MDS-NT1 - Sony Audio Service Manual (repair manual). Page 6

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6
MDS-NT1
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
The laser  component in this product
is capable of emitting radiation
exceeding  the limit for Class  1.
This appliance is classified as a CLASS 1
LASER  product.  The CLASS  1 LASER
PRODUCT MARKING is located on the
bottom exterior.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
0
  OR  DOTTED  LINE
WITH  MARK  
0
  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS  WHOSE
PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  MANUAL
OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
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