 45
7-22. IC Pin Function Description ······································· 46
7-23. IC Block Diagrams ····················································· 50

8-1. Main Section ································································· 54
8-2. Panel Section ································································ 55
8-3. Main Board Section ······················································ 56
8-4. Tape Mechanism Section (TCM-230PWR11) (1/2) ····· 57
8-5. Tape Mechanism Section (TCM-230PWR11) (2/2) ····· 58
8-6. CD Mechanism Section (CDM58-K2BD37) ··············· 59

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