Read Sony MDS-B6P Service Manual online
— 103 —
Note:
• SEMICONDUCTORS
In each case, u: µ , for example:
uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,
uPC...: µ PC..., uPD...: µ PD...
uA...: µ A..., uPA...: µ PA..., uPB...: µ PB...,
uPC...: µ PC..., uPD...: µ PD...
• CAPACITORS
uF : µ F
• COILS
uH : µ H
• Abbreviation
CND : Canadian model
• Due to standardization, replacements in the parts list
may be different from the parts specified in the
diagrams or the components used on the set.
diagrams or the components used on the set.
• Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
should be anticipated when ordering these items.
• RESISTORS
All resistors are in ohms
METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
METAL: Metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F : nonflammable
The components identified by mark
!
or dotted line with mark
! are critical
for safety.
Replace only with part number speci-
fied.
Replace only with part number speci-
fied.
Les composants identifiés par une
marque
marque
! sont critiques pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro spécifié.
piéce portant le numéro spécifié.
When indicating parts by reference
number, please include the board
name.
number, please include the board
name.
Ref. No.
Part No.
Description
Remark
*
1-662-432-11 232C BOARD
**********
< FERRITE BEAD >
FB701
1-236-129-11 ENCAPSULATED COMPONENT
FB702
1-236-129-11 ENCAPSULATED COMPONENT
FB703
1-236-129-11 ENCAPSULATED COMPONENT
FB704
1-236-129-11 ENCAPSULATED COMPONENT
FB705
1-236-129-11 ENCAPSULATED COMPONENT
FB706
1-236-129-11 ENCAPSULATED COMPONENT
FB707
1-236-129-11 ENCAPSULATED COMPONENT
< JACK >
* J701
1-766-194-11 CONNECTOR, D-SUB 9P (RS-232C)
J703
1-562-837-21 JACK (REMOTE)
**************************************************************
*
1-663-864-11 A OUT BOARD
***********
< FERRITE BEAD >
FB805
1-236-163-11 ENCAPSULATED COMPONENT
FB806
1-236-163-11 ENCAPSULATED COMPONENT
FB807
1-236-163-11 ENCAPSULATED COMPONENT
FB808
1-236-163-11 ENCAPSULATED COMPONENT
< JACK >
J802
1-750-785-11 CONNECTOR (XLR TYPE) 3P (ANALOG OUT)
**************************************************************
*
A-4699-189-A ADIO BOARD, COMPLETE
*********************
< CAPACITOR >
C801
1-104-665-11 ELECT
100uF
20%
16V
C802
1-104-665-11 ELECT
100uF
20%
16V
C809
1-104-665-11 ELECT
100uF
20%
16V
C810
1-104-665-11 ELECT
100uF
20%
16V
C811
1-124-907-11 ELECT
10uF
20%
50V
C812
1-124-907-11 ELECT
10uF
20%
50V
C813
1-124-478-11 ELECT
100uF
20%
25V
Ref. No.
Part No.
Description
Remark
C814
1-124-478-11 ELECT
100uF
20%
25V
C815
1-124-478-11 ELECT
100uF
20%
25V
C816
1-124-478-11 ELECT
100uF
20%
25V
C833
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C834
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C835
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C836
1-164-004-11 CERAMIC CHIP
0.1uF
10%
25V
C839
1-104-665-11 ELECT
100uF
20%
16V
C840
1-104-665-11 ELECT
100uF
20%
16V
C872
1-163-038-91 CERAMIC CHIP
0.1uF
25V
C873
1-163-038-91 CERAMIC CHIP
0.1uF
25V
C881
1-163-038-91 CERAMIC CHIP
0.1uF
25V
C885
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C886
1-165-319-11 CERAMIC CHIP
0.1uF
50V
C896
1-163-009-11 CERAMIC CHIP
0.001uF
10%
50V
< CONNECTOR >
* CN801
1-564-337-00 PIN, CONNECTOR 3P
CN803
1-778-332-11 PIN, CONNECTOR (PC BOARD) 10P
* CN805
1-564-338-00 PIN, CONNECTOR 4P
* CN808
1-564-336-00 PIN, CONNECTOR 2P
* CN815
1-569-504-11 PIN, CONNECTOR 9P
* CN817
1-569-396-11 PIN, CONNECTOR 4P
< DIODE >
D803
8-719-800-76 DIODE 1SS226
D805
8-719-210-39 DIODE EC10QS-04
D806
8-719-210-39 DIODE EC10QS-04
< IC >
IC804
8-759-900-72 IC NE5532P
IC805
8-759-900-72 IC NE5532P
IC871
8-759-030-26 IC MC34050ML
< COIL >
L871
1-410-375-11 INDUCTOR CHIP
3.3uH
< TRANSISTOR >
Q805
8-729-900-53 TRANSISTOR DTC114EK
Q806
8-729-038-16 TRANSISTOR RT1P434C-TP-1
SECTION 7
ELECTRICAL PARTS LIST
A OUT
ADIO
232C
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