MHC-V3, MHC-V4D - Sony Audio Service Manual (repair manual). Page 6

For a Bluetooth device
1.  Press the [

\

/1

] button to turn the power on.

2.  Press BLUETOOTH on the unit to select Bluetooth function.
 

“BT AUDIO” appears in the display panel.

3.  Establish connection with the Bluetooth device.
 

Press BLUETOOTH on the unit to connect to the last 
connected Bluetooth device.

 Perform 

the 

Bluetooth connection from the Bluetooth device if 

the device is not connected.

 

Once the connection is established, the Bluetooth device name 
appears in the display panel.

4. Press 

N

.

 

Depending on the Bluetooth device,

 

– you may have to press N twice.

 

– you may need to start playback of an audio source on the
  Bluetooth device.

For an NFC-compatible smartphone
1.  Press the [

\

/1

] button to turn the power on.

 

Touch the smartphone to the N-Mark on the system to establish 
the Bluetooth connection.

  Start playback of an audio source on the smartphone. For 

details on playback, refer to the operating instructions of your 
smartphone.

To disconnect the Bluetooth device
For a Bluetooth device
Press BLUETOOTH on the unit.
“BT AUDIO” appears in the display panel.

For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.

BOND  FIXATION  OF  ELECTRIC  PARTS
When DAMP board is replaced or the following object parts are 
replaced, it is necessary to fi x parts to the boards by using a speci-
fi ed bond without fail.

• Object boards
Complete DAMP board

DAMP

C1071, C1073, C1126, C1127, C1128, C1129, 
C1130

Part No.

   

Description

7-600-020-70 

ADHESIVE (SC608Z2) 180ML

1. 

DAMP board (page 6)

The portion which applies bond: